CN1239615C - 可固化树脂组合物 - Google Patents
可固化树脂组合物 Download PDFInfo
- Publication number
- CN1239615C CN1239615C CN00819862.4A CN00819862A CN1239615C CN 1239615 C CN1239615 C CN 1239615C CN 00819862 A CN00819862 A CN 00819862A CN 1239615 C CN1239615 C CN 1239615C
- Authority
- CN
- China
- Prior art keywords
- resin composition
- curable resin
- polyphenylene oxide
- curable
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34928—Salts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2000/005883 WO2002018493A1 (fr) | 2000-08-30 | 2000-08-30 | Composition de resine durcissable |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1454240A CN1454240A (zh) | 2003-11-05 |
CN1239615C true CN1239615C (zh) | 2006-02-01 |
Family
ID=11736411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN00819862.4A Expired - Lifetime CN1239615C (zh) | 2000-08-30 | 2000-08-30 | 可固化树脂组合物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4007911B2 (ja) |
CN (1) | CN1239615C (ja) |
WO (1) | WO2002018493A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7413791B2 (en) | 2003-01-28 | 2008-08-19 | Matsushita Electric Works, Ltd. | Poly (phenylene ether) resin composition, prepreg, and laminated sheet |
JP3923441B2 (ja) | 2003-03-25 | 2007-05-30 | 三光株式会社 | 難燃性合成樹脂組成物 |
EP1640411B1 (en) * | 2003-06-12 | 2008-07-02 | Fuji Electric Holdings Co., Ltd. | Reactive flame retardants and flame-retarded resin products |
JP4189003B2 (ja) * | 2003-10-03 | 2008-12-03 | サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ | 難燃性熱硬化性組成物、方法並びに製品 |
US7495047B2 (en) | 2005-10-06 | 2009-02-24 | At&T Intellectual Property, I, L.P. | Poly(arylene ether) composition, method, and article |
US7488766B2 (en) | 2005-10-06 | 2009-02-10 | Sabic Innovative Plastics Ip B.V. | Polymer composition, method, and article |
JP5172839B2 (ja) * | 2008-04-09 | 2013-03-27 | 住友電気工業株式会社 | 難燃性チューブ及びこれを用いた熱収縮チューブ |
JP5165639B2 (ja) * | 2009-05-26 | 2013-03-21 | パナソニック株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
DE102010035103A1 (de) * | 2010-08-23 | 2012-02-23 | Catena Additives Gmbh & Co. Kg | Flammschutzmittelzusammensetzungen enthaltend Triazin-interkalierte Metall-Phosphate |
JP6219112B2 (ja) * | 2013-09-27 | 2017-10-25 | 旭化成株式会社 | Ppe含有樹脂組成物 |
TWI557155B (zh) * | 2013-11-20 | 2016-11-11 | Asahi Kasei E Materials Corp | And a cured product of a resin composition containing a polyphenyl ether |
DE102014014098A1 (de) | 2014-09-30 | 2016-03-31 | Mankiewicz Gebr. & Co. Gmbh & Co. Kg | Sperrschicht und deren Verwendung in Beschichtungssystemen auf Kunststoffsubstraten |
DE102017215780A1 (de) * | 2017-09-07 | 2019-03-07 | Clariant Plastics & Coatings Ltd | Synergistische Flammschutzmittelkombinationen für Polymerzusammensetzungen und deren Verwendung |
WO2019084532A1 (en) * | 2017-10-27 | 2019-05-02 | Frx Polymers, Inc. | PHOSPHONATE-BASED HALOGEN-FREE COMPOSITIONS FOR PRINTED CIRCUIT BOARD APPLICATIONS |
TWI834753B (zh) * | 2018-11-08 | 2024-03-11 | 日商力森諾科股份有限公司 | 樹脂組成物、預浸體、積層板、樹脂薄膜、多層印刷線路板及毫米波雷達用多層印刷線路板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4900768A (en) * | 1983-08-23 | 1990-02-13 | General Electric Company | Crosslinkable flame retardant composition of polyphenylene ether and elastomers |
JPH0726014B2 (ja) * | 1989-03-08 | 1995-03-22 | 旭化成工業株式会社 | 難燃化樹脂組成物 |
JP2796145B2 (ja) * | 1989-11-15 | 1998-09-10 | 旭化成工業株式会社 | 樹脂組成物 |
JPH03185058A (ja) * | 1989-12-14 | 1991-08-13 | Asahi Chem Ind Co Ltd | 熱可塑性樹脂組成物 |
