CN1221860C - 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法 - Google Patents

感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法 Download PDF

Info

Publication number
CN1221860C
CN1221860C CNB018115772A CN01811577A CN1221860C CN 1221860 C CN1221860 C CN 1221860C CN B018115772 A CNB018115772 A CN B018115772A CN 01811577 A CN01811577 A CN 01811577A CN 1221860 C CN1221860 C CN 1221860C
Authority
CN
China
Prior art keywords
molecule
compound
glycol chain
unsaturated bond
optical polymerism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB018115772A
Other languages
English (en)
Chinese (zh)
Other versions
CN1437716A (zh
Inventor
木村伯世
青木知明
神尾贤治
远藤昌树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1437716A publication Critical patent/CN1437716A/zh
Application granted granted Critical
Publication of CN1221860C publication Critical patent/CN1221860C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CNB018115772A 2000-06-22 2001-06-22 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法 Expired - Lifetime CN1221860C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP187819/2000 2000-06-22
JP2000187819 2000-06-22

Publications (2)

Publication Number Publication Date
CN1437716A CN1437716A (zh) 2003-08-20
CN1221860C true CN1221860C (zh) 2005-10-05

Family

ID=18687725

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018115772A Expired - Lifetime CN1221860C (zh) 2000-06-22 2001-06-22 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法

Country Status (7)

Country Link
US (1) US7067228B2 (ja)
JP (3) JP4779284B2 (ja)
KR (1) KR100537085B1 (ja)
CN (1) CN1221860C (ja)
AU (1) AU2001266324A1 (ja)
TW (1) TWI240149B (ja)
WO (1) WO2001098832A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI240149B (en) * 2000-06-22 2005-09-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
JP3503639B2 (ja) * 2000-09-27 2004-03-08 日立化成工業株式会社 レジストパターン、その製造法およびその利用
US7005143B2 (en) * 2002-04-12 2006-02-28 3M Innovative Properties Company Gel materials, medical articles, and methods
KR100521999B1 (ko) * 2002-09-03 2005-10-18 주식회사 코오롱 샌드블래스트 레지스트용 감광성수지 조성물
JP2006527179A (ja) * 2003-06-06 2006-11-30 ビーエーエスエフ　アクチェンゲゼルシャフト アルキレニレングリコールの（メタ）アクリル酸エステルおよびその使用
WO2006025092A1 (ja) * 2004-08-30 2006-03-09 Hitachi Chemical Co., Ltd. 感光性フィルム
JP4315892B2 (ja) * 2004-11-25 2009-08-19 東京応化工業株式会社 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
JP4764668B2 (ja) * 2005-07-05 2011-09-07 セイコーエプソン株式会社 電子基板の製造方法および電子基板
CN103885292B (zh) * 2005-10-25 2017-09-22 日立化成株式会社 感光性树脂组合物、使用其的感光性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法
JP4586919B2 (ja) * 2006-04-18 2010-11-24 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4711886B2 (ja) * 2006-05-26 2011-06-29 富士フイルム株式会社 感光性組成物、感光性フィルム及びプリント基板
CN101568883B (zh) * 2006-12-27 2012-01-18 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法
KR100974790B1 (ko) * 2009-11-03 2010-08-06 강법식 가래떡 중앙 속넣기 장치
JP5935271B2 (ja) * 2010-09-22 2016-06-15 Dic株式会社 熱転写用フィルム及びその製造方法
KR102281035B1 (ko) * 2012-11-20 2021-07-22 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
TW201546547A (zh) * 2014-05-13 2015-12-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
TWI695225B (zh) * 2014-11-17 2020-06-01 日商日立化成股份有限公司 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
CN104834182B (zh) * 2015-05-20 2019-05-03 杭州福斯特应用材料股份有限公司 一种具有高分辨率和优异掩孔性能的感光干膜

