CN1192125C - 铜或铜合金非电镀镀锡的方法 - Google Patents

铜或铜合金非电镀镀锡的方法 Download PDF

Info

Publication number
CN1192125C
CN1192125C CNB008154627A CN00815462A CN1192125C CN 1192125 C CN1192125 C CN 1192125C CN B008154627 A CNB008154627 A CN B008154627A CN 00815462 A CN00815462 A CN 00815462A CN 1192125 C CN1192125 C CN 1192125C
Authority
CN
China
Prior art keywords
tin
copper
layer
foreign metal
tin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB008154627A
Other languages
English (en)
Chinese (zh)
Other versions
CN1387465A (zh
Inventor
J·贝尔
J·赫耶
J·休普
I·卡克
M·克莱恩菲尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone OMI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7928903&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1192125(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone OMI Inc filed Critical Enthone OMI Inc
Publication of CN1387465A publication Critical patent/CN1387465A/zh
Application granted granted Critical
Publication of CN1192125C publication Critical patent/CN1192125C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
CNB008154627A 1999-11-12 2000-11-09 铜或铜合金非电镀镀锡的方法 Expired - Lifetime CN1192125C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19954613A DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
DE19954613.4 1999-11-12

Publications (2)

Publication Number Publication Date
CN1387465A CN1387465A (zh) 2002-12-25
CN1192125C true CN1192125C (zh) 2005-03-09

Family

ID=7928903

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008154627A Expired - Lifetime CN1192125C (zh) 1999-11-12 2000-11-09 铜或铜合金非电镀镀锡的方法

Country Status (7)

Country Link
EP (1) EP1230034B1 (enExample)
JP (1) JP4084569B2 (enExample)
CN (1) CN1192125C (enExample)
AT (1) ATE480340T1 (enExample)
AU (1) AU1597501A (enExample)
DE (2) DE19954613A1 (enExample)
WO (1) WO2001034310A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534701A (zh) * 2010-12-28 2012-07-04 罗门哈斯电子材料有限公司 从镀液中去除杂质的方法
CN102560570A (zh) * 2010-12-28 2012-07-11 罗门哈斯电子材料有限公司 从镀液中去除杂质的方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100494491C (zh) * 2005-10-25 2009-06-03 新毅电子有限公司 印刷电路板的铜、锡置换药水的制造方法
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010031181A1 (de) 2010-07-09 2012-01-12 Atotech Deutschland Gmbh Verfahren und Anordnung zum Abscheiden einer Metallschicht
JP5937320B2 (ja) * 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
MA37931A1 (fr) * 2012-08-13 2016-07-29 Teni Boulikas Procédés améliorés permettant de traiter un cancer avec une toxicité rénale réduite

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5160422A (en) * 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
JP2833026B2 (ja) 1989-07-05 1998-12-09 上村工業株式会社 無電解錫めっき方法
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
US5217751A (en) * 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP3419995B2 (ja) 1996-05-10 2003-06-23 株式会社大和化成研究所 無電解錫−銀合金めっき浴
JP3660777B2 (ja) * 1997-03-06 2005-06-15 日本エレクトロプレイテイング・エンジニヤース株式会社 錫合金膜の形成方法およびその錫合金めっき浴

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534701A (zh) * 2010-12-28 2012-07-04 罗门哈斯电子材料有限公司 从镀液中去除杂质的方法
CN102560570A (zh) * 2010-12-28 2012-07-11 罗门哈斯电子材料有限公司 从镀液中去除杂质的方法
CN102534701B (zh) * 2010-12-28 2016-01-13 罗门哈斯电子材料有限公司 从镀液中去除杂质的方法

Also Published As

Publication number Publication date
CN1387465A (zh) 2002-12-25
WO2001034310A1 (en) 2001-05-17
EP1230034A1 (en) 2002-08-14
DE19954613A1 (de) 2001-05-17
JP4084569B2 (ja) 2008-04-30
JP2003514120A (ja) 2003-04-15
ATE480340T1 (de) 2010-09-15
AU1597501A (en) 2001-06-06
EP1230034B1 (en) 2010-09-08
EP1230034A4 (en) 2003-01-08
DE60044943D1 (de) 2010-10-21

Similar Documents

Publication Publication Date Title
TW301844B (enExample)
TWI242607B (en) Bath and method of electroless plating of silver on metal surfaces
CN101578393B (zh) 通过无电镀形成金属薄膜的镀敷物及其制造方法
WO1998033959A1 (en) Method for electroplating nonconductive material
TW201042077A (en) Pre-treatment process for electroless nickel plating
JPH08250865A (ja) 電子ハウジングの製作に利用するシート上での金属ウイスカの形成を防止することにより電子ハウジングの信頼性をより高くする方法
CN1192125C (zh) 铜或铜合金非电镀镀锡的方法
US6821323B1 (en) Process for the non-galvanic tin plating of copper or copper alloys
CN1510174A (zh) 沉积无铅锡合金的方法
KR20140020829A (ko) 고 알칼리성 도금 욕을 이용하는 금속의 무전해 증착 방법
CN100564594C (zh) 银的浸镀
CN102187012B (zh) 用于增加金属和金属合金表面耐腐蚀性的后处理组合物
US20160222519A1 (en) Method of selectively treating copper in the presence of further metal
JP6114770B2 (ja) 銅合金材のスズめっき方法
JP2009149965A (ja) 銀めっき方法
CN1297490A (zh) 用锡或锡合金层在铜或铜合金上形成镀覆表面的方法
JP3499543B2 (ja) 耐白錆性に優れる電気Ｚｎめっき鋼板およびその製造方法
TWI377268B (en) Method for coating substrates containing antimony compounds with tin and tin alloys
JP3499544B2 (ja) 耐白錆性に優れる電気Ｚｎめっき鋼板およびその製造方法
JP3994295B2 (ja) 銅または銅合金材の変色防止方法及び銅または銅合金材
JP2544678B2 (ja) 給水・給湯用内面Ｓｎメツキ銅管およびその製造方法
CN117512725B (zh) 用于大电流保险管的锡锌线镀银工艺
US6572754B2 (en) Method for producing a tin film on the inner surface of hollow copper alloy components
JPS6047913B2 (ja) ステンレス鋼に直接金メツキを施す方法
TW202336294A (zh) 用於自基材電解移除金屬沉積物之水性剝離組合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20050309

CX01 Expiry of patent term