CN116583943A - 环氧树脂、固化性组合物、固化物、半导体密封材料、半导体装置、预浸料、电路基板、及积层薄膜 - Google Patents

环氧树脂、固化性组合物、固化物、半导体密封材料、半导体装置、预浸料、电路基板、及积层薄膜 Download PDF

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Publication number
CN116583943A
CN116583943A CN202180081331.0A CN202180081331A CN116583943A CN 116583943 A CN116583943 A CN 116583943A CN 202180081331 A CN202180081331 A CN 202180081331A CN 116583943 A CN116583943 A CN 116583943A
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CN
China
Prior art keywords
epoxy resin
group
compound
resin
phenolic hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180081331.0A
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English (en)
Chinese (zh)
Inventor
青山和贤
矢本和久
秋元源祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
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DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of CN116583943A publication Critical patent/CN116583943A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
CN202180081331.0A 2020-12-03 2021-11-25 环氧树脂、固化性组合物、固化物、半导体密封材料、半导体装置、预浸料、电路基板、及积层薄膜 Pending CN116583943A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020200933 2020-12-03
JP2020-200933 2020-12-03
PCT/JP2021/043092 WO2022118723A1 (ja) 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Publications (1)

Publication Number Publication Date
CN116583943A true CN116583943A (zh) 2023-08-11

Family

ID=81855009

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081331.0A Pending CN116583943A (zh) 2020-12-03 2021-11-25 环氧树脂、固化性组合物、固化物、半导体密封材料、半导体装置、预浸料、电路基板、及积层薄膜

Country Status (5)

Country Link
JP (1) JP7290205B2 (enrdf_load_stackoverflow)
KR (1) KR20230059829A (enrdf_load_stackoverflow)
CN (1) CN116583943A (enrdf_load_stackoverflow)
TW (1) TW202231701A (enrdf_load_stackoverflow)
WO (1) WO2022118723A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006307162A (ja) * 2005-03-18 2006-11-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
CN101495533A (zh) * 2005-03-18 2009-07-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
JP3973773B2 (ja) 1998-07-28 2007-09-12 ジャパンエポキシレジン株式会社 半導体封止用エポキシ樹脂組成物
JP5257725B2 (ja) 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
KR20160053907A (ko) 2013-09-10 2016-05-13 닛뽄 가야쿠 가부시키가이샤 에폭시 수지 혼합물, 에폭시 수지 조성물, 경화물 및 반도체 장치
TWI733770B (zh) 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006307162A (ja) * 2005-03-18 2006-11-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
CN101495533A (zh) * 2005-03-18 2009-07-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP2011026385A (ja) * 2009-07-22 2011-02-10 Dic Corp エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂
JP2014037487A (ja) * 2012-08-16 2014-02-27 Dic Corp 硬化性樹脂組成物、硬化物、及びプリント配線基板

Also Published As

Publication number Publication date
WO2022118723A1 (ja) 2022-06-09
JP7290205B2 (ja) 2023-06-13
TW202231701A (zh) 2022-08-16
KR20230059829A (ko) 2023-05-03
JPWO2022118723A1 (enrdf_load_stackoverflow) 2022-06-09

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