CN1245790C - 面发光激光器及其制造方法和光接收元件及其制造方法 - Google Patents
面发光激光器及其制造方法和光接收元件及其制造方法 Download PDFInfo
- Publication number
- CN1245790C CN1245790C CNB021200815A CN02120081A CN1245790C CN 1245790 C CN1245790 C CN 1245790C CN B021200815 A CNB021200815 A CN B021200815A CN 02120081 A CN02120081 A CN 02120081A CN 1245790 C CN1245790 C CN 1245790C
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- Prior art keywords
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- substrate
- lens
- laser
- semiconductor substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
- H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0207—Substrates having a special shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18386—Details of the emission surface for influencing the near- or far-field, e.g. a grating on the surface
- H01S5/18388—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP157737/01 | 2001-05-25 | ||
JP2001157737A JP3956647B2 (ja) | 2001-05-25 | 2001-05-25 | 面発光レ−ザの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1388615A CN1388615A (zh) | 2003-01-01 |
CN1245790C true CN1245790C (zh) | 2006-03-15 |
Family
ID=19001553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021200815A Expired - Fee Related CN1245790C (zh) | 2001-05-25 | 2002-05-24 | 面发光激光器及其制造方法和光接收元件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6999493B2 (ko) |
EP (1) | EP1263098A3 (ko) |
JP (1) | JP3956647B2 (ko) |
KR (2) | KR100642230B1 (ko) |
CN (1) | CN1245790C (ko) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3767496B2 (ja) | 2002-03-01 | 2006-04-19 | セイコーエプソン株式会社 | 面発光型発光素子およびその製造方法、光モジュール、光伝達装置 |
CN1748291B (zh) * | 2002-12-20 | 2010-09-08 | 诺瓦勒克斯公司 | 半导体器件支撑结构的制造方法 |
JP3941713B2 (ja) * | 2003-03-11 | 2007-07-04 | セイコーエプソン株式会社 | 面発光レーザを備えた半導体集積回路、半導体集積回路の製造方法および電子機器 |
US6953291B2 (en) * | 2003-06-30 | 2005-10-11 | Finisar Corporation | Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
JP4092570B2 (ja) * | 2003-07-23 | 2008-05-28 | セイコーエプソン株式会社 | 光素子およびその製造方法、光モジュール、ならびに光モジュールの駆動方法 |
JP3719441B2 (ja) * | 2003-08-01 | 2005-11-24 | セイコーエプソン株式会社 | 光素子およびその製造方法、光モジュール、光伝達装置 |
US6984076B2 (en) * | 2003-10-08 | 2006-01-10 | Honeywell International Inc. | Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection |
JP2005150393A (ja) * | 2003-11-14 | 2005-06-09 | Sharp Corp | 受発光素子用サブマウント |
JP2005167090A (ja) | 2003-12-04 | 2005-06-23 | Hamamatsu Photonics Kk | 半導体受光素子及びその製造方法 |
JP4160597B2 (ja) * | 2004-01-07 | 2008-10-01 | 浜松ホトニクス株式会社 | 半導体発光素子及びその製造方法 |
JP2005251966A (ja) * | 2004-03-04 | 2005-09-15 | Renesas Technology Corp | 半導体装置およびその製造方法 |
US7488117B2 (en) * | 2004-03-05 | 2009-02-10 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Large tolerance fiber optic transmitter and receiver |
US7223619B2 (en) * | 2004-03-05 | 2007-05-29 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | VCSEL with integrated lens |
JP4331033B2 (ja) | 2004-03-29 | 2009-09-16 | 浜松ホトニクス株式会社 | 半導体光検出素子及びその製造方法 |
JP4116587B2 (ja) | 2004-04-13 | 2008-07-09 | 浜松ホトニクス株式会社 | 半導体発光素子及びその製造方法 |
FR2879759B1 (fr) * | 2004-12-21 | 2007-10-12 | Intexys Sa | Dispositif optoelectronique et procede de fabrication dudit dispositif |
US20060078031A1 (en) * | 2004-10-08 | 2006-04-13 | Govorkov Sergei V | InGaN LED pumped II-VI semiconductor laser |
US7483469B2 (en) | 2004-11-01 | 2009-01-27 | Seiko Epson Corporation | Surface-emitting type semiconductor laser and its manufacturing method, optical module, and light transmission device |
US7203426B2 (en) * | 2005-06-04 | 2007-04-10 | National Taiwan University | Optical subassembly of optical transceiver |
WO2007069222A2 (en) * | 2005-12-15 | 2007-06-21 | Koninklijke Philips Electronics N.V. | Analysis device with an array of focusing microstructures |
CN101535859B (zh) * | 2006-09-13 | 2012-05-02 | 埃迪斯科文大学 | 光学连接组件 |
JP5092432B2 (ja) * | 2007-02-02 | 2012-12-05 | 富士ゼロックス株式会社 | 面発光型半導体レーザ、面発光型半導体レーザの製造方法、光学装置、光照射装置、情報処理装置、光送信装置、光空間伝送装置および光伝送システム |
FR2915029A1 (fr) * | 2007-04-13 | 2008-10-17 | Commissariat Energie Atomique | Dispositif optoelectronique compact incluant au moins un laser emettant par la surface |
