KR20260019614A - 관통 전극 기판, 실장 기판 및 관통 전극 기판의 제조 방법 - Google Patents

관통 전극 기판, 실장 기판 및 관통 전극 기판의 제조 방법

Info

Publication number
KR20260019614A
KR20260019614A KR1020267000218A KR20267000218A KR20260019614A KR 20260019614 A KR20260019614 A KR 20260019614A KR 1020267000218 A KR1020267000218 A KR 1020267000218A KR 20267000218 A KR20267000218 A KR 20267000218A KR 20260019614 A KR20260019614 A KR 20260019614A
Authority
KR
South Korea
Prior art keywords
substrate
electrode
hole
thickness
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020267000218A
Other languages
English (en)
Korean (ko)
Inventor
다카히로 다이
사토루 구라모치
고지 후지모토
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20260019614A publication Critical patent/KR20260019614A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020267000218A 2023-06-09 2024-06-07 관통 전극 기판, 실장 기판 및 관통 전극 기판의 제조 방법 Pending KR20260019614A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2023095806 2023-06-09
JPJP-P-2023-095806 2023-06-09
JPJP-P-2024-077561 2024-05-10
JP2024077561 2024-05-10
PCT/JP2024/020939 WO2024253200A1 (ja) 2023-06-09 2024-06-07 貫通電極基板、実装基板及び貫通電極基板の製造方法

Publications (1)

Publication Number Publication Date
KR20260019614A true KR20260019614A (ko) 2026-02-10

Family

ID=93795505

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020267000218A Pending KR20260019614A (ko) 2023-06-09 2024-06-07 관통 전극 기판, 실장 기판 및 관통 전극 기판의 제조 방법

Country Status (6)

Country Link
EP (1) EP4727267A1 (https=)
JP (1) JPWO2024253200A1 (https=)
KR (1) KR20260019614A (https=)
CN (1) CN121264176A (https=)
TW (1) TW202520798A (https=)
WO (1) WO2024253200A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022173057A1 (ja) 2021-02-15 2022-08-18 大日本印刷株式会社 貫通電極基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310779A (ja) * 2005-03-29 2006-11-09 Kyocera Corp 回路基板および電子装置
US8785790B2 (en) * 2011-11-10 2014-07-22 Invensas Corporation High strength through-substrate vias
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
JP7219598B2 (ja) * 2018-11-27 2023-02-08 新光電気工業株式会社 配線基板及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022173057A1 (ja) 2021-02-15 2022-08-18 大日本印刷株式会社 貫通電極基板

Also Published As

Publication number Publication date
TW202520798A (zh) 2025-05-16
WO2024253200A1 (ja) 2024-12-12
CN121264176A (zh) 2026-01-02
JPWO2024253200A1 (https=) 2024-12-12
EP4727267A1 (en) 2026-04-15

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)