KR20230059829A - 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름 - Google Patents

에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름 Download PDF

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Publication number
KR20230059829A
KR20230059829A KR1020237011018A KR20237011018A KR20230059829A KR 20230059829 A KR20230059829 A KR 20230059829A KR 1020237011018 A KR1020237011018 A KR 1020237011018A KR 20237011018 A KR20237011018 A KR 20237011018A KR 20230059829 A KR20230059829 A KR 20230059829A
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KR
South Korea
Prior art keywords
group
compound
epoxy resin
resin
hydroxyl group
Prior art date
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Pending
Application number
KR1020237011018A
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English (en)
Korean (ko)
Inventor
가즈마사 아오야마
가즈히사 야모토
겐스케 아키모토
Original Assignee
디아이씨 가부시끼가이샤
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Publication of KR20230059829A publication Critical patent/KR20230059829A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Compounds (AREA)
KR1020237011018A 2020-12-03 2021-11-25 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름 Pending KR20230059829A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020200933 2020-12-03
JPJP-P-2020-200933 2020-12-03
PCT/JP2021/043092 WO2022118723A1 (ja) 2020-12-03 2021-11-25 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Publications (1)

Publication Number Publication Date
KR20230059829A true KR20230059829A (ko) 2023-05-03

Family

ID=81855009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237011018A Pending KR20230059829A (ko) 2020-12-03 2021-11-25 에폭시 수지, 경화성 조성물, 경화물, 반도체 봉지 재료, 반도체 장치, 프리프레그, 회로 기판, 및, 빌드업 필름

Country Status (5)

Country Link
JP (1) JP7290205B2 (enrdf_load_stackoverflow)
KR (1) KR20230059829A (enrdf_load_stackoverflow)
CN (1) CN116583943A (enrdf_load_stackoverflow)
TW (1) TW202231701A (enrdf_load_stackoverflow)
WO (1) WO2022118723A1 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5689230B2 (ja) 2009-07-22 2015-03-25 Dic株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物
JPH1160681A (ja) * 1997-08-14 1999-03-02 Jsr Corp ビフェノール型エポキシ樹脂およびその組成物
JP3973773B2 (ja) 1998-07-28 2007-09-12 ジャパンエポキシレジン株式会社 半導体封止用エポキシ樹脂組成物
JP5245199B2 (ja) * 2005-03-18 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂、その製造方法、及び新規フェノール樹脂
CN101495533B (zh) * 2005-03-18 2012-02-29 大日本油墨化学工业株式会社 环氧树脂组合物、其固化物、新型环氧树脂、其制造方法和新型酚树脂
JP5257725B2 (ja) 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP5987262B2 (ja) 2012-08-16 2016-09-07 Dic株式会社 硬化性樹脂組成物、硬化物、及びプリント配線基板
KR20160053907A (ko) 2013-09-10 2016-05-13 닛뽄 가야쿠 가부시키가이샤 에폭시 수지 혼합물, 에폭시 수지 조성물, 경화물 및 반도체 장치
TWI733770B (zh) 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5689230B2 (ja) 2009-07-22 2015-03-25 Dic株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、半導体装置、及びエポキシ樹脂

Also Published As

Publication number Publication date
CN116583943A (zh) 2023-08-11
WO2022118723A1 (ja) 2022-06-09
JP7290205B2 (ja) 2023-06-13
TW202231701A (zh) 2022-08-16
JPWO2022118723A1 (enrdf_load_stackoverflow) 2022-06-09

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