CN117063620A - 贯通电极基板 - Google Patents

贯通电极基板 Download PDF

Info

Publication number
CN117063620A
CN117063620A CN202280024043.6A CN202280024043A CN117063620A CN 117063620 A CN117063620 A CN 117063620A CN 202280024043 A CN202280024043 A CN 202280024043A CN 117063620 A CN117063620 A CN 117063620A
Authority
CN
China
Prior art keywords
substrate
hole
electrode
electrode substrate
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280024043.6A
Other languages
English (en)
Chinese (zh)
Inventor
仓持悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN117063620A publication Critical patent/CN117063620A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN202280024043.6A 2021-02-15 2022-02-15 贯通电极基板 Pending CN117063620A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021523 2021-02-15
JP2021-021523 2021-02-15
PCT/JP2022/005968 WO2022173057A1 (ja) 2021-02-15 2022-02-15 貫通電極基板

Publications (1)

Publication Number Publication Date
CN117063620A true CN117063620A (zh) 2023-11-14

Family

ID=82838388

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280024043.6A Pending CN117063620A (zh) 2021-02-15 2022-02-15 贯通电极基板

Country Status (6)

Country Link
US (1) US20240339389A1 (https=)
JP (1) JPWO2022173057A1 (https=)
KR (1) KR20230146557A (https=)
CN (1) CN117063620A (https=)
TW (1) TWI904333B (https=)
WO (1) WO2022173057A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024085727A1 (ko) * 2022-10-21 2024-04-25 동우 화인켐 주식회사 전자부품용 기판, 상기 전자부품용 기판의 제조방법 및 이를 포함하는 표시 장치 및 반도체 장치
JP2024172826A (ja) * 2023-06-01 2024-12-12 イビデン株式会社 プリント配線板
JPWO2024253200A1 (https=) 2023-06-09 2024-12-12
WO2025121374A1 (ja) * 2023-12-05 2025-06-12 大日本印刷株式会社 貫通電極基板及び貫通電極基板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6201663B2 (ja) * 2013-11-13 2017-09-27 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板、および半導体装置
KR20170040918A (ko) * 2015-10-06 2017-04-14 삼성전자주식회사 바이오 센서 및 그의 센싱 방법
JP6280956B2 (ja) * 2016-06-20 2018-02-14 株式会社フジクラ アンテナ装置及びその製造方法
WO2018092480A1 (ja) * 2016-11-17 2018-05-24 大日本印刷株式会社 貫通電極基板、貫通電極基板を用いた半導体装置、および貫通電極基板の製造方法
JP7003412B2 (ja) * 2017-02-03 2022-01-20 大日本印刷株式会社 導電基板およびその製造方法
JP7022365B2 (ja) 2017-03-24 2022-02-18 大日本印刷株式会社 貫通電極基板及びその製造方法
US11078112B2 (en) * 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP7180605B2 (ja) * 2017-09-29 2022-11-30 大日本印刷株式会社 貫通電極基板及び貫通電極基板を用いた半導体装置
US11152294B2 (en) * 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
JP6369653B1 (ja) * 2018-05-17 2018-08-08 大日本印刷株式会社 貫通電極基板および半導体装置
WO2020022129A1 (ja) * 2018-07-25 2020-01-30 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
JP7207193B2 (ja) * 2019-06-21 2023-01-18 Ａｇｃ株式会社 導波管フィルタ
JP6927251B2 (ja) * 2019-07-08 2021-08-25 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Also Published As

Publication number Publication date
TW202247725A (zh) 2022-12-01
TWI904333B (zh) 2025-11-11
WO2022173057A1 (ja) 2022-08-18
JPWO2022173057A1 (https=) 2022-08-18
KR20230146557A (ko) 2023-10-19
US20240339389A1 (en) 2024-10-10

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