TWI904333B - 貫通電極基板 - Google Patents

貫通電極基板

Info

Publication number
TWI904333B
TWI904333B TW111105464A TW111105464A TWI904333B TW I904333 B TWI904333 B TW I904333B TW 111105464 A TW111105464 A TW 111105464A TW 111105464 A TW111105464 A TW 111105464A TW I904333 B TWI904333 B TW I904333B
Authority
TW
Taiwan
Prior art keywords
substrate
hole
electrode
electrode substrate
aforementioned
Prior art date
Application number
TW111105464A
Other languages
English (en)
Chinese (zh)
Other versions
TW202247725A (zh
Inventor
倉持悟
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202247725A publication Critical patent/TW202247725A/zh
Application granted granted Critical
Publication of TWI904333B publication Critical patent/TWI904333B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
TW111105464A 2021-02-15 2022-02-15 貫通電極基板 TWI904333B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021523 2021-02-15
JP2021-021523 2021-02-15

Publications (2)

Publication Number Publication Date
TW202247725A TW202247725A (zh) 2022-12-01
TWI904333B true TWI904333B (zh) 2025-11-11

Family

ID=82838388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105464A TWI904333B (zh) 2021-02-15 2022-02-15 貫通電極基板

Country Status (6)

Country Link
US (1) US20240339389A1 (https=)
JP (1) JPWO2022173057A1 (https=)
KR (1) KR20230146557A (https=)
CN (1) CN117063620A (https=)
TW (1) TWI904333B (https=)
WO (1) WO2022173057A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024085727A1 (ko) * 2022-10-21 2024-04-25 동우 화인켐 주식회사 전자부품용 기판, 상기 전자부품용 기판의 제조방법 및 이를 포함하는 표시 장치 및 반도체 장치
JP2024172826A (ja) * 2023-06-01 2024-12-12 イビデン株式会社 プリント配線板
JPWO2024253200A1 (https=) 2023-06-09 2024-12-12
WO2025121374A1 (ja) * 2023-12-05 2025-06-12 大日本印刷株式会社 貫通電極基板及び貫通電極基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201924505A (zh) * 2017-09-29 2019-06-16 日商大日本印刷股份有限公司 貫通電極基板及使用有貫通電極基板之半導體裝置
WO2019199677A2 (en) * 2018-04-09 2019-10-17 Corning Incorporated Hermetic metallized via with improved reliability
JP2021002779A (ja) * 2019-06-21 2021-01-07 Ａｇｃ株式会社 導波管フィルタ
JP2021011411A (ja) * 2019-07-08 2021-02-04 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6201663B2 (ja) * 2013-11-13 2017-09-27 大日本印刷株式会社 貫通電極基板の製造方法、貫通電極基板、および半導体装置
KR20170040918A (ko) * 2015-10-06 2017-04-14 삼성전자주식회사 바이오 센서 및 그의 센싱 방법
JP6280956B2 (ja) * 2016-06-20 2018-02-14 株式会社フジクラ アンテナ装置及びその製造方法
WO2018092480A1 (ja) * 2016-11-17 2018-05-24 大日本印刷株式会社 貫通電極基板、貫通電極基板を用いた半導体装置、および貫通電極基板の製造方法
JP7003412B2 (ja) * 2017-02-03 2022-01-20 大日本印刷株式会社 導電基板およびその製造方法
JP7022365B2 (ja) 2017-03-24 2022-02-18 大日本印刷株式会社 貫通電極基板及びその製造方法
US11078112B2 (en) * 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
JP6369653B1 (ja) * 2018-05-17 2018-08-08 大日本印刷株式会社 貫通電極基板および半導体装置
WO2020022129A1 (ja) * 2018-07-25 2020-01-30 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201924505A (zh) * 2017-09-29 2019-06-16 日商大日本印刷股份有限公司 貫通電極基板及使用有貫通電極基板之半導體裝置
WO2019199677A2 (en) * 2018-04-09 2019-10-17 Corning Incorporated Hermetic metallized via with improved reliability
JP2021002779A (ja) * 2019-06-21 2021-01-07 Ａｇｃ株式会社 導波管フィルタ
JP2021011411A (ja) * 2019-07-08 2021-02-04 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Also Published As

Publication number Publication date
CN117063620A (zh) 2023-11-14
TW202247725A (zh) 2022-12-01
WO2022173057A1 (ja) 2022-08-18
JPWO2022173057A1 (https=) 2022-08-18
KR20230146557A (ko) 2023-10-19
US20240339389A1 (en) 2024-10-10

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