AU2001248465A1 - Electrolytic solution for electrochemical deposit of palladium or its alloys - Google Patents
Electrolytic solution for electrochemical deposit of palladium or its alloysInfo
- Publication number
- AU2001248465A1 AU2001248465A1 AU2001248465A AU4846501A AU2001248465A1 AU 2001248465 A1 AU2001248465 A1 AU 2001248465A1 AU 2001248465 A AU2001248465 A AU 2001248465A AU 4846501 A AU4846501 A AU 4846501A AU 2001248465 A1 AU2001248465 A1 AU 2001248465A1
- Authority
- AU
- Australia
- Prior art keywords
- palladium
- alloys
- bath
- electrolytic solution
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention relates to an aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium or its alloys, said bath comprising a palladium compound and optionally at least one compound of a secondary metal to be codeposited in the form of an alloy with the palladium, and also comprising ethylenediamine as a palladium complexing agent, and an organic brightening agent, in which bath said brightening agent is 3-(3-pyridyl)acrylic acid, 3-(3-quinolyl)acrylic acid or one of their salts. It further relates to a process for the electroplating of palladium or a palladium alloy which comprises operating an electrolysis bath as defined above by using current densities of between 0.5 and 150 A/dm<2>.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0004381A FR2807450B1 (en) | 2000-04-06 | 2000-04-06 | ELECTROLYTIC BATH FOR ELECTROCHEMICAL DEPOSITION OF PALLADIUM OR ITS ALLOYS |
FR0004381 | 2000-04-06 | ||
PCT/FR2001/001021 WO2001077417A1 (en) | 2000-04-06 | 2001-04-05 | Electrolytic solution for electrochemical deposit of palladium or its alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001248465A1 true AU2001248465A1 (en) | 2001-10-23 |
Family
ID=8848927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001248465A Abandoned AU2001248465A1 (en) | 2000-04-06 | 2001-04-05 | Electrolytic solution for electrochemical deposit of palladium or its alloys |
Country Status (10)
Country | Link |
---|---|
US (1) | US6743346B2 (en) |
EP (1) | EP1272691B1 (en) |
JP (1) | JP4790191B2 (en) |
CN (1) | CN1190522C (en) |
AT (1) | ATE262055T1 (en) |
AU (1) | AU2001248465A1 (en) |
DE (1) | DE60102364T2 (en) |
ES (1) | ES2220757T3 (en) |
FR (1) | FR2807450B1 (en) |
WO (1) | WO2001077417A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2807422B1 (en) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | PALLADIUM COMPLEX SALT AND ITS USE FOR ADJUSTING THE PALLADIUM CONCENTRATION OF AN ELECTROLYTIC BATH FOR DEPOSITION OF PALLADIUM OR ONE OF ITS ALLOYS |
US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
US6828898B2 (en) * | 2003-04-03 | 2004-12-07 | Cts Corporation | Fuel tank resistor card having improved corrosion resistance |
US8361553B2 (en) * | 2004-07-30 | 2013-01-29 | Kimberly-Clark Worldwide, Inc. | Methods and compositions for metal nanoparticle treated surfaces |
PL2283170T3 (en) * | 2008-05-07 | 2012-09-28 | Umicore Galvanotechnik Gmbh | Pd and pd-ni electrolyte baths |
ATE473991T1 (en) * | 2008-05-07 | 2010-07-15 | Umicore Galvanotechnik Gmbh | METHOD FOR PRODUCING COMPLEXES OF PALLADIUM (HYDROGEN) CARBONATE WITH AMINE LIGANDS |
CN101838830B (en) * | 2010-05-07 | 2012-08-15 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
EP2431502B1 (en) | 2010-09-21 | 2017-05-24 | Rohm and Haas Electronic Materials LLC | Cyanide-free silver electroplating solutions |
CN102677110B (en) * | 2012-04-19 | 2016-08-10 | 永保纳米科技(深圳)有限公司 | A kind of rhotanium electroplate liquid and preparation method thereof and electroplating technology |
JP6620103B2 (en) * | 2014-09-04 | 2019-12-11 | 日本高純度化学株式会社 | Palladium plating solution and palladium film obtained using the same |
JP6189878B2 (en) * | 2015-01-14 | 2017-08-30 | 松田産業株式会社 | Cyan resistance imparting agent for palladium or palladium alloy plating, plating solution, method for imparting cyan resistance to plating solution |
