CN121264176A - 贯通电极基板、安装基板以及贯通电极基板的制造方法 - Google Patents

贯通电极基板、安装基板以及贯通电极基板的制造方法

Info

Publication number
CN121264176A
CN121264176A CN202480038326.5A CN202480038326A CN121264176A CN 121264176 A CN121264176 A CN 121264176A CN 202480038326 A CN202480038326 A CN 202480038326A CN 121264176 A CN121264176 A CN 121264176A
Authority
CN
China
Prior art keywords
electrode
thickness
substrate
hole
electrode substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480038326.5A
Other languages
English (en)
Chinese (zh)
Inventor
田井贵裕
仓持悟
藤本兴治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of CN121264176A publication Critical patent/CN121264176A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
CN202480038326.5A 2023-06-09 2024-06-07 贯通电极基板、安装基板以及贯通电极基板的制造方法 Pending CN121264176A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2023095806 2023-06-09
JP2023-095806 2023-06-09
JP2024077561 2024-05-10
JP2024-077561 2024-05-10
PCT/JP2024/020939 WO2024253200A1 (ja) 2023-06-09 2024-06-07 貫通電極基板、実装基板及び貫通電極基板の製造方法

Publications (1)

Publication Number Publication Date
CN121264176A true CN121264176A (zh) 2026-01-02

Family

ID=93795505

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480038326.5A Pending CN121264176A (zh) 2023-06-09 2024-06-07 贯通电极基板、安装基板以及贯通电极基板的制造方法

Country Status (6)

Country Link
EP (1) EP4727267A1 (https=)
JP (1) JPWO2024253200A1 (https=)
KR (1) KR20260019614A (https=)
CN (1) CN121264176A (https=)
TW (1) TW202520798A (https=)
WO (1) WO2024253200A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310779A (ja) * 2005-03-29 2006-11-09 Kyocera Corp 回路基板および電子装置
US8785790B2 (en) * 2011-11-10 2014-07-22 Invensas Corporation High strength through-substrate vias
EP3570645B1 (en) * 2018-05-17 2023-01-25 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with only partially filled thermal through-hole
JP7219598B2 (ja) * 2018-11-27 2023-02-08 新光電気工業株式会社 配線基板及びその製造方法
US20240339389A1 (en) 2021-02-15 2024-10-10 Dai Nippon Printing Co., Ltd. Through via substrate

Also Published As

Publication number Publication date
TW202520798A (zh) 2025-05-16
WO2024253200A1 (ja) 2024-12-12
JPWO2024253200A1 (https=) 2024-12-12
KR20260019614A (ko) 2026-02-10
EP4727267A1 (en) 2026-04-15

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