CN118804952A - 双组分型导热性加成固化型有机硅组合物及其有机硅固化物 - Google Patents

双组分型导热性加成固化型有机硅组合物及其有机硅固化物 Download PDF

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CN118804952A
CN118804952A CN202380025147.3A CN202380025147A CN118804952A CN 118804952 A CN118804952 A CN 118804952A CN 202380025147 A CN202380025147 A CN 202380025147A CN 118804952 A CN118804952 A CN 118804952A
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component
mass
thermally conductive
parts
silicone composition
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多畑勇志
岩田充弘
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/08Preparatory processes characterised by the catalysts used
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
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    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
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    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/04Polysiloxanes
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08L2312/00Crosslinking
    • C08L2312/08Crosslinking by silane

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202380025147.3A 2022-03-08 2023-02-21 双组分型导热性加成固化型有机硅组合物及其有机硅固化物 Pending CN118804952A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022035272 2022-03-08
JP2022-035272 2022-03-08
PCT/JP2023/006097 WO2023171353A1 (ja) 2022-03-08 2023-02-21 2液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

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CN118804952A true CN118804952A (zh) 2024-10-18

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CN202380025147.3A Pending CN118804952A (zh) 2022-03-08 2023-02-21 双组分型导热性加成固化型有机硅组合物及其有机硅固化物

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US (1) US20250171636A1 (https=)
EP (1) EP4491673A4 (https=)
JP (1) JPWO2023171353A1 (https=)
KR (1) KR20240157075A (https=)
CN (1) CN118804952A (https=)
TW (1) TW202407015A (https=)
WO (1) WO2023171353A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240157074A (ko) * 2022-03-08 2024-10-31 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물
JP2024129724A (ja) * 2023-03-13 2024-09-27 住友化学株式会社 着色硬化性樹脂組成物、カラーフィルタ、及び固体撮像素子

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933094B1 (https=) 1968-12-31 1974-09-04
JPS4913874B1 (https=) 1969-08-29 1974-04-03
JPS4917380B1 (https=) 1970-07-06 1974-04-30
JPS58366B2 (ja) 1973-10-06 1983-01-06 ソニー株式会社 表面材貼付方法
JPS5233325U (https=) 1975-08-30 1977-03-09
JPS5283346U (https=) 1975-12-17 1977-06-21
JPS5447337U (https=) 1977-09-07 1979-04-02
JPS5738088Y2 (https=) 1978-10-04 1982-08-23
JPS6048416U (ja) 1983-09-13 1985-04-05 住友ベークライト株式会社 板状体のそり直し装置
JPH09176495A (ja) * 1995-12-28 1997-07-08 Furukawa Electric Co Ltd:The 屋外用絶縁高分子材料組成物および屋外用高電圧機器
JP2938429B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2938428B1 (ja) 1998-02-27 1999-08-23 信越化学工業株式会社 熱伝導性グリース組成物
JP4678910B2 (ja) * 2000-03-03 2011-04-27 ダウ コーニング コーポレーション 有機ケイ素化合物の製造方法
JP3580366B2 (ja) 2001-05-01 2004-10-20 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
EP1266903B1 (en) * 2001-06-15 2004-09-29 DOW CORNING ASIA, Ltd. Method of preparing an organosilicon compound
JP3952184B2 (ja) 2002-10-10 2007-08-01 信越化学工業株式会社 熱伝導性シート
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4917380B2 (ja) 2006-07-31 2012-04-18 信越化学工業株式会社 放熱用シリコーングリース組成物及びその製造方法
JP5283346B2 (ja) 2007-04-10 2013-09-04 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP5233325B2 (ja) 2008-02-29 2013-07-10 信越化学工業株式会社 熱伝導性硬化物及びその製造方法
JP4656340B2 (ja) 2008-03-03 2011-03-23 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP4572243B2 (ja) 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP4913874B2 (ja) 2010-01-18 2012-04-11 信越化学工業株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
CN102906309B (zh) * 2010-04-22 2015-01-14 日本化药株式会社 防银变色剂、防银变色树脂组合物、防银变色方法、及使用该防银变色剂的发光二极管
JP5447337B2 (ja) 2010-10-29 2014-03-19 信越化学工業株式会社 シリコーン構造体の製造方法及び半導体装置
JP5553006B2 (ja) 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
KR101866299B1 (ko) 2011-01-26 2018-06-12 다우 실리콘즈 코포레이션 고온 안정성 열 전도성 재료
CN103145748A (zh) * 2013-03-08 2013-06-12 山东大学 一种含有8-羟基喹啉有机硅聚合物的金属离子配合物
TWI459145B (zh) * 2013-04-26 2014-11-01 Chi Mei Corp 光硬化性聚矽氧烷組成物、保護膜及具有保護膜的元件
TWI506374B (zh) * 2013-09-10 2015-11-01 Chi Mei Corp 感光性聚矽氧烷組成物、保護膜及具有保護膜的元件
TWI540396B (zh) * 2014-02-18 2016-07-01 奇美實業股份有限公司 感光性聚矽氧烷組成物、保護膜及具有保護膜的元件
JP6502809B2 (ja) * 2015-09-17 2019-04-17 信越化学工業株式会社 Led封止材用蛍光体含有シリコーンフィルム及びその製造方法
CN106243704A (zh) * 2016-08-30 2016-12-21 宁波通冠电气自动化设备有限公司 一种led用散热呼吸器尼龙材料及其制备方法
CN106702749A (zh) * 2016-12-13 2017-05-24 中山市得高行知识产权中心(有限合伙) 一种纺织面料表面改性处理剂及其制备方法
JP6887815B2 (ja) 2017-01-30 2021-06-16 富士高分子工業株式会社 耐熱性熱伝導性シリコーン組成物
WO2019025002A1 (de) * 2017-08-04 2019-02-07 Wacker Chemie Ag Stabilisierung von edelmetallkatalysatoren
CA3210167A1 (en) * 2021-02-09 2022-08-18 Genentech, Inc. Tetracyclic oxazepine compounds and uses thereof
WO2022181281A1 (ja) * 2021-02-25 2022-09-01 コニカミノルタ株式会社 封止材組成物、半導体封止材料及び半導体
KR20240157074A (ko) * 2022-03-08 2024-10-31 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 부가 경화형 실리콘 조성물 및 그 실리콘 경화물

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US20250171636A1 (en) 2025-05-29
EP4491673A1 (en) 2025-01-15
JPWO2023171353A1 (https=) 2023-09-14
KR20240157075A (ko) 2024-10-31
TW202407015A (zh) 2024-02-16
EP4491673A4 (en) 2026-03-18
WO2023171353A1 (ja) 2023-09-14

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