CN116569244B - 显示装置以及复合型显示装置 - Google Patents

显示装置以及复合型显示装置

Info

Publication number
CN116569244B
CN116569244B CN202180081088.2A CN202180081088A CN116569244B CN 116569244 B CN116569244 B CN 116569244B CN 202180081088 A CN202180081088 A CN 202180081088A CN 116569244 B CN116569244 B CN 116569244B
Authority
CN
China
Prior art keywords
display device
connection pad
substrate
light emitting
emitting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180081088.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN116569244A (zh
Inventor
伊藤弘晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN116569244A publication Critical patent/CN116569244A/zh
Application granted granted Critical
Publication of CN116569244B publication Critical patent/CN116569244B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/49—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/45—Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
CN202180081088.2A 2020-12-08 2021-12-01 显示装置以及复合型显示装置 Active CN116569244B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020203733 2020-12-08
JP2020-203733 2020-12-08
PCT/JP2021/044113 WO2022124161A1 (ja) 2020-12-08 2021-12-01 表示装置および複合型表示装置

Publications (2)

Publication Number Publication Date
CN116569244A CN116569244A (zh) 2023-08-08
CN116569244B true CN116569244B (zh) 2025-12-23

Family

ID=81973902

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180081088.2A Active CN116569244B (zh) 2020-12-08 2021-12-01 显示装置以及复合型显示装置

Country Status (4)

Country Link
US (1) US20240038954A1 (https=)
JP (1) JP7453418B2 (https=)
CN (1) CN116569244B (https=)
WO (1) WO2022124161A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2023466990A1 (en) * 2023-09-26 2026-02-12 Boe Technology Group Co., Ltd. Array substrate and display apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005221598A (ja) * 2004-02-04 2005-08-18 Hitachi Displays Ltd 表示装置
CN109637451A (zh) * 2019-01-10 2019-04-16 云谷（固安）科技有限公司 一种显示面板的驱动方法、显示面板和显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW543145B (en) 2001-10-11 2003-07-21 Samsung Electronics Co Ltd A thin film transistor array panel and a method of the same
JP2010232276A (ja) * 2009-03-26 2010-10-14 Casio Computer Co Ltd 発光装置及びその製造方法
KR101811341B1 (ko) * 2010-12-09 2017-12-26 삼성디스플레이 주식회사 유기 발광 표시 장치
JP5838299B2 (ja) * 2011-09-22 2016-01-06 パナソニックＩｐマネジメント株式会社 発光モジュール及び照明装置
KR102652604B1 (ko) * 2016-06-08 2024-04-02 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2018017988A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
KR102612998B1 (ko) 2016-12-30 2023-12-11 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
KR102582059B1 (ko) * 2016-12-30 2023-09-21 엘지디스플레이 주식회사 표시 장치 및 이를 이용한 멀티 스크린 표시 장치
US10468397B2 (en) * 2017-05-05 2019-11-05 X-Celeprint Limited Matrix addressed tiles and arrays
US10403189B2 (en) * 2017-12-19 2019-09-03 Dell Products L.P. Compensating for temperature induced differences in a computing device having dual-displays or a foldable display
JP6811353B2 (ja) * 2018-02-28 2021-01-13 京セラ株式会社 表示装置、ガラス基板およびガラス基板の製造方法
US11107841B2 (en) * 2018-07-04 2021-08-31 Samsung Electronics Co., Ltd. Display panel and large format display apparatus using the same
CN113812009B (zh) 2019-05-29 2024-06-21 京瓷株式会社 发光元件搭载基板以及使用该发光元件搭载基板的显示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005221598A (ja) * 2004-02-04 2005-08-18 Hitachi Displays Ltd 表示装置
CN109637451A (zh) * 2019-01-10 2019-04-16 云谷（固安）科技有限公司 一种显示面板的驱动方法、显示面板和显示装置

Also Published As

Publication number Publication date
JPWO2022124161A1 (https=) 2022-06-16
CN116569244A (zh) 2023-08-08
WO2022124161A1 (ja) 2022-06-16
JP7453418B2 (ja) 2024-03-19
US20240038954A1 (en) 2024-02-01

Similar Documents

Publication Publication Date Title
CN113661580B (zh) 微型led元件基板以及显示装置
US11600240B2 (en) Display apparatus with pixel structure on glass substrate and glass substrate
US10008555B2 (en) Display device and method of manufacturing the same
CN1331219C (zh) 半导体芯片安装基板、电光装置、液晶装置、电致发光装置及电子机器
KR102380057B1 (ko) 표시장치
JP7311595B2 (ja) 発光素子基板および表示装置、ならびに表示装置の製造方法
CN112863375B (zh) 显示装置
JP7449360B2 (ja) 配線基板、それを用いた発光装置及び表示装置
JP7478257B2 (ja) 表示装置
KR20120061129A (ko) 표시 장치
WO2023063164A1 (ja) 表示装置
JP6798952B2 (ja) 半導体装置、発光装置および半導体装置の製造方法
CN116569244B (zh) 显示装置以及复合型显示装置
JP7618830B2 (ja) 表示装置およびマルチディスプレイ
CN113424330B (zh) 微型led元件搭载基板以及使用其的显示装置
KR20230102328A (ko) 표시 패널
JP7551401B2 (ja) 遮光層積層型基板
KR20230098960A (ko) 표시 패널
KR20230095439A (ko) 표시 패널
CN118414044A (zh) 显示装置
KR102807945B1 (ko) 표시 장치
KR20180025523A (ko) 표시장치
CN111554660A (zh) 显示装置
CN112114697A (zh) 显示装置
US20260068433A1 (en) Display device and manufacturing method of display device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant