JPWO2022173057A1 - - Google Patents

Info

Publication number
JPWO2022173057A1
JPWO2022173057A1 JP2022580720A JP2022580720A JPWO2022173057A1 JP WO2022173057 A1 JPWO2022173057 A1 JP WO2022173057A1 JP 2022580720 A JP2022580720 A JP 2022580720A JP 2022580720 A JP2022580720 A JP 2022580720A JP WO2022173057 A1 JPWO2022173057 A1 JP WO2022173057A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022580720A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022173057A1 publication Critical patent/JPWO2022173057A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2022580720A 2021-02-15 2022-02-15 Pending JPWO2022173057A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021523 2021-02-15
PCT/JP2022/005968 WO2022173057A1 (ja) 2021-02-15 2022-02-15 貫通電極基板

Publications (1)

Publication Number Publication Date
JPWO2022173057A1 true JPWO2022173057A1 (ja) 2022-08-18

Family

ID=82838388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580720A Pending JPWO2022173057A1 (ja) 2021-02-15 2022-02-15

Country Status (5)

Country Link
JP (1) JPWO2022173057A1 (ja)
KR (1) KR20230146557A (ja)
CN (1) CN117063620A (ja)
TW (1) TW202247725A (ja)
WO (1) WO2022173057A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018092480A1 (ja) * 2016-11-17 2019-10-17 大日本印刷株式会社 貫通電極基板、貫通電極基板を用いた半導体装置、および貫通電極基板の製造方法
JP7003412B2 (ja) * 2017-02-03 2022-01-20 大日本印刷株式会社 導電基板およびその製造方法
JP7022365B2 (ja) 2017-03-24 2022-02-18 大日本印刷株式会社 貫通電極基板及びその製造方法
US11078112B2 (en) * 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11152294B2 (en) * 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
JP6369653B1 (ja) * 2018-05-17 2018-08-08 大日本印刷株式会社 貫通電極基板および半導体装置
JP7207193B2 (ja) * 2019-06-21 2023-01-18 Ａｇｃ株式会社 導波管フィルタ
JP6927251B2 (ja) * 2019-07-08 2021-08-25 Tdk株式会社 ガラスセラミックス焼結体および配線基板

Also Published As

Publication number Publication date
KR20230146557A (ko) 2023-10-19
TW202247725A (zh) 2022-12-01
CN117063620A (zh) 2023-11-14
WO2022173057A1 (ja) 2022-08-18

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230814