WO2022124161A1 - 表示装置および複合型表示装置 - Google Patents
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- WO2022124161A1 WO2022124161A1 PCT/JP2021/044113 JP2021044113W WO2022124161A1 WO 2022124161 A1 WO2022124161 A1 WO 2022124161A1 JP 2021044113 W JP2021044113 W JP 2021044113W WO 2022124161 A1 WO2022124161 A1 WO 2022124161A1
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- display device
- connection pad
- light emitting
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- light
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
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- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
Definitions
- the present disclosure relates to a display device including a self-luminous light emitting element such as a light emitting diode (LED) element, and a composite type display device configured by combining (tyling) a plurality of display devices.
- a self-luminous light emitting element such as a light emitting diode (LED) element
- a composite type display device configured by combining (tyling) a plurality of display devices.
- Patent Documents 1 to 5 The display device and the composite display device of the prior art are described in, for example, Patent Documents 1 to 5.
- Japanese Unexamined Patent Publication No. 2005-148248 Japanese Unexamined Patent Publication No. 57-114189 Japanese Patent Application Laid-Open No. 2003-295785 Japanese Unexamined Patent Publication No. 2012-104497 Japanese Unexamined Patent Publication No. 2007-335249
- the display device of the present disclosure includes a substrate having a first side and a second side adjacent thereto, a plurality of light emitting elements located on the substrate, and light emitting / non-light emitting of the light emitting element located on the substrate.
- a plurality of light emission control signal lines to be controlled located at the edge portion on the first side side and the edge portion on the second side side on the substrate, and connected to each of the plurality of light emission control signal lines. It is configured to include a connection pad.
- the composite display device of the present disclosure is a composite display device configured by connecting a plurality of display devices and the side surfaces of the plurality of display devices, and the plurality of display devices are the first display device.
- a second display device is included, and a side surface of the first display device adjacent to the first side and a side surface of the second display device facing the side surface are connected to each other.
- FIG. 3 is a cross-sectional view of the display device of FIG. 3 as viewed from the cut plane line IV-IV. It is a partial plan view which shows the wiring structure of the main part of the display device of FIG. It is a partial plan view which shows the wiring structure of the main part of the display device of FIG. It is a partial plan view which shows the wiring structure of the main part of the display device of FIG. It is a partial plan view which shows the wiring structure of the main part about the modification of the display device of FIG.
- FIG. 3 is a cross-sectional view of the display device of FIG.
- FIG. 3 It is a block circuit diagram schematically showing the circuit configuration on the 1st surface side of the display device shown in FIG. 1. It is a block circuit diagram schematically showing the circuit configuration on the 2nd surface side of the display device shown in FIG. 1. It is a circuit diagram which shows the structure of the pixel circuit in the display device of this disclosure. It is a partial plan view which shows the wiring structure of the main part about the modification of the display device of FIG. It is a partial plan view which shows the wiring structure of the main part about the modification of the display device of FIG. It is a partial plan view which shows the main part of the composite type display device of one Embodiment of this disclosure.
- each display device electrically mounts a substrate for mounting a light emitting element on one main surface (front surface) side, a drive unit installed on the other main surface (back surface) side of the substrate, and a light emitting element and a drive unit.
- the side wiring connection pad on the one main surface side connected to the side wiring is located at the end edge portion on one main surface of the board, and is connected to the side wiring at the end edge portion on the other main surface of the board.
- the side wiring connection pad on the main surface side is located.
- the above configuration may be applied to a self-luminous display device provided with a micro LED ( ⁇ LED) element as a light emitting element.
- a micro LED ( ⁇ LED) element as a light emitting element.
- an organic EL display device provided with an organic EL (Electroluminescence) element has also been proposed.
- On the first surface (the surface and the surface on the display side) of the substrate constituting the organic EL display device a plurality of pixel portions including a pixel circuit including a thin film transistor (TFT) for driving and controlling an organic EL element are provided.
- TFT thin film transistor
- a plurality of pixel portions arranged in the outermost array portion of the side portions to be combined in one display device and the outermost arrangement of the combined side portions in the other display device coupled to the one display device.
- the pixel pitch between a plurality of pixel portions arranged in a portion is the pixel pitch of a plurality of pixel portions arranged in a region other than the outermost array portion (also referred to as a non-coupling portion pixel pitch).
- the continuity of the displayed image at the joint portion is likely to be lost, and the viewer may feel a sense of discomfort in the displayed image or the joint portion may be easily seen. , For the reason.
- a light emission control signal line for supplying a light emission control signal for controlling light emission / non-light emission of a light emitting element is connected to each pixel portion of a plurality of pixel portions. Then, the connection pad connected to the light emission control signal line is arranged on one main surface of the substrate in the frame portion (non-effective portion) outside the display portion (effective portion) including the plurality of pixel portions. Since this connection pad is also connected to the side wiring formed by applying and firing the conductive paste, the light emission control signal line formed by the thin film forming method and the electrode pad of the pixel portion connected to the light emitting element. It is difficult to make it finer than the above.
- connection pads are arranged on one side of the substrate in correspondence with a narrowed pixel pitch, the distance between the connection pads becomes small, and it becomes difficult to arrange the entire plurality of connection pads. There was a case. Further, when the area of the connection pad is reduced, the connection area with the side wiring is reduced and the connection resistance is increased. As a result, display unevenness or the like may occur and the display quality may deteriorate. Further, if the distance between the plurality of connection pads becomes small, there is a possibility that an electrical short circuit may occur between the connection pads.