JPH03275761A (ja) * | 1990-03-26 | 1991-12-06 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド系樹脂組成物 |
JPH04117452A (ja) * | 1990-09-06 | 1992-04-17 | Mitsubishi Kasei Polytec Co | ポリフェニレンエーテル系樹脂組成物 |
JPH04370134A (ja) * | 1991-06-19 | 1992-12-22 | Asahi Chem Ind Co Ltd | 非ハロゲン系難燃性樹脂組成物 |
DE4130488A1 (de) * | 1991-09-13 | 1993-03-18 | Bayer Ag | Phosphorhaltige polymerisate |
JPH07316415A (ja) * | 1994-05-23 | 1995-12-05 | Sumitomo Bakelite Co Ltd | 難燃性ポリフェニレンエーテル系樹脂組成物及びその製造方法 |
JPH08176450A (ja) * | 1994-12-21 | 1996-07-09 | Sumitomo Bakelite Co Ltd | 熱可塑性樹脂組成物 |
JP2000129263A (ja) * | 1998-10-27 | 2000-05-09 | Rin Kagaku Kogyo Kk | 低発煙性難燃剤組成物及び低発煙性難燃樹脂組成物 |
JP2000248169A (ja) * | 1999-03-01 | 2000-09-12 | Asahi Chem Ind Co Ltd | 難燃・硬化性樹脂組成物 |
JP2000336261A (ja) * | 1999-03-24 | 2000-12-05 | Asahi Chem Ind Co Ltd | 硬化性樹脂組成物 |
JP2000290490A (ja) * | 1999-04-01 | 2000-10-17 | Asahi Chem Ind Co Ltd | 難燃硬化性樹脂組成物 |
JP3403987B2 (ja) * | 1999-12-27 | 2003-05-06 | 京セラケミカル株式会社 | ビルドアップ型多層プリント配線板とそれに用いる樹脂組成物および樹脂フィルム |
-
2000
- 2000-08-30 JP JP2002524003A patent/JP4007911B2/ja not_active Expired - Lifetime
- 2000-08-30 WO PCT/JP2000/005883 patent/WO2002018493A1/ja active Application Filing
- 2000-08-30 CN CN00819862.4A patent/CN1239615C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1454240A (zh) | 2003-11-05 |
JP4007911B2 (ja) | 2007-11-14 |
WO2002018493A1 (fr) | 2002-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1206279C (zh) | 热固性聚亚苯基醚树脂组合物、由其得到的可固化树脂组合物及层压结构体 | |
CN1130427C (zh) | 环氧树脂组成物及其制成的半固化片和多层印刷电路板 | |
CN1239615C (zh) | 可固化树脂组合物 | |
CN1081658C (zh) | 包含至少一个已固化聚苯氧树脂组合物层的叠层结构 | |
CN100344697C (zh) | 阻燃剂组合物 | |
CN100341938C (zh) | 不含卤素的阻燃性环氧树脂组合物和含该组合物的制品 | |
CN1293147C (zh) | 热固化性树脂组合物及使用该组合物的预浸体及层叠板 | |
CN1280337C (zh) | 聚苯醚-聚乙烯基热固性树脂 | |
CN1240772C (zh) | 含磷的环氧树脂组合物及其应用 | |
CN1556830A (zh) | 官能化聚苯醚 | |
CN1390246A (zh) | 阻燃环氧树脂组合物和由其制得的层压物 | |
CN1865382A (zh) | 阻燃粘合剂组合物,和使用该组合物的粘合片材、覆盖膜和软质敷铜层压材料 | |
EP2578632A1 (en) | Prepreg, metal-clad laminate, and printed circuit board | |
CN1826365A (zh) | 印刷电路板用树脂合成物、预浸料坯、层压板及用其制造的印刷电路板 | |
CN1847351A (zh) | 阻燃粘合剂组合物及使用该组合物的粘合剂片、叠层膜和柔性覆铜层合板 | |
CN1626577A (zh) | 树脂组合物、使用该树脂组合物的预浸料及叠层板 | |
JP6946578B2 (ja) | 樹脂組成物およびその製造方法 | |
CN1639223A (zh) | 含磷环氧树脂和树脂组合物及其制造方法,以及密封材料和层积板 | |
CN1771274A (zh) | 印刷线路板用树脂组成物、半固化片及采用了半固化片的层叠板 | |
JP2004315705A (ja) | 変性ポリイミド樹脂組成物ならびにそれを用いたプリプレグおよび積層板 | |
JP2002308948A (ja) | 硬化性樹脂組成物 | |
JP3965786B2 (ja) | 熱硬化性樹脂組成物及びプリプレグ、プリント配線板用積層板 | |
JP6304294B2 (ja) | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 | |
JP2012012588A (ja) | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 | |
JP2003147170A (ja) | 樹脂組成物ならびにそれを用いたプリプレグおよび積層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ASAHI KASEI ELECTRONICS MATERIALS CO., LTD. Free format text: FORMER OWNER: ASAHI KASEI CORPORATION Effective date: 20091016 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20091016 Address after: Tokyo, Japan Patentee after: Asahi Chemical Corp. Address before: Japan Osaka Patentee before: Asahi Kasei Kogyo K. K. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160503 Address after: Tokyo, Japan, Japan Patentee after: Asahi Kasei Kogyo K. K. Address before: Tokyo, Japan Patentee before: Asahi Chemical Corp. |
|
CX01 | Expiry of patent term |
Granted publication date: 20060201 |
|
CX01 | Expiry of patent term |