JPWO2022173057A1 - - Google Patents

Info

Publication number
JPWO2022173057A1
JPWO2022173057A1 JP2022580720A JP2022580720A JPWO2022173057A1 JP WO2022173057 A1 JPWO2022173057 A1 JP WO2022173057A1 JP 2022580720 A JP2022580720 A JP 2022580720A JP 2022580720 A JP2022580720 A JP 2022580720A JP WO2022173057 A1 JPWO2022173057 A1 JP WO2022173057A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022580720A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022173057A1 publication Critical patent/JPWO2022173057A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2022580720A 2021-02-15 2022-02-15 Pending JPWO2022173057A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021523 2021-02-15
PCT/JP2022/005968 WO2022173057A1 (ja) 2021-02-15 2022-02-15 貫通電極基板

Publications (1)

Publication Number Publication Date
JPWO2022173057A1 true JPWO2022173057A1 (https=) 2022-08-18

Family

ID=82838388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580720A Pending JPWO2022173057A1 (https=) 2021-02-15 2022-02-15

Country Status (6)

Country Link
US (1) US20240339389A1 (https=)
JP (1) JPWO2022173057A1 (https=)
KR (1) KR20230146557A (https=)
CN (1) CN117063620A (https=)
TW (1) TWI904333B (https=)
WO (1) WO2022173057A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024085727A1 (ko) * 2022-10-21 2024-04-25 동우 화인켐 주식회사 전자부품용 기판, 상기 전자부품용 기판의 제조방법 및 이를 포함하는 표시 장치 및 반도체 장치
JP2024172826A (ja) * 2023-06-01 2024-12-12 イビデン株式会社 プリント配線板
JPWO2024253200A1 (https=) 2023-06-09 2024-12-12
WO2025121374A1 (ja) * 2023-12-05 2025-06-12 大日本印刷株式会社 貫通電極基板及び貫通電極基板の製造方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015095590A (ja) * 2013-11-13 2015-05-18 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板、および半導体装置
WO2017061727A1 (ko) * 2015-10-06 2017-04-13 삼성전자 주식회사 바이오 센서 및 그의 센싱 방법
JP2017228846A (ja) * 2016-06-20 2017-12-28 株式会社フジクラ アンテナ装置及びその製造方法
WO2018092480A1 (ja) * 2016-11-17 2018-05-24 大日本印刷株式会社 貫通電極基板、貫通電極基板を用いた半導体装置、および貫通電極基板の製造方法
JP2018125491A (ja) * 2017-02-03 2018-08-09 大日本印刷株式会社 導電基板およびその製造方法
WO2018217698A2 (en) * 2017-05-25 2018-11-29 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP2018195825A (ja) * 2018-05-17 2018-12-06 大日本印刷株式会社 貫通電極基板および半導体装置
WO2019199677A2 (en) * 2018-04-09 2019-10-17 Corning Incorporated Hermetic metallized via with improved reliability
WO2020022129A1 (ja) * 2018-07-25 2020-01-30 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
JP2021002779A (ja) * 2019-06-21 2021-01-07 Ａｇｃ株式会社 導波管フィルタ
JP2021011411A (ja) * 2019-07-08 2021-02-04 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7022365B2 (ja) 2017-03-24 2022-02-18 大日本印刷株式会社 貫通電極基板及びその製造方法
JP7180605B2 (ja) * 2017-09-29 2022-11-30 大日本印刷株式会社 貫通電極基板及び貫通電極基板を用いた半導体装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015095590A (ja) * 2013-11-13 2015-05-18 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板、および半導体装置
WO2017061727A1 (ko) * 2015-10-06 2017-04-13 삼성전자 주식회사 바이오 센서 및 그의 센싱 방법
JP2017228846A (ja) * 2016-06-20 2017-12-28 株式会社フジクラ アンテナ装置及びその製造方法
WO2018092480A1 (ja) * 2016-11-17 2018-05-24 大日本印刷株式会社 貫通電極基板、貫通電極基板を用いた半導体装置、および貫通電極基板の製造方法
JP2018125491A (ja) * 2017-02-03 2018-08-09 大日本印刷株式会社 導電基板およびその製造方法
WO2018217698A2 (en) * 2017-05-25 2018-11-29 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
WO2019199677A2 (en) * 2018-04-09 2019-10-17 Corning Incorporated Hermetic metallized via with improved reliability
JP2018195825A (ja) * 2018-05-17 2018-12-06 大日本印刷株式会社 貫通電極基板および半導体装置
WO2020022129A1 (ja) * 2018-07-25 2020-01-30 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
JP2021002779A (ja) * 2019-06-21 2021-01-07 Ａｇｃ株式会社 導波管フィルタ
JP2021011411A (ja) * 2019-07-08 2021-02-04 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Also Published As

Publication number Publication date
CN117063620A (zh) 2023-11-14
TW202247725A (zh) 2022-12-01
TWI904333B (zh) 2025-11-11
WO2022173057A1 (ja) 2022-08-18
KR20230146557A (ko) 2023-10-19
US20240339389A1 (en) 2024-10-10

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