- the width and length of the frame portion tend to increase.
- the pixel pitch of the coupled portion tends to be larger than the pixel pitch of the non-coupled portion in which the pitch is narrowed. That is, it becomes difficult to make the pixel pitch of the coupled portion equal to the pixel pitch of the non-coupled portion.
- the width of the frame portion on the side adjacent to one side of the substrate becomes large as a result.
- connection pad between the outermost pixel portions on one side of the substrate.
- the number of connection pads that can be arranged along one side of the substrate is (number of pixels-1), and there arises a problem that all the connection pads cannot be arranged on one side of the substrate.
- the display device of the present disclosure includes a substrate 2 having a first side m1 and a second side m2 adjacent thereto, and a plurality of light emitting elements 6 (shown in FIG. 3) located on the substrate 2.
- a plurality of light emission control signal lines L1 and L2 located on the substrate 2 and controlling light emission / non-light emission of the light emitting element 6, and edge portions 2e1 and second side m2 side on the first side m1 side on the substrate 2.
- the configuration is such that the connection pad 8 is located at the edge portion 2e2 of the above and is connected to each of the plurality of light emission control signal lines L1 and L2.
- reference numeral 3 indicates a pixel portion, and each of the plurality of pixel portions 3 is provided with a light emitting element 6.
- the plurality of pixel portions 3 are arranged in an effective region A on the first surface 2a of the substrate 2, for example, in a matrix.
- the display device of the present disclosure has the following effects due to the above configuration. Since the plurality of connection pads 8 that are difficult to miniaturize are arranged on the edge portion 2e1 on the first side m1 side and the edge portion 2e2 on the second side m2 side on the substrate 2, between the plurality of connection pads 8 The intervals can be arranged as intervals at which electrical short circuits are unlikely to occur. As a result, it is arranged on the substrate 2 while suppressing the occurrence of an electrical short circuit between the plurality of connection pads 8 and the enlargement of the frame portion (which substantially corresponds to the edge portions 2e1 and 2e2). Can be done. Further, it is possible to arrange the plurality of connection pads 8 on the substrate 2 with the frame portion smaller.
- the edge portion 2e1 is an edge portion along the first side m1 and has a width of about 10 ⁇ m to 500 ⁇ m from the first side m1 on the first surface 2a of the substrate 2 toward the center side of the first surface 2a. It is a part to have, but it is not limited to the value of this width. Further, the width of the edge portion 2e1 may be about 1 ⁇ 2 or less of the pixel pitch.
- the edge portion 2e2 and the edge portion 2e3 (shown in FIG. 2) have the same configuration as the edge portion 2e1.
- the connection pad 8 has a rectangular shape having a side length of about 50 ⁇ m to 500 ⁇ m, preferably about 70 ⁇ m to 300 ⁇ m, but the length of one side is not limited to these values.
- connection pad 8 may be various shapes such as a polygonal shape such as a pentagonal shape, a trapezoidal shape, a circular shape, and an elliptical shape.
- a polygonal shape such as a pentagonal shape, a trapezoidal shape, a circular shape, and an elliptical shape.
- - means "to”, and the same shall apply hereinafter.
- the display device of the present disclosure has a plurality of light emission control signal lines L1 and L2 for controlling light emission / non-light emission of the light emission element 6, and the light emission control signal lines L1 and L2 have the following configurations and functions. .. As shown in FIG. 11, the display device intersects the scanning signal line (gate signal line) 102 arranged in a predetermined direction (for example, the row direction) on the first surface 2a of the substrate 2 with the scanning signal line 102. A plurality of pixel portions separated by a light emission control signal line L1 (L2) arranged in a direction intersecting a predetermined direction (for example, a column direction), a scanning signal line 102, and a light emission control signal line L1 (L2).
- the scanning signal line 102 and the light emission control signal line L1 (L2) are connected to the back surface wiring on the second surface (back surface) 2b of the substrate 2 via the side surface wiring 10 arranged on the side surface 2c of the substrate 2.
- the back surface wiring is connected to a drive unit such as a drive element such as an IC or LSI installed on the second surface 2b. That is, the display of the display device is driven and controlled by a drive unit on the back surface of the substrate 2.
- a light emission control unit 122 for controlling light emission, non-light emission, light emission intensity, etc. of the light emitting element 6 is arranged in each pixel unit 3.
- the light emission control unit 122 transmits a thin film (Thin Film Transistor: TFT) 112 as a switch element for inputting a light emission signal to each of the light emission elements 6 and a light emission control signal (light emission control signal line L1 (L2)).
- TFT Thin Film Transistor
- the light emission control signal line L1 (L2) is connected to the source electrode of the TFT 112, the gate voltage of the TFT 113 is controlled by the voltage level of the light emission control signal, and the current between the source and drain of the TFT 113 according to the gate voltage level. , Controls the brightness of the light emitting element 6.
- a capacitive element is arranged on the connection line connecting the gate electrode of the TFT 113 and the source electrode, and the capacitive element changes the voltage of the light emission control signal input to the gate electrode of the TFT 113 until the next rewriting (one frame). Period) Functions as a holding capacity to hold.