CN104694053B (en) * | 2015-02-15 | 2016-09-07 | 滁州云林数码影像耗材有限公司 | A kind of body of wall acrylate pressure-sensitive adhesive and preparation method thereof |
CN107858718A (en) * | 2017-11-28 | 2018-03-30 | 江苏澳光电子有限公司 | A kind of palladium plating solution and its application for plastic surface galvanizing |
CN108864200B (en) * | 2018-08-06 | 2020-12-11 | 金川集团股份有限公司 | One-step preparation method of ethylenediamine palladium sulfate for electroplating |
CN109183096B (en) * | 2018-11-08 | 2021-04-23 | 杭州云会五金电镀有限公司 | Surface electroplating liquid for alloy and electroplating process |
CN114084984A (en) * | 2022-01-20 | 2022-02-25 | 河北海力香料股份有限公司 | Method for recovering palladium from biphenyl tetracarboxylic acid palladium-containing wastewater |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1051383A (en) * | 1965-02-17 | |||
CH572989A5 (en) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
US4278514A (en) * | 1980-02-12 | 1981-07-14 | Technic, Inc. | Bright palladium electrodeposition solution |
JPS5747891A (en) * | 1980-09-03 | 1982-03-18 | Nippon Dento Kogyo Kk | Gold-palladium alloy plating bath |
US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
GB2112018B (en) * | 1981-02-27 | 1984-08-15 | Western Electric Co | Palladium and palladium alloys electroplating procedure |
GB8612361D0 (en) * | 1986-05-21 | 1986-06-25 | Engelhard Corp | Gold electroplating bath |
EP0415632A1 (en) * | 1989-08-29 | 1991-03-06 | AT&T Corp. | Palladium alloy electroplating process |
JPH06340983A (en) * | 1993-06-02 | 1994-12-13 | Takamatsu Mekki Kogyo Kk | Personal ornament with palladium-copper plating film |
JPH0711476A (en) * | 1993-06-23 | 1995-01-13 | Kojima Kagaku Yakuhin Kk | Palladium plating solution |
KR0171685B1 (en) * | 1994-02-26 | 1999-02-18 | 문성수 | Palladium alloy plating compositions comprising two or three components |
JPH07278870A (en) * | 1994-04-08 | 1995-10-24 | Kojima Kagaku Yakuhin Kk | Palladium plating solution |
US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
JP3685276B2 (en) * | 1996-07-01 | 2005-08-17 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Palladium / silver alloy plating bath |
FR2807422B1 (en) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | PALLADIUM COMPLEX SALT AND ITS USE FOR ADJUSTING THE PALLADIUM CONCENTRATION OF AN ELECTROLYTIC BATH FOR DEPOSITION OF PALLADIUM OR ONE OF ITS ALLOYS |
-
2000
- 2000-04-06 FR FR0004381A patent/FR2807450B1/en not_active Expired - Fee Related
-
2001
- 2001-04-05 EP EP01921482A patent/EP1272691B1/en not_active Expired - Lifetime
- 2001-04-05 DE DE60102364T patent/DE60102364T2/en not_active Expired - Lifetime
- 2001-04-05 AT AT01921482T patent/ATE262055T1/en not_active IP Right Cessation
- 2001-04-05 ES ES01921482T patent/ES2220757T3/en not_active Expired - Lifetime
- 2001-04-05 AU AU2001248465A patent/AU2001248465A1/en not_active Abandoned
- 2001-04-05 US US10/239,863 patent/US6743346B2/en not_active Expired - Fee Related
- 2001-04-05 CN CNB01809757XA patent/CN1190522C/en not_active Expired - Lifetime
- 2001-04-05 WO PCT/FR2001/001021 patent/WO2001077417A1/en active IP Right Grant
- 2001-04-05 JP JP2001575263A patent/JP4790191B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2001077417A1 (en) | 2001-10-18 |
CN1430683A (en) | 2003-07-16 |
ATE262055T1 (en) | 2004-04-15 |
EP1272691A1 (en) | 2003-01-08 |
US20030183533A1 (en) | 2003-10-02 |
FR2807450B1 (en) | 2002-07-05 |
DE60102364T2 (en) | 2005-03-17 |
ES2220757T3 (en) | 2004-12-16 |
US6743346B2 (en) | 2004-06-01 |
CN1190522C (en) | 2005-02-23 |
JP4790191B2 (en) | 2011-10-12 |
EP1272691B1 (en) | 2004-03-17 |
JP2003530486A (en) | 2003-10-14 |
FR2807450A1 (en) | 2001-10-12 |
DE60102364D1 (en) | 2004-04-22 |
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