US8378287B2 (en) | 2007-06-27 | 2013-02-19 | Koninklijke Philips Electronics N.V. | Optical sensor module including a diode laser and a substrate transparent to radiation emitted by the diode laser and a method for manufacturing an optical sensor module |
CN101667716B (zh) * | 2008-09-03 | 2011-10-26 | 中国科学院半导体研究所 | 一种双面键合长波长垂直腔面发射激光器及其制作方法 |
US20120082413A1 (en) * | 2009-02-05 | 2012-04-05 | Edith Cowan University | An optical connection system |
DE102010045403A1 (de) * | 2010-09-15 | 2012-03-15 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
EP2847834B1 (en) * | 2012-05-08 | 2023-04-05 | MACOM Technology Solutions Holdings, Inc. | Lasers with beam-shape modification |
JP6048100B2 (ja) * | 2012-12-07 | 2016-12-21 | 富士ゼロックス株式会社 | 半導体ウエハー、半導体発光装置、光伝送装置、情報処理装置および半導体発光素子の製造方法 |
JP2014190988A (ja) * | 2013-03-26 | 2014-10-06 | Fuji Xerox Co Ltd | レンズアレイ及びレンズアレイ製造方法 |
US9865983B2 (en) * | 2015-08-31 | 2018-01-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | VCSEL incorporating a substrate having an aperture |
JP2019134019A (ja) * | 2018-01-30 | 2019-08-08 | セイコーエプソン株式会社 | 発光装置 |
JP2020067625A (ja) * | 2018-10-26 | 2020-04-30 | 国立大学法人九州工業大学 | 光学装置 |
EP4019895A4 (en) * | 2019-08-20 | 2022-10-19 | Sony Semiconductor Solutions Corporation | SEMICONDUCTOR LASER CONTROL DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MAKING A SEMICONDUCTOR LASER CONTROL DEVICE |
JP2023151011A (ja) * | 2022-03-31 | 2023-10-16 | ソニーセミコンダクタソリューションズ株式会社 | 発光装置、発光装置の製造方法、測距装置 |
Family Cites Families (17)
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JPS6042890A (ja) * | 1983-08-18 | 1985-03-07 | Mitsubishi Electric Corp | 面発光形半導体レ−ザ及びその製造方法 |
US4948960A (en) * | 1988-09-20 | 1990-08-14 | The University Of Delaware | Dual mode light emitting diode/detector diode for optical fiber transmission lines |
JPH02231786A (ja) * | 1989-03-06 | 1990-09-13 | Matsushita Electric Ind Co Ltd | 面発光レーザ装置およびその製造方法 |
JPH04147691A (ja) * | 1990-10-11 | 1992-05-21 | Nec Corp | レンズ付面発光形半導体レーザユニット |
US5073041A (en) * | 1990-11-13 | 1991-12-17 | Bell Communications Research, Inc. | Integrated assembly comprising vertical cavity surface-emitting laser array with Fresnel microlenses |
KR0164285B1 (ko) * | 1995-01-25 | 1998-12-15 | 심상철 | 마이크로렌즈가 형성된 광집적 소자 및 그의 제조방법 |
US5633527A (en) * | 1995-02-06 | 1997-05-27 | Sandia Corporation | Unitary lens semiconductor device |
JP3058077B2 (ja) * | 1996-01-16 | 2000-07-04 | 松下電器産業株式会社 | 半導体受発光装置 |
US5956362A (en) * | 1996-02-27 | 1999-09-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device and method of etching |
JP3507632B2 (ja) * | 1996-09-17 | 2004-03-15 | 株式会社東芝 | 回折格子レンズ |
JPH10255509A (ja) * | 1997-03-12 | 1998-09-25 | Koito Mfg Co Ltd | 車両用灯具 |
JPH10335737A (ja) * | 1997-05-30 | 1998-12-18 | Olympus Optical Co Ltd | 半導体レーザ装置 |
US5966399A (en) * | 1997-10-02 | 1999-10-12 | Motorola, Inc. | Vertical cavity surface emitting laser with integrated diffractive lens and method of fabrication |
KR100273134B1 (ko) * | 1997-11-29 | 2001-01-15 | 정선종 | 단일모드표면방출레이저및그제조방법 |
KR100363165B1 (ko) * | 2000-02-03 | 2002-11-30 | 삼성전자 주식회사 | 마이크로 렌즈 일체형 표면광 레이저 및 그 제조방법 |
DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
KR100393057B1 (ko) * | 2000-10-20 | 2003-07-31 | 삼성전자주식회사 | 마이크로 렌즈 일체형 표면광 레이저 |
-
2001
- 2001-05-25 JP JP2001157737A patent/JP3956647B2/ja not_active Expired - Fee Related
-
2002
- 2002-05-13 KR KR1020020026149A patent/KR100642230B1/ko not_active IP Right Cessation
- 2002-05-23 US US10/152,848 patent/US6999493B2/en not_active Expired - Fee Related
- 2002-05-23 EP EP02011381A patent/EP1263098A3/en not_active Withdrawn
- 2002-05-24 CN CNB021200815A patent/CN1245790C/zh not_active Expired - Fee Related
-
2005
- 2005-03-23 KR KR1020050024030A patent/KR20050033875A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US6999493B2 (en) | 2006-02-14 |
EP1263098A2 (en) | 2002-12-04 |
JP2002353564A (ja) | 2002-12-06 |
EP1263098A3 (en) | 2004-12-29 |
KR100642230B1 (ko) | 2006-11-02 |
JP3956647B2 (ja) | 2007-08-08 |
KR20050033875A (ko) | 2005-04-13 |
CN1388615A (zh) | 2003-01-01 |
KR20020090122A (ko) | 2002-11-30 |
US20020176468A1 (en) | 2002-11-28 |
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