ATE262055T1 - Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen - Google Patents

Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen

Info

Publication number
ATE262055T1
ATE262055T1 AT01921482T AT01921482T ATE262055T1 AT E262055 T1 ATE262055 T1 AT E262055T1 AT 01921482 T AT01921482 T AT 01921482T AT 01921482 T AT01921482 T AT 01921482T AT E262055 T1 ATE262055 T1 AT E262055T1
Authority
AT
Austria
Prior art keywords
palladium
alloys
electrochemical deposition
bath
electrolytic solution
Prior art date
Application number
AT01921482T
Other languages
English (en)
Inventor
Jose Gonzalez
Lionel Chalumeau
Michel Limayrac
Original Assignee
Metalor Technologies France S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies France S filed Critical Metalor Technologies France S
Application granted granted Critical
Publication of ATE262055T1 publication Critical patent/ATE262055T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
AT01921482T 2000-04-06 2001-04-05 Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen ATE262055T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0004381A FR2807450B1 (fr) 2000-04-06 2000-04-06 Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
PCT/FR2001/001021 WO2001077417A1 (fr) 2000-04-06 2001-04-05 Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages

Publications (1)

Publication Number Publication Date
ATE262055T1 true ATE262055T1 (de) 2004-04-15

Family

ID=8848927

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01921482T ATE262055T1 (de) 2000-04-06 2001-04-05 Elektrolytische lösung zur elektrochemischen abscheidung von palladium oder dessen legierungen

Country Status (10)

Country Link
US (1) US6743346B2 (de)
EP (1) EP1272691B1 (de)
JP (1) JP4790191B2 (de)
CN (1) CN1190522C (de)
AT (1) ATE262055T1 (de)
AU (1) AU2001248465A1 (de)
DE (1) DE60102364T2 (de)
ES (1) ES2220757T3 (de)
FR (1) FR2807450B1 (de)
WO (1) WO2001077417A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US8361553B2 (en) * 2004-07-30 2013-01-29 Kimberly-Clark Worldwide, Inc. Methods and compositions for metal nanoparticle treated surfaces
EP2116550B1 (de) 2008-05-07 2010-07-14 Umicore Galvanotechnik GmbH Verfahren zur Herstellung von Komplexen des Palladium(hydrogen) carbonats mit Aminliganden
EP2283170B1 (de) * 2008-05-07 2012-04-25 Umicore Galvanotechnik GmbH Pd- und pd-ni-elektrolytbäder
CN101838830B (zh) * 2010-05-07 2012-08-15 厦门大学 一种电镀钯镍合金的电解液
EP2431502B1 (de) 2010-09-21 2017-05-24 Rohm and Haas Electronic Materials LLC Cyanidfreie silberelektroplattierungslösungen
CN102677110B (zh) * 2012-04-19 2016-08-10 永保纳米科技(深圳)有限公司 一种金钯合金电镀液及其制备方法和电镀工艺
CN106661735B (zh) * 2014-09-04 2019-12-10 日本高纯度化学株式会社 钯镀液和使用该钯镀液得到的钯覆膜
JP6189878B2 (ja) * 2015-01-14 2017-08-30 松田産業株式会社 パラジウム又はパラジウム合金めっき用シアン耐性付与剤、めっき液、めっき液へのシアン耐性付与方法
CN104694053B (zh) * 2015-02-15 2016-09-07 滁州云林数码影像耗材有限公司 一种墙体用丙烯酸酯压敏胶及其制备方法
CN107858718A (zh) * 2017-11-28 2018-03-30 江苏澳光电子有限公司 一种用于塑料表面电镀的钯镀液及其应用
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
CN109183096B (zh) * 2018-11-08 2021-04-23 杭州云会五金电镀有限公司 一种用于合金的表面电镀液及电镀工艺
CN114084984A (zh) * 2022-01-20 2022-02-25 河北海力香料股份有限公司 一种从联苯四甲酸含钯废水中回收钯的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
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GB1051383A (de) * 1965-02-17
CH572989A5 (de) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution
JPS5747891A (en) * 1980-09-03 1982-03-18 Nippon Dento Kogyo Kk Gold-palladium alloy plating bath
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
JPS58500289A (ja) * 1981-02-27 1983-02-24 ウエスタ−ン　エレクトリツク　カムパニ−，インコ−ポレ−テツド パラジウムとパラジウム合金の電気メツキ方法
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
EP0415632A1 (de) * 1989-08-29 1991-03-06 AT&T Corp. Palladiumlegierung-Elektroplattierungsverfahren
JPH06340983A (ja) * 1993-06-02 1994-12-13 Takamatsu Mekki Kogyo Kk パラジウムー銅メッキ被覆を有する装身具
JPH0711476A (ja) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk パラジウムめっき液
KR0171685B1 (ko) * 1994-02-26 1999-02-18 문성수 팔라듐 2원 또는 3원 합금 도금 조성물, 이를 이용한 도금방법 및 도금체
JPH07278870A (ja) * 1994-04-08 1995-10-24 Kojima Kagaku Yakuhin Kk パラジウムめっき液
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
JP3685276B2 (ja) * 1996-07-01 2005-08-17 日本エレクトロプレイテイング・エンジニヤース株式会社 パラジウム・銀合金めっき浴
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages

Also Published As

Publication number Publication date
EP1272691A1 (de) 2003-01-08
FR2807450B1 (fr) 2002-07-05
US20030183533A1 (en) 2003-10-02
DE60102364D1 (de) 2004-04-22
WO2001077417A1 (fr) 2001-10-18
AU2001248465A1 (en) 2001-10-23
FR2807450A1 (fr) 2001-10-12
US6743346B2 (en) 2004-06-01
JP4790191B2 (ja) 2011-10-12
CN1190522C (zh) 2005-02-23
CN1430683A (zh) 2003-07-16
DE60102364T2 (de) 2005-03-17
EP1272691B1 (de) 2004-03-17
ES2220757T3 (es) 2004-12-16
JP2003530486A (ja) 2003-10-14

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