- the light emitting element 6 is connected to the light emitting control unit 122, the positive power supply (VDD) input line 116, and the negative power supply (VSS) input line 117 via through conductors 123a and 123b such as through holes penetrating the insulating layer below the light emitting element 6. It is electrically connected. That is, the positive electrode of the light emitting element 6 is connected to the positive power input line 116 via the through conductor 123a and the light emission control unit 122, and the negative electrode of the light emitting element 6 is connected to the negative power input line via the through conductor 123b. It is connected to 117.
- VDD positive power supply
- VSS negative power supply
- FIG. 1 is a plan view showing a schematic configuration of a display device 1a according to an embodiment of the present disclosure.
- the self-luminous display device 1a has the following configuration.
- the plurality of connection pads 8 are located along the first side m1 on the edge portion 2e1 on the first side m1 side on the substrate 2, and each of the light emitting elements 6 of the first group 3a among the plurality of light emitting elements 6
- a plurality of first connection pads 81 connected to a first light emission control signal line L1 for controlling light emission / non-light emission, and a plurality of light emitting elements 6 located at an edge portion 2e2 on the second side m2 side on the substrate 2.
- a second connection pad 82 connected to a second light emission control signal line L2 for controlling light emission / non-light emission of the light emitting element 6 of the second group 3b is included.
- the plurality of first connection pads 81 which are the majority of the plurality of connection pads 8, are arranged on the edge portion 2e1 at intervals at which short circuits are unlikely to occur, and cannot be completely arranged on the edge portion 2e1.
- the second connection pad 82 can be arranged at the edge portion 2e2. As a result, it is possible to reliably suppress the occurrence of an electrical short circuit between the plurality of connection pads 8 and the enlargement of the frame portion, and to dispose of them on the substrate 2.
- the interval at which a short circuit is unlikely to occur is about 30 ⁇ m to 100 ⁇ m, but is not limited to these values and can be appropriately set.
- the light emitting element 6 of the second group 3b is a light emitting element 6 provided in the group of the pixel portions 3 included in the row closest to the second side m2 among the plurality of pixel portions 3 arranged in a matrix. May be good.
- the light emitting element 6 of the second group 3b is a light emitting element 6 provided in the group of the pixel parts 3 included in the two rows closest to the second side m2 among the plurality of pixel parts 3 arranged in a matrix. If there are, there may be two second connection pads 82. Further, there may be three or more second connection pads 82.
- connection pads connected to wiring other than the second light emission control signal line L2 are located on the edge portion 2e2 on the second side m2 side on the substrate 2, and the second connection is made.
- the pad 82 may be configured to be closer to the first side than other connection pads.
- the length of the connection portion (the length L2c) that connects the second connection pad 82 in the second light emission control signal line L2 and the nearest pixel portion 3b1 can be brought close to each other.
- the difference between L1c and L2c can be almost minimized.
- the length of the first light emission control signal line L1 and the length of the second light emission control signal line L2 can be made substantially the same, and the resistance of the first light emission control signal line L1 and the second light emission control signal line L2.
- the resistance of can be made almost the same. Therefore, when the same light emission control signal is input to the first light emission control signal line L1 and the second light emission control signal line L2, the current value and voltage level of the light emission control signal transmitted through the first light emission control signal line L1. It is possible to suppress the problem that the current value and the voltage level of the light emission control signal transmitted through the second light emission control signal line L2 are different from each other.
- the display quality of the display device is improved. Further, it is possible to prevent the presence of the second connection pad 82 from hindering the degree of freedom in the layout of various wirings located on the side of the second surface 2b of the substrate 2. Therefore, the layout of various wirings located on the side of the second surface 2b of the substrate 2 becomes easy.
- connection pad 82 may be configured to be adjacent to the first connection pad 81a located closest to the second side m2 among the plurality of first connection pads 8. In the case of this configuration, the above-mentioned various effects are further improved.
- connection pad 181 may be a power supply connection pad 181 (shown in FIG. 9) connected to a power supply wiring that supplies a power supply current to the light emitting element 6, and is a fifth connection connected to the gate signal line 4. It may be a pad 18 (shown in FIG. 9).
- the plurality of light emitting elements 6 are a plurality of outermost light emitting elements 6 located along the first side m1 on the edge portion 2e1 on the first side m1 side on the substrate 2.
- the first connection pad 81 may be configured to include the light emitting element 6 m and to be located between the plurality of outermost light emitting elements 6 m. In the case of this configuration, since the first connection pad 81 can be arranged between the outermost pixel portions 3 on the first side m1 of the substrate 2, the frame portion on the first side m1 can be made smaller.
- connection pads 8 that can be arranged along the first side m1 of the substrate 2 is (number of pixels-1), and all the connection pads 8 cannot be arranged on the first side m1 of the substrate 2. Therefore, one extra connection pad 8 (second connection pad 82) is arranged at the edge portion 2e2 on the side of the second side m2.
- the light emitting element 6 of the second group 3b is located along the edge portion 2e2 on the second side m2 side, and the second connection pad 82 is the second group 3b. It may be configured to be located between the light emitting elements 6 of the above. In the case of this configuration, since the second connection pad 82 can be arranged between the outermost pixel portions 3 on the second side m2 of the substrate 2, the frame portion on the second side m2 can be made smaller.
- the size of the second connection pad 82 may be larger than the size of the first connection pad 81.
- the length L2c of the connection portion connecting the second connection pad 82 and the nearest pixel portion 3b1 in the second light emission control signal line L2 can be shortened to be closer to L1c.
- L1c and L2c can be made almost the same.
- the length of the first light emission control signal line L1 and the length of the second light emission control signal line L2 can be made closer to the same, and the resistance of the first light emission control signal line L1 and the second light emission control signal line L2 can be made closer to each other. Resistance can be closer to the same.
- the current value and voltage level of the light emission control signal transmitted through the first light emission control signal line L1 are different from each other.
- the display quality of the display device 1b is improved.
- the length of the second connection pad 82 in the direction along the second side m2 is larger than the length of the first connection pad 81 in the direction along the first side m1. May also have a long configuration.
- the second connection pad 82 may have an extending portion extending toward the corner between the first side m1 and the second side m2. That is, the second connection pad 82 may have an extension portion 82e that extends toward the first side m1 side along the second side m2.
- the width of the extending portion 82e may be smaller than the width of the main body portion of the second connection pad 82. In the case of this configuration, it is possible to prevent the width of the frame portion on the second side m2 from becoming large.
- the substrate 2 has a first surface 2a on the side where a plurality of light emitting elements 6 are located and a second surface 2b on the side opposite to the first surface 2a (shown in FIG. 4).
- the first connection pad 81 and the second connection pad 82 may be configured to be connected to the side wiring 10, respectively.
- the drive unit can be arranged on the side of the second surface 2b of the substrate 2, and the pixel unit 3 and the drive unit can be electrically connected via the side wiring 10.
- the drive unit which has been conventionally arranged in the frame portion, can be arranged on the side of the second surface 2b, which is advantageous for narrowing the frame portion.
- FIG. 2 is a plan view showing a schematic configuration of the display device 1b of another embodiment.
- the same reference numerals are given to the parts corresponding to the above-described embodiments.
- the self-luminous display device 1b according to the present embodiment has the following configuration.
- the substrate 2 has a third side m3 adjacent to the first side m1 and facing the second side m2, and is located at an edge portion 2e3 on the third side m3 side on the substrate 2, and has a plurality of light emitting elements 6.
- the configuration may include a third connection pad 83 connected to a third light emission control signal line L3 that controls light emission / non-light emission of the light emitting element 6 of the third group 3c.
- the plurality of first connection pads 81 which are the majority of the plurality of connection pads 8, are arranged on the edge portion 2e1 at intervals at which short circuits are unlikely to occur, and cannot be completely arranged on the edge portion 2e1.
- the second connection pad 82 and the third connection pad 83 can be arranged at the edge portions 2e2 and 2e3. As a result, it is possible to more reliably suppress the occurrence of an electrical short circuit between the plurality of connection pads 8 and the increase in the size of the frame portion, and to dispose of them on the substrate 2.
- the light emitting element 6 of the third group 3c is a light emitting element 6 provided in the group of the pixel portions 3 included in one row closest to the third side m3 among the plurality of pixel portions 3 arranged in a matrix. May be good.
- the light emitting element 6 of the third group 3c is a light emitting element 6 provided in the group of the pixel parts 3 included in the two rows closest to the third side m3 among the plurality of pixel parts 3 arranged in a matrix. If there are, there may be two third connection pads 83. Further, there may be three or more second connection pads 82.
- connection pads connected to wiring other than the third light emission control signal line L3 are located on the edge portion 2e3 on the third side m3 side on the substrate 2.
- the third connection pad 83 may be configured to be closer to the first side m1 than the other connection pads.
- the above-mentioned length L1c and the length of the connection portion (referred to as the length L3c) connecting the third connection pad 83 in the third light emission control signal line L3 and the nearest pixel portion 3c1 are set. You can get closer. That is, the difference between L1c and L3c can be almost minimized.
- the length of the first light emission control signal line L1 and the length of the third light emission control signal line L3 can be made substantially the same, and the resistance of the first light emission control signal line L1 and the third light emission control signal line L3.
- the resistance of can be made almost the same. Therefore, when the same light emission control signal is input to the first light emission control signal line L1 and the third light emission control signal line L3, the current value and voltage level of the light emission control signal transmitted through the first light emission control signal line L1. It is possible to suppress the problem that the current value and the voltage level of the light emission control signal transmitted through the third light emission control signal line L3 are different from each other. As a result, the display quality of the display device 1b is improved.
- the third connection pad 83 may be configured to be adjacent to the first connection pad 81b located closest to the third side m3 among the plurality of first connection pads 8. In the case of this configuration, the above-mentioned various effects are further improved.
- connection pad described above may be a power supply connection pad connected to a power supply wiring that supplies a power supply current to the light emitting element 6, or may be a connection pad connected to the gate signal line 4.
- the light emitting element 6 of the third group 3c is located along the edge portion 2e3 on the third side m3 side, and the third connection pad 83 is the third group 3c. It may be configured to be located between the light emitting elements 6. In the case of this configuration, since the third connection pad 83 can be arranged between the outermost pixel portions 3 on the third side m3 of the substrate 2, the frame portion on the third side m3 can be made smaller.
- the display device 1b may have a configuration in which the size of the third connection pad 83 is larger than the size of the first connection pad 81.
- the length L3c of the connection portion connecting the third connection pad 83 and the nearest pixel portion 3c1 in the third light emission control signal line L3 can be shortened so as to be closer to L1c.
- L1c and L3c can be made almost the same.
- the length of the first light emission control signal line L1 and the length of the third light emission control signal line L3 can be made closer to the same, and the resistance of the first light emission control signal line L1 and the third light emission control signal line L3 can be made closer to each other. Resistance can be closer to the same.
