TW202520798A - 貫通電極基板及貫通電極基板之製造方法 - Google Patents

貫通電極基板及貫通電極基板之製造方法 Download PDF

Info

Publication number
TW202520798A
TW202520798A TW113121375A TW113121375A TW202520798A TW 202520798 A TW202520798 A TW 202520798A TW 113121375 A TW113121375 A TW 113121375A TW 113121375 A TW113121375 A TW 113121375A TW 202520798 A TW202520798 A TW 202520798A
Authority
TW
Taiwan
Prior art keywords
substrate
electrode
thickness
hole
dimension
Prior art date
Application number
TW113121375A
Other languages
English (en)
Chinese (zh)
Inventor
田井貴裕
倉持悟
藤本興治
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202520798A publication Critical patent/TW202520798A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
TW113121375A 2023-06-09 2024-06-07 貫通電極基板及貫通電極基板之製造方法 TW202520798A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023095806 2023-06-09
JP2023-095806 2023-06-09
JP2024077561 2024-05-10
JP2024-077561 2024-05-10

Publications (1)

Publication Number Publication Date
TW202520798A true TW202520798A (zh) 2025-05-16

Family

ID=93795505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113121375A TW202520798A (zh) 2023-06-09 2024-06-07 貫通電極基板及貫通電極基板之製造方法

Country Status (6)

Country Link
EP (1) EP4727267A1 (https=)
JP (1) JPWO2024253200A1 (https=)
KR (1) KR20260019614A (https=)
CN (1) CN121264176A (https=)
TW (1) TW202520798A (https=)
WO (1) WO2024253200A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310779A (ja) * 2005-03-29 2006-11-09 Kyocera Corp 回路基板および電子装置
US8785790B2 (en) * 2011-11-10 2014-07-22 Invensas Corporation High strength through-substrate vias
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
JP7219598B2 (ja) * 2018-11-27 2023-02-08 新光電気工業株式会社 配線基板及びその製造方法
US20240339389A1 (en) 2021-02-15 2024-10-10 Dai Nippon Printing Co., Ltd. Through via substrate

Also Published As

Publication number Publication date
WO2024253200A1 (ja) 2024-12-12
CN121264176A (zh) 2026-01-02
JPWO2024253200A1 (https=) 2024-12-12
KR20260019614A (ko) 2026-02-10
EP4727267A1 (en) 2026-04-15

Similar Documents

Publication Publication Date Title
JP7091801B2 (ja) 貫通電極基板及びその製造方法、並びに実装基板
JP7022365B2 (ja) 貫通電極基板及びその製造方法
JP7276403B2 (ja) 貫通電極基板及び実装基板
JP6596906B2 (ja) 貫通電極基板並びに貫通電極基板を用いたインターポーザ及び半導体装置
JP7075625B2 (ja) 貫通電極基板、貫通電極基板の製造方法及び実装基板
CN112151481B (zh) 一种表面强化沸腾散热结构
WO2023085366A1 (ja) 貫通電極基板、実装基板及び貫通電極基板の製造方法
JP2018107423A (ja) 有孔基板、有孔基板を備える実装基板及び有孔基板の製造方法
TWI444113B (zh) A circuit board with a hierarchical conductive unit
JP2019016733A (ja) 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いた半導体装置
TW202520798A (zh) 貫通電極基板及貫通電極基板之製造方法
JP6852415B2 (ja) 貫通電極基板及び貫通電極基板を備える実装基板並びに貫通電極基板の製造方法
TW202531807A (zh) 貫通電極基板及貫通電極基板之製造方法
JP2016225360A (ja) 貫通電極基板並びに貫通電極基板を用いたインターポーザ及び半導体装置
JP7591201B2 (ja) 貫通電極基板及びその製造方法
JP2021009942A (ja) 両面実装基板、両面実装基板の製造方法、および半導体レーザ
WO2026009953A1 (ja) 貫通電極基板、素子付き貫通電極基板、半導体装置および貫通電極用基板
TW202541271A (zh) 貫通電極基板及半導體封裝以及其等之製造方法
JP2017069411A (ja) 貫通電極基板並びに貫通電極基板を用いたインターポーザ及び半導体装置
CN119028829A (zh) 一种玻璃基板结构及其制备方法
JP2019016732A (ja) 貫通電極基板、貫通電極基板の製造方法及び貫通電極基板を用いた半導体装置