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548016B2 (ja) * 1986-09-09 1996-10-30 旭化成工業株式会社 光重合性積層体
JP2880775B2 (ja) * 1990-08-01 1999-04-12 旭化成工業株式会社 光重合性組成物及び光重合性積層体
JPH05341527A (ja) 1992-06-12 1993-12-24 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JPH06242603A (ja) * 1993-02-15 1994-09-02 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP3458000B2 (ja) * 1994-05-26 2003-10-20 旭化成株式会社 光重合性樹脂組成物
JP3368987B2 (ja) * 1994-06-02 2003-01-20 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP3415928B2 (ja) * 1994-06-09 2003-06-09 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性フィルム
JP3362095B2 (ja) * 1996-03-27 2003-01-07 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、積層方法、積層基板及び硬化方法
JP3469066B2 (ja) * 1997-10-27 2003-11-25 日立化成工業株式会社 光重合性組成物及び光重合性積層体
JP3281307B2 (ja) * 1997-12-24 2002-05-13 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、感光性樹脂組成物の層の積層方法、感光性樹脂組成物層積層基板及び感光性樹脂組成物の層の硬化方法
JP4002658B2 (ja) 1998-02-04 2007-11-07 日本合成化学工業株式会社 レジストパターン形成方法
US5922509A (en) 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
JP2001159817A (ja) * 1999-12-03 2001-06-12 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
TWI240149B (en) * 2000-06-22 2005-09-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board

Also Published As

Publication number Publication date
AU2001266324A1 (en) 2002-01-02
US7067228B2 (en) 2006-06-27
TWI240149B (en) 2005-09-21
JP4900514B2 (ja) 2012-03-21
WO2001098832A1 (fr) 2001-12-27
KR100537085B1 (ko) 2005-12-16
US20040101777A1 (en) 2004-05-27
CN1437716A (zh) 2003-08-20
KR20030076239A (ko) 2003-09-26
JP4983985B2 (ja) 2012-07-25
JP4779284B2 (ja) 2011-09-28
JP2011128629A (ja) 2011-06-30
JP2011123505A (ja) 2011-06-23

Similar Documents

Publication Publication Date Title
CN1221860C (zh) 感光性树脂组合物、使用它的感光性元件、光刻胶图案的制造方法及印刷电路板的制造方法
CN1265244C (zh) 感光性元件、抗蚀图形的形成方法和印刷电路板的制造方法
JP6778387B2 (ja) 感光性エレメント
CN1228688C (zh) 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法
KR102234811B1 (ko) 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트
CN1111758C (zh) 感光树脂组合物及使用了该组合物的感光部件
CN1054838A (zh) 正向作用的光刻胶
CN101059655A (zh) 感光性组合物及由该感光性组合物形成的滤色片
CN1209685C (zh) 感光性树脂组合物、使用该组合物的感光性元件、保护层图案的制造法及印刷电路板的制造法
KR100199242B1 (ko) 가교 경화형 수지 조성물, 가교 경화형 수지 조성물과 금속과의 적층체 및 가교 경화형 수지 조성물을 사용하는 금속 가공방법
CN1342273A (zh) 光敏树脂组合物、使用光敏树脂组合物的感光性元件、蚀刻图形的制法及印刷线路板的制法
JP2009145613A (ja) フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法
CN1639641A (zh) 感光性树脂组合物、使用感光性树脂组合物的光敏元件、抗蚀图形的形成方法及印刷电路板的制造方法
JP2009042720A (ja) 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
TW201007360A (en) Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board
CN1928718A (zh) 用于形成等离子显示器的遮光性图案的感光性树脂组合物
CN1856742A (zh) 感光性元件、光阻图型的形成方法及印刷电路板制造方法
CN1353743A (zh) 水乳状液型光敏树脂组合物
CN1879060A (zh) 感光性树脂组合物、感光性组件、抗蚀图的形成方法及印刷电路板的制造方法
CN1089907C (zh) 光敏树脂组合物
CN1280674C (zh) 电路形成用感光性膜及印刷配线板的制造方法
CN1273867C (zh) 感光性树脂组合物及其用途
CN1466706A (zh) 抗蚀图、其制造方法及其应用
CN1226200A (zh) 叠层薄膜及印刷线路板的制备方法
CN1902547A (zh) 感光性树脂组合物、使用其的感光性元件、抗蚀图的制造方法及印刷电路板的制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20051005

CX01 Expiry of patent term