JP7453418B2 - 表示装置および複合型表示装置 - Google Patents

表示装置および複合型表示装置 Download PDF

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Publication number
JP7453418B2
JP7453418B2 JP2022568218A JP2022568218A JP7453418B2 JP 7453418 B2 JP7453418 B2 JP 7453418B2 JP 2022568218 A JP2022568218 A JP 2022568218A JP 2022568218 A JP2022568218 A JP 2022568218A JP 7453418 B2 JP7453418 B2 JP 7453418B2
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JP
Japan
Prior art keywords
display device
connection pad
light emitting
substrate
light
Prior art date
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Active
Application number
JP2022568218A
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English (en)
Japanese (ja)
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JPWO2022124161A1 (https=
Inventor
弘晃 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022124161A1 publication Critical patent/JPWO2022124161A1/ja
Application granted granted Critical
Publication of JP7453418B2 publication Critical patent/JP7453418B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/49—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30—Active-matrix LED displays
    • H10H29/45—Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP2022568218A 2020-12-08 2021-12-01 表示装置および複合型表示装置 Active JP7453418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020203733 2020-12-08
JP2020203733 2020-12-08
PCT/JP2021/044113 WO2022124161A1 (ja) 2020-12-08 2021-12-01 表示装置および複合型表示装置

Publications (2)

Publication Number Publication Date
JPWO2022124161A1 JPWO2022124161A1 (https=) 2022-06-16
JP7453418B2 true JP7453418B2 (ja) 2024-03-19

Family

ID=81973902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568218A Active JP7453418B2 (ja) 2020-12-08 2021-12-01 表示装置および複合型表示装置

Country Status (4)

Country Link
US (1) US20240038954A1 (https=)
JP (1) JP7453418B2 (https=)
CN (1) CN116569244B (https=)
WO (1) WO2022124161A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2023466990A1 (en) * 2023-09-26 2026-02-12 Boe Technology Group Co., Ltd. Array substrate and display apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003121867A (ja) 2001-10-11 2003-04-23 Samsung Electronics Co Ltd ビジュアルインスペクション手段を備えた薄膜トランジスタ基板及びビジュアルインスペクション方法
JP2005221598A (ja) 2004-02-04 2005-08-18 Hitachi Displays Ltd 表示装置
JP2010232276A (ja) 2009-03-26 2010-10-14 Casio Computer Co Ltd 発光装置及びその製造方法
US20180188579A1 (en) 2016-12-30 2018-07-05 Lg Display Co., Ltd. Display device, multi-screen display device using the same and method for manufacturing the same
US20180190631A1 (en) 2016-12-30 2018-07-05 Lg Display Co., Ltd. Display device and multi-screen display device using the same
WO2019167966A1 (ja) 2018-02-28 2019-09-06 京セラ株式会社 表示装置、ガラス基板およびガラス基板の製造方法
WO2020241117A1 (ja) 2019-05-29 2020-12-03 京セラ株式会社 発光素子搭載基板およびそれを用いた表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101811341B1 (ko) * 2010-12-09 2017-12-26 삼성디스플레이 주식회사 유기 발광 표시 장치
JP5838299B2 (ja) * 2011-09-22 2016-01-06 パナソニックＩｐマネジメント株式会社 発光モジュール及び照明装置
KR102652604B1 (ko) * 2016-06-08 2024-04-02 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2018017988A (ja) * 2016-07-29 2018-02-01 株式会社ジャパンディスプレイ 表示装置
US10468397B2 (en) * 2017-05-05 2019-11-05 X-Celeprint Limited Matrix addressed tiles and arrays
US10403189B2 (en) * 2017-12-19 2019-09-03 Dell Products L.P. Compensating for temperature induced differences in a computing device having dual-displays or a foldable display
US11107841B2 (en) * 2018-07-04 2021-08-31 Samsung Electronics Co., Ltd. Display panel and large format display apparatus using the same
CN109637451B (zh) * 2019-01-10 2020-10-16 云谷（固安）科技有限公司 一种显示面板的驱动方法、显示面板和显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003121867A (ja) 2001-10-11 2003-04-23 Samsung Electronics Co Ltd ビジュアルインスペクション手段を備えた薄膜トランジスタ基板及びビジュアルインスペクション方法
JP2005221598A (ja) 2004-02-04 2005-08-18 Hitachi Displays Ltd 表示装置
JP2010232276A (ja) 2009-03-26 2010-10-14 Casio Computer Co Ltd 発光装置及びその製造方法
US20180188579A1 (en) 2016-12-30 2018-07-05 Lg Display Co., Ltd. Display device, multi-screen display device using the same and method for manufacturing the same
US20180190631A1 (en) 2016-12-30 2018-07-05 Lg Display Co., Ltd. Display device and multi-screen display device using the same
WO2019167966A1 (ja) 2018-02-28 2019-09-06 京セラ株式会社 表示装置、ガラス基板およびガラス基板の製造方法
WO2020241117A1 (ja) 2019-05-29 2020-12-03 京セラ株式会社 発光素子搭載基板およびそれを用いた表示装置

Also Published As

Publication number Publication date
JPWO2022124161A1 (https=) 2022-06-16
CN116569244A (zh) 2023-08-08
CN116569244B (zh) 2025-12-23
WO2022124161A1 (ja) 2022-06-16
US20240038954A1 (en) 2024-02-01

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