JPWO2024253200A1 - - Google Patents
Info
- Publication number
- JPWO2024253200A1 JPWO2024253200A1 JP2025526170A JP2025526170A JPWO2024253200A1 JP WO2024253200 A1 JPWO2024253200 A1 JP WO2024253200A1 JP 2025526170 A JP2025526170 A JP 2025526170A JP 2025526170 A JP2025526170 A JP 2025526170A JP WO2024253200 A1 JPWO2024253200 A1 JP WO2024253200A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023095806 | 2023-06-09 | ||
| JP2024077561 | 2024-05-10 | ||
| PCT/JP2024/020939 WO2024253200A1 (ja) | 2023-06-09 | 2024-06-07 | 貫通電極基板、実装基板及び貫通電極基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024253200A1 true JPWO2024253200A1 (https=) | 2024-12-12 |
Family
ID=93795505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025526170A Pending JPWO2024253200A1 (https=) | 2023-06-09 | 2024-06-07 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4727267A1 (https=) |
| JP (1) | JPWO2024253200A1 (https=) |
| KR (1) | KR20260019614A (https=) |
| CN (1) | CN121264176A (https=) |
| TW (1) | TW202520798A (https=) |
| WO (1) | WO2024253200A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310779A (ja) * | 2005-03-29 | 2006-11-09 | Kyocera Corp | 回路基板および電子装置 |
| US8785790B2 (en) * | 2011-11-10 | 2014-07-22 | Invensas Corporation | High strength through-substrate vias |
| EP3570645B1 (en) * | 2018-05-17 | 2023-01-25 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with only partially filled thermal through-hole |
| JP7219598B2 (ja) * | 2018-11-27 | 2023-02-08 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| US20240339389A1 (en) | 2021-02-15 | 2024-10-10 | Dai Nippon Printing Co., Ltd. | Through via substrate |
-
2024
- 2024-06-07 JP JP2025526170A patent/JPWO2024253200A1/ja active Pending
- 2024-06-07 KR KR1020267000218A patent/KR20260019614A/ko active Pending
- 2024-06-07 TW TW113121375A patent/TW202520798A/zh unknown
- 2024-06-07 EP EP24819427.6A patent/EP4727267A1/en active Pending
- 2024-06-07 CN CN202480038326.5A patent/CN121264176A/zh active Pending
- 2024-06-07 WO PCT/JP2024/020939 patent/WO2024253200A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| TW202520798A (zh) | 2025-05-16 |
| WO2024253200A1 (ja) | 2024-12-12 |
| CN121264176A (zh) | 2026-01-02 |
| KR20260019614A (ko) | 2026-02-10 |
| EP4727267A1 (en) | 2026-04-15 |