CN1190522C - 用于钯或其合金电化学沉积的电解液 - Google Patents

用于钯或其合金电化学沉积的电解液 Download PDF

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Publication number
CN1190522C
CN1190522C CNB01809757XA CN01809757A CN1190522C CN 1190522 C CN1190522 C CN 1190522C CN B01809757X A CNB01809757X A CN B01809757XA CN 01809757 A CN01809757 A CN 01809757A CN 1190522 C CN1190522 C CN 1190522C
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CN
China
Prior art keywords
palladium
electrolyte
solution according
electrolytic solution
acid
Prior art date
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Expired - Lifetime
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CNB01809757XA
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English (en)
Chinese (zh)
Other versions
CN1430683A (zh
Inventor
乔斯·冈萨雷斯
莱昂内尔·查卢米厄
米歇尔·利梅拉克
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METALOR TECHNOLOGIES FRANCE S
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METALOR TECHNOLOGIES FRANCE S
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Publication of CN1430683A publication Critical patent/CN1430683A/zh
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Publication of CN1190522C publication Critical patent/CN1190522C/zh
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Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
CNB01809757XA 2000-04-06 2001-04-05 用于钯或其合金电化学沉积的电解液 Expired - Lifetime CN1190522C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0004381A FR2807450B1 (fr) 2000-04-06 2000-04-06 Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR00/04381 2000-04-06

Publications (2)

Publication Number Publication Date
CN1430683A CN1430683A (zh) 2003-07-16
CN1190522C true CN1190522C (zh) 2005-02-23

Family

ID=8848927

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB01809757XA Expired - Lifetime CN1190522C (zh) 2000-04-06 2001-04-05 用于钯或其合金电化学沉积的电解液

Country Status (10)

Country Link
US (1) US6743346B2 (enExample)
EP (1) EP1272691B1 (enExample)
JP (1) JP4790191B2 (enExample)
CN (1) CN1190522C (enExample)
AT (1) ATE262055T1 (enExample)
AU (1) AU2001248465A1 (enExample)
DE (1) DE60102364T2 (enExample)
ES (1) ES2220757T3 (enExample)
FR (1) FR2807450B1 (enExample)
WO (1) WO2001077417A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104694053A (zh) * 2015-02-15 2015-06-10 滁州云林数码影像耗材有限公司 一种墙体用丙烯酸酯压敏胶及其制备方法

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* Cited by examiner, † Cited by third party
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FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US8361553B2 (en) * 2004-07-30 2013-01-29 Kimberly-Clark Worldwide, Inc. Methods and compositions for metal nanoparticle treated surfaces
EP2116550B1 (de) * 2008-05-07 2010-07-14 Umicore Galvanotechnik GmbH Verfahren zur Herstellung von Komplexen des Palladium(hydrogen) carbonats mit Aminliganden
CN102037162B (zh) * 2008-05-07 2013-03-27 尤米科尔电镀技术有限公司 Pd-和Pd-Ni-电镀浴
CN101838830B (zh) * 2010-05-07 2012-08-15 厦门大学 一种电镀钯镍合金的电解液
SG179380A1 (en) 2010-09-21 2012-04-27 Rohm & Haas Elect Mat Cyanide-free silver electroplating solutions
CN102677110B (zh) * 2012-04-19 2016-08-10 永保纳米科技(深圳)有限公司 一种金钯合金电镀液及其制备方法和电镀工艺
KR102482321B1 (ko) * 2014-09-04 2022-12-27 니혼 고쥰도가가쿠 가부시키가이샤 팔라듐 도금액 및 그것을 사용하여 얻어진 팔라듐 피막
JP6189878B2 (ja) * 2015-01-14 2017-08-30 松田産業株式会社 パラジウム又はパラジウム合金めっき用シアン耐性付与剤、めっき液、めっき液へのシアン耐性付与方法
CN107858718A (zh) * 2017-11-28 2018-03-30 江苏澳光电子有限公司 一种用于塑料表面电镀的钯镀液及其应用
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
CN109183096B (zh) * 2018-11-08 2021-04-23 杭州云会五金电镀有限公司 一种用于合金的表面电镀液及电镀工艺
CN114084984A (zh) * 2022-01-20 2022-02-25 河北海力香料股份有限公司 一种从联苯四甲酸含钯废水中回收钯的方法
CN116675717B (zh) * 2022-02-22 2025-11-25 北京车和家汽车科技有限公司 钯配合物激发剂、纳米复合材料、后整理剂、纺织面料及其应用

Family Cites Families (16)

* Cited by examiner, † Cited by third party
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GB1051383A (enExample) * 1965-02-17
CH572989A5 (enExample) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution
JPS5747891A (en) * 1980-09-03 1982-03-18 Nippon Dento Kogyo Kk Gold-palladium alloy plating bath
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
GB2112018B (en) * 1981-02-27 1984-08-15 Western Electric Co Palladium and palladium alloys electroplating procedure
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
EP0415632A1 (en) * 1989-08-29 1991-03-06 AT&T Corp. Palladium alloy electroplating process
JPH06340983A (ja) * 1993-06-02 1994-12-13 Takamatsu Mekki Kogyo Kk パラジウムー銅メッキ被覆を有する装身具
JPH0711476A (ja) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk パラジウムめっき液
KR0171685B1 (ko) * 1994-02-26 1999-02-18 문성수 팔라듐 2원 또는 3원 합금 도금 조성물, 이를 이용한 도금방법 및 도금체
JPH07278870A (ja) * 1994-04-08 1995-10-24 Kojima Kagaku Yakuhin Kk パラジウムめっき液
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
JP3685276B2 (ja) * 1996-07-01 2005-08-17 日本エレクトロプレイテイング・エンジニヤース株式会社 パラジウム・銀合金めっき浴
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104694053A (zh) * 2015-02-15 2015-06-10 滁州云林数码影像耗材有限公司 一种墙体用丙烯酸酯压敏胶及其制备方法
CN104694053B (zh) * 2015-02-15 2016-09-07 滁州云林数码影像耗材有限公司 一种墙体用丙烯酸酯压敏胶及其制备方法

Also Published As

Publication number Publication date
JP4790191B2 (ja) 2011-10-12
DE60102364T2 (de) 2005-03-17
EP1272691A1 (fr) 2003-01-08
ES2220757T3 (es) 2004-12-16
FR2807450A1 (fr) 2001-10-12
US6743346B2 (en) 2004-06-01
ATE262055T1 (de) 2004-04-15
FR2807450B1 (fr) 2002-07-05
EP1272691B1 (fr) 2004-03-17
CN1430683A (zh) 2003-07-16
JP2003530486A (ja) 2003-10-14
AU2001248465A1 (en) 2001-10-23
DE60102364D1 (de) 2004-04-22
US20030183533A1 (en) 2003-10-02
WO2001077417A1 (fr) 2001-10-18

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Granted publication date: 20050223