CN1187804C - 采用导电的粘合膜的功率半导体管芯的连接方法 - Google Patents

采用导电的粘合膜的功率半导体管芯的连接方法 Download PDF

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Publication number
CN1187804C
CN1187804C CNB008161534A CN00816153A CN1187804C CN 1187804 C CN1187804 C CN 1187804C CN B008161534 A CNB008161534 A CN B008161534A CN 00816153 A CN00816153 A CN 00816153A CN 1187804 C CN1187804 C CN 1187804C
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China
Prior art keywords
tube core
film
area
substrate
bonding film
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Expired - Fee Related
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CNB008161534A
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English (en)
Chinese (zh)
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CN1399794A (zh
Inventor
M·帕维尔
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Infineon science and technology Americas
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International Rectifier Corp USA
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CNB008161534A 1999-11-24 2000-11-22 采用导电的粘合膜的功率半导体管芯的连接方法 Expired - Fee Related CN1187804C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16745699P 1999-11-24 1999-11-24
US60/167,456 1999-11-24

Publications (2)

Publication Number Publication Date
CN1399794A CN1399794A (zh) 2003-02-26
CN1187804C true CN1187804C (zh) 2005-02-02

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Application Number Title Priority Date Filing Date
CNB008161534A Expired - Fee Related CN1187804C (zh) 1999-11-24 2000-11-22 采用导电的粘合膜的功率半导体管芯的连接方法

Country Status (6)

Country Link
JP (1) JP3771843B2 (ja)
KR (1) KR100468233B1 (ja)
CN (1) CN1187804C (ja)
AU (1) AU1927501A (ja)
TW (1) TW501207B (ja)
WO (1) WO2001039266A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620651B2 (en) * 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
US6781352B2 (en) 2002-12-16 2004-08-24 International Rectifer Corporation One cycle control continuous conduction mode PFC boost converter integrated circuit with integrated power switch and boost converter
WO2005057644A1 (ja) * 2003-12-15 2005-06-23 The Furukawa Electric Co., Ltd. ウェハ加工用テープおよびその製造方法
JP2006114649A (ja) * 2004-10-14 2006-04-27 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法およびその製造装置
CN101807531A (zh) * 2010-03-30 2010-08-18 上海凯虹电子有限公司 一种超薄芯片的封装方法以及封装体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2994510B2 (ja) * 1992-02-10 1999-12-27 ローム株式会社 半導体装置およびその製法
US5286679A (en) * 1993-03-18 1994-02-15 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer
JP3467611B2 (ja) * 1995-09-29 2003-11-17 日本テキサス・インスツルメンツ株式会社 半導体装置の製造方法
US5776799A (en) * 1996-11-08 1998-07-07 Samsung Electronics Co., Ltd. Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same

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Publication number Publication date
CN1399794A (zh) 2003-02-26
AU1927501A (en) 2001-06-04
KR20020059782A (ko) 2002-07-13
KR100468233B1 (ko) 2005-01-26
WO2001039266A1 (en) 2001-05-31
WO2001039266A9 (en) 2002-04-18
JP3771843B2 (ja) 2006-04-26
JP2003515929A (ja) 2003-05-07
TW501207B (en) 2002-09-01

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