- the length of the third connection pad 83 in the direction along the third side m3 is larger than the length of the first connection pad 81 in the direction along the first side m1. May also have a long configuration.
- the third connection pad 83 may have an extending portion extending toward the corner portion between the first side m1 and the third side m3. That is, the third connection pad 83 may have an extension portion 83e that extends toward the first side m1 side along the third side m3.
- the width of the extending portion 83e may be smaller than the width of the main body portion of the third connection pad 83. In the case of this configuration, it is possible to suppress an increase in the width of the frame portion on the third side m3.
- FIG. 12 is a partial plan view showing a wiring structure of a main part of a modified example of the display device of FIG. 7.
- the first connection pad 81 may have a configuration in which the length in the direction orthogonal to the direction along the first side m1 is longer than the length in the direction along the first side m1.
- the length L1c of the connection portion connecting the first connection pad 81 and the nearest pixel portion 3 is further shortened. be able to.
- the signal transmission path length between the first connection pad 81 and the nearest pixel unit 3 is shortened, and the signal can be efficiently transmitted from the first connection pad 81 to the pixel unit 3.
- the conductive paste for forming the side wiring 10 is likely to spread in the depth direction of the first connection pad 81, and as a result, the contact area between the side wiring 10 and the first connection pad 81 is increased, and the side wiring is increased.
- the connection resistance between the 10 and the first connection pad 81 becomes smaller.
- the first connection pad 81 may have a shape having a longitudinal direction and a lateral direction such as a rectangle, a band, an ellipse, and an oval.
- the length of the first connection pad 81 in the direction orthogonal to the direction along the first side m1 is more than 1 times and not more than 3 times the length in the direction along the first side m1 of the first connection pad 81. It may be, but it is not limited to this range.
- the configuration of the first connection pad 81 shown in FIG. 12 can also be applied to the display devices shown in FIGS. 3, 5, and 6.
- FIG. 13 is a partial plan view showing a wiring structure of a main part of a modified example of the display device of FIG. 7.
- the first connection pad 81 may have a configuration in which the length of the portion (for example, the side portion) on the first side m1 side is longer than the length of the portion (for example, the side portion) opposite to the first side m1. .. More specifically, the first connection pad 81 may have an extension portion 81e extending in a direction along the first side m1 at the end on the first side m1 side. In this case, the conductive paste for forming the side wiring 10 is effectively drawn into the first connection pad 81, and easily extends in the depth direction of the first connection pad 81.
- the extending portion 81e is located between the outermost light emitting element 6m located along the first side m1 on the edge portion 2e1 on the first side m1 side on the substrate 2 and the end of the substrate 2 (frame portion). Can be placed. In this case, it is possible to prevent the conductive paste from reaching the outermost light emitting element 6 m.
- the first connection pad 81 may have a trapezoidal shape or the like.
- the length of the portion of the first connection pad 81 on the first side m1 side may be more than 1 times and not more than 3 times the length of the portion of the first connection pad 81 on the side opposite to the first side m1. , Not limited to this range.
- the configuration of the first connection pad 81 shown in FIG. 13 can also be applied to the display devices shown in FIGS. 3, 5, and 6.
- a configuration in which the configuration of the first connection pad 81 shown in FIG. 12 and the configuration of the first connection pad 81 shown in FIG. 13 are combined may be adopted.
- the substrate 2 has a first surface 2a on the side where a plurality of light emitting elements 6 are located, a second surface 2b on the side opposite to the first surface 2a, and a first surface 2a. It has a side surface 2c connecting the second surface 2b and a side surface wiring 10 located from the end edge portion of the first surface 2a to the end edge portion of the second surface 2b via the side surface 2c, and has a third connection pad 83. May be configured to be connected to the side wiring 10.
- the drive unit can be arranged on the side of the second surface 2b of the substrate 2, and the pixel unit 3 and the drive unit can be electrically connected via the side wiring 10.
- the drive unit which has been conventionally arranged in the frame portion, can be arranged on the side of the second surface 2b, which is advantageous for narrowing the frame portion.
- the drive unit may be, for example, a drive element such as an IC or LSI mounted on the second surface 2b of the substrate 2 by a COG (Chip On Glass) method.
- the drive unit is made of low-temperature polycrystalline silicon (LTPS) formed on the second surface 2b of the substrate 2 by a thin film forming method such as a chemical vapor deposition (CVD) method. It may be a thin film circuit including a thin film transistor (TFT) having a semiconductor layer.
- the drive unit may be a drive element provided on the flexible wiring board connected to the external connection terminal located on the second surface 2b of the substrate 2. Further, the drive unit may be an external drive element electrically connected to the wiring of the flexible wiring board.
- a power supply connection pad 181 connected to a power supply wiring for supplying a power supply current to a plurality of light emitting elements 6 at an edge portion 2e2 on the second side m2 side. May be located.
- the wiring structure is simplified and it is advantageous for narrowing the frame.
- the display devices 1a and 1b may have a configuration in which each of the plurality of pixel portions 3 is provided with a rectangular micro-light emitting diode element having a side length of 1 ⁇ m or more and 100 ⁇ m or less in a plan view as a light emitting element. .. This configuration is advantageous for high definition.
- the composite display device of the embodiment according to the present disclosure is a composite display device configured by connecting the side surfaces of the plurality of display devices 1a (1b) described above, and the plurality of display devices 1a (1b). Including the first display device 1a (1b) and the second display device 1a (1b) having the same configuration as the first display device 1a (1b), the portion of the first side surface adjacent to the first side m1 in the first display device 1a (1b), and the first. 2
- the configuration is such that the first side surface of the display device 1a (1b) and the second side surface facing the first side surface are connected to each other.
- the display device 1a (1b) indicates that it is a display device 1a or a display device 1b.
- the composite display device has the following effects due to the above configuration.
- connection pads 8 can be arranged while suppressing the occurrence of an electrical short circuit between them, reliability is improved. Further, since the display device 1a (1b) having a narrow frame portion is used, the frame portion becomes inconspicuous and the display quality is improved.
- FIG. 3 is a partial plan view schematically showing the configuration of a main part of the display device 1a of FIG. 1
- FIG. 4 is a cross-sectional view of the display device 1a of FIG. 3 as viewed from the cut plane line IV-IV.
- 8 is a cross-sectional view of the display device 1a of FIG. 3 as viewed from the cutting plane line VV.
- 5 is a partial plan view showing the wiring structure of the main part of the display device 1a of FIG. 1
- FIG. 6 is a partial plan view showing the wiring structure of the main part of the display device 1b of FIG. 2.
- FIG. Is a partial plan view showing the wiring structure of the main part of the modified example of the display device 1b of FIG.
- the circuit configuration on the second surface 2b side of the substrate 2 is omitted in order to facilitate the illustration.
- the mother substrate is cut from the back surface side by laser light irradiation, and a plurality of substrates having a narrow frame for tiling provided with a plurality of metal light-shielding layers are used. It may be realized.
- a high-power CO 2 laser, a YAG laser, or the like can be adopted as the laser beam for cutting the mother substrate.
- the beam diameter of the laser beam L (shown in FIG. 4) is about 5 ⁇ m to 5 mm.
- the display devices 1a and 1b are generically referred to, they are referred to as the display device 1.
- the display device 1 includes the substrate 2, the first metal light-shielding layer 31 laminated on the edge portion W on one side of the first surface 2a of the substrate 2, the first metal light-shielding layer 31, and the first surface 2a.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 located above the first metal light-shielding layer 31 at the portion 2a1 that does not overlap with the first metal light-shielding layer 31 are provided.
- the mother substrate is divided by laser light irradiation from the back surface side of the substrate, the influence of heat generated on the laser beam irradiation portion on the insulating layer (particularly the second insulating layer 32i) can be effectively suppressed.
- the metal light-shielding layer is divided into the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the metal light-shielding layer has a structure in which electrostatic discharge is unlikely to occur.
- the display device 1 includes pixel portions 3 arranged in a matrix on the first surface 2a of the substrate 2, a power supply circuit 7 located on the second surface 2b of the substrate 2, and the first surface 2a of the substrate 2.
- a plurality of first connection pads 8 that are located near the upper edge portion W and are electrically connected to the side wiring 10, and are located near the edge portion W on the second surface 2b of the substrate 2 and are side wiring.
- a plurality of backside side seventh connection pads 80 electrically connected to 10 and a plurality of side surface wirings 10 may be provided.
- the width of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 is, for example, about 50 ⁇ m to 200 ⁇ m.
- the display device 1 is further laminated on the edge portion W on the first side m1 side on the first surface 2a of the substrate 2 with a distance ⁇ L1 from each other in the direction in which the first side m1 extends.
- the light-shielding layer 31 and the first insulating layer 31i laminated on the region 2a1 exposed from between the plurality of first metal light-shielding layers 31 on the plurality of first metal light-shielding layers 31 and on the first surface 2a of the substrate 2.
- a plurality of second metal shading layers 32 laminated on the region 2a1 between two first metal shading layers 31 adjacent to each other in the direction in which the first side m1 extends in a plan view on the first insulating layer 31i.
- the second insulating layer 32i is laminated on the second metal light-shielding layer 32 and in the region 23a exposed from between the plurality of second metal light-shielding layers 32 of the first insulating layer 31i in a plan view.
- the material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 as the light-shielding layer of the laser beam L may be aluminum, chromium, molybdenum, or an alloy of these metals. Further, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may each have a single layer, but may have a laminated structure in which a plurality of layers are laminated. When the materials of the first and second metal light-shielding layers 31 and 32 are aluminum having high reflectance, a transparent insulating layer is provided on the irradiation side of the laser beam L of the first and second metal light-shielding layers 31 and 32. You may.
- the laser beam L is reflected by the first and second metal shading layers 31 and 32 without lowering the reflectance, and the heat absorption is reduced by the transparent insulating layer.
- the laser beam L is efficiently reflected to the outside of the second surface 2b side of the substrate 2 while suppressing heat absorption. Therefore, the effect of reducing thermal damage to the second insulating layer 32i, the organic insulating layers 24, 26, and the like is increased.
- the material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be more preferably molybdenum or the like. Since molybdenum efficiently absorbs and transfers heat from the laser beam, the intensity of the reflected light can be suppressed and the temperature rise of the display device 1 can be suppressed. That is, it is possible to increase the effect of reducing thermal damage due to the secondary reflection and absorption of the reflected light reflected by the first and second metal shading layers 31 and 32.
- first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be configured to be composed of Mo / Al / Mo, MoNd / AlNd / MoNd, or the like.
- Mo / Al / Mo indicates a laminated structure in which the Al layer is laminated on the Mo layer and the Mo layer is laminated on the Al layer.
- MoNd indicates that it is an alloy of Mo and Nd.
- the material of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be chromium oxide exhibiting black color. That is, it may be a layer that absorbs and attenuates the laser beam L.
- the display device 1 has a plurality of first metal light-shielding layers 31, and each of the first metal light-shielding layers 31 is parallel to one side (for example, the first side m1) of the edge portion W.
- the second metal light-shielding layer 32 may be laminated on the first insulating layer 31i in the region 2a1 between the adjacent first metal light-shielding layers 31. ..
- the region 2a1 is also a portion that does not overlap with the first metal light-shielding layer 31.
- the metal light-shielding layer since the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are further divided into smaller areas, the metal light-shielding layer has a structure in which electrostatic discharge is less likely to occur.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be in a series in a plan view. In this case, it is possible to further suppress the light (laser light) incident from the side of the second surface 2b of the substrate 2 from reaching the second insulating layer 32i. As a result, it is possible to more effectively suppress the influence of the heat of the laser beam on the second insulating layer 32i.
- the second metal light-shielding layer 32 may have an overlapping portion (overlap portion) LW that overlaps with the first metal light-shielding layer 31 in a plan view. In this case, it is possible to further suppress the light (laser light) incident from the side of the second surface 2b of the substrate 2 from reaching the second insulating layer 32i. As a result, it is possible to more effectively suppress the influence of the heat of the laser beam on the second insulating layer 32i.
- the length of the superimposing portion LW may be about 5 ⁇ m to 500 ⁇ m.
- the superimposed portion LW has a length such that the diffracted light (laser light) incident from the side of the second surface 2b of the substrate 2 diffracted at the end of the first metal shading layer 31 does not reach the second insulating layer 32i. You may have. In this case as well, the same effect as described above is obtained. In this case, the length of the superimposed portion LW is about 20 ⁇ m to 700 ⁇ m.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may have a structure having light reflectivity. In this case, since the light (laser light) incident from the side of the second surface 2b of the substrate 2 is reflected by the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the second insulating layer 32i is the laser light. The influence of heat can be suppressed more effectively.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be made of, for example, a metal material, an alloy material, or the like having a high light reflectance of visible light.
- the metal material examples include aluminum (Al), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), tin (Sn) and the like.
- the alloy material there are duralmin (Al—Cu alloy, Al—Cu—Mg alloy, Al—Zn—Mg—Cu alloy) which is an aluminum alloy containing aluminum as a main component.
- the light reflectance of these materials is about 90% to 95% for aluminum, about 93% for silver, about 60% to 70% for gold, about 60% to 70% for chromium, and about 60% to 70% for nickel.
- Platinum is about 60% to 70%
- tin is about 60% to 70%
- aluminum alloy is about 80% to 85%. Therefore, suitable materials for the first metal light-shielding layer 31 and the second metal light-shielding layer 32 having light reflectivity include aluminum, silver, gold, and aluminum alloys.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may have a light scattering property.
- the arithmetic surface roughness at which the surface of the thin film and the surface of the substrate are optical mirror surfaces is about 1/10 of the wavelength used. Therefore, in the case of light having a wavelength of 550 nm, which has the highest sensitivity of the human eye, a surface having an arithmetic surface roughness of 55 nm or less tends to be an optical mirror surface.
- the surfaces of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 which have light scattering properties, are 55 nm to 10 ⁇ m. It may be a degree of arithmetic surface roughness. It may be preferably about 1 ⁇ m to 10 ⁇ m, and more preferably about 2 ⁇ m to 7 ⁇ m.
- the first insulating layer 31i may be configured to include light-scattering particles.
- the light (laser light) incident from the side of the second surface 2b of the substrate 2 is scattered by the light scattering particles contained in the first insulating layer 31i, and the second insulating layer 32i is affected by the heat of the laser light. It is possible to effectively suppress receiving.
- the light scattering particles are made of, for example, a metal material, an alloy material, a glass material, a ceramic material, a metal oxide material, and the like.
- the metal material include aluminum (Al), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), platinum (Pt), tin (Sn) and the like.
- the alloy material there are duralmin (Al—Cu alloy, Al—Cu—Mg alloy, Al—Zn—Mg—Cu alloy) which is an aluminum alloy containing aluminum as a main component.
- the glass material include borosilicate glass, crystallized glass, quartz, soda glass and the like.
- the ceramic material include alumina, aluminum nitride, silicon nitride and the like.
- the metal oxide material include titanium oxide.
- the light scattering particles have light reflectivity such as a metallic gloss color such as a metal material or an alloy material, the light scattering particles reflect and scatter the laser light incident from the side of the second surface 2b of the substrate 2 to provide the second insulation. It is possible to make it difficult to reach the side of the layer 32i.
- the average particle size of the light-scattering particles may be about 55 nm to 10 ⁇ m. It may be preferably about 1 ⁇ m to 10 ⁇ m, and more preferably about 2 ⁇ m to 7 ⁇ m.
- the first insulating layer 31i may be made of an inorganic material such as silicon oxide (SiO 2 ) or silicon nitride (Si 3 N 4 ).
- SiO 2 silicon oxide
- Si 3 N 4 silicon nitride
- the second insulating layer 32i may be made of an organic material such as an acrylic resin or a polycarbonate resin.
- the second insulating layer 32i which is not easily affected by the heat of the laser beam incident from the side of the second surface 2b of the substrate 2, can form a thick flattening layer or the like.
- the second insulating layer 32i may be a light-shielding layer made of a blackening resin, so-called black matrix, or the like. In this case, when the display device is manufactured using the display device 1, the light-shielding layer becomes a black background color, and the contrast of the display image is improved.
- a side wiring 10 located from the edge portion W of the first surface 2a of the substrate 2 to the side of the second surface 2b via the side surface 2c of the substrate 2 is provided, and the side wiring 10 is a first metal shading layer 31 and / or a first. 2
- the configuration may be such that it overlaps with the metal light-shielding layer 32. In this case, it is possible to prevent the adjacent side wirings 10 from being short-circuited via the exposed portion of the first metal light-shielding layer 31 and / or the exposed portion of the second metal light-shielding layer 32.
- the side surface wiring 10 is formed by applying a conductive paste containing conductive particles such as Ag, Cu, Al, and stainless steel, an uncured resin component, an alcohol solvent, water, and the like from the first surface 2a to the side surface 2c and the second surface of the substrate 2. It can be formed by a method such as a heating method, a photo-curing method in which the surface 2b is applied to a desired portion and then cured by irradiation with light such as ultraviolet rays, or a photo-curing heating method.
- the side wiring 10 can also be formed by a thin film forming method such as a plating method, a vapor deposition method, or a CVD (Chemical Vapor Deposition) method.
- a groove may be formed in advance at a portion of the substrate 2 on the first surface 2a, the side surface 2c, and the second surface 2b where the side surface wiring 10 is formed.
- the conductive paste serving as the side wiring 10 can be easily arranged at a desired portion on the substrate 2.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be electrically floating (floating state). That is, the first metal shading layer 31 and the second metal shading layer 32 may be in a non-connected state to specific potential portions such as the anode potential portion and the cathode potential portion. In this case, the first metal shading layer 31 and the second metal due to the potential gradient generated from the connection portion with the specific potential portion to the opposite end portion of the first metal shading layer 31 and the second metal shading layer 32. It is possible to prevent the light-shielding layer 32 from being deteriorated by electrolytic corrosion.
- first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be arranged over the entire circumference of the substrate 2.
- the substrate 2 has a rectangular shape, if all the sides (4 sides) are laser-cut, the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are arranged on all the sides. May be good.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be arranged at least on the laser-cut side.
- the first insulating layer 31i is made of an inorganic material.
- the second insulating layer 32i is made of an organic material.
- a light emitting element 6, a TFT that drives and controls the light emitting element 6, and a wiring layer such as a gate signal line 4 and a source signal line 5, which will be described later, are connected to the light emitting element 6 and the TFT.
- a wiring layer such as a gate signal line 4 and a source signal line 5, which will be described later.
- at least one of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 may be made of the same material as the wiring layer. In this case, the number of steps can be reduced.
- FIG. 9 is a block circuit diagram schematically showing the circuit configuration on the first surface 2a side of the display device shown in FIG. 1
- FIG. 10 is a block circuit schematically showing the circuit configuration on the second surface 2b side of the display device. It is a figure.
- the substrate 2 is, for example, a transparent or opaque glass substrate, a plastic substrate, a ceramic substrate, or the like.
- the substrate 2 has a third surface (side surface) 2c that connects the first surface 2a and the second surface 2b.
- the substrate 2 has a shape having at least a first side m1 and a second side m2 adjacent thereto.
- the shape of the substrate 2 may be a triangular plate shape, a rectangular plate shape, a parallelogram plate shape, a trapezoidal plate shape, a hexagonal plate shape, or the like, or may be any other shape.
- the shape of the substrate 2 is a triangular plate shape, a rectangular plate shape, a hexagonal plate shape, or the like, a plurality of display devices 1 are tiled to form a composite and large display device (hereinafter, multi-display). Also called) becomes easy to produce.
- the substrate 2 has a rectangular plate-like shape.
- the substrate 2 may have a shape having a third side m3 adjacent to the first side m1 and facing the second side m2.
- the shape of the substrate 2 may be a rectangular plate shape, a parallelogram plate shape, a trapezoidal plate shape, a hexagonal plate shape, or the like, or may be another shape.
- the second side m2 and the third side m3 facing the second side m2 may be parallel to each other, but may not be completely parallel to each other.
- a plurality of pixel portions 3 are arranged in a matrix on the first surface 2a of the substrate 2 at a predetermined pitch.
- the plurality of pixel units 3 are arranged corresponding to the intersections of the plurality of gate signal lines 4 and the plurality of source signal lines 5, and each pixel unit 3 has a light emitting element 6.
- the plurality of gate signal lines 4 are arranged along a predetermined direction (left-right direction in FIG. 9, for example, row direction).
- the plurality of source signal lines 5 are arranged so as to intersect the plurality of gate signal lines 4 in a direction intersecting a predetermined direction (for example, in a column direction).
- the plurality of pixel portions 3 are arranged corresponding to the intersections of the plurality of gate signal lines 4 and the plurality of source signal lines 5. As shown in FIG. 9, for example, the plurality of pixel portions 3 are arranged in a matrix at a predetermined pixel pitch.
- Each of the plurality of pixel portions 3 has a light emitting element 6 and an electrode pad 62.
- the light emitting element 6 is a self-luminous element such as a light emitting diode (LED) element, an organic electroluminescence element, or a semiconductor laser element. In this embodiment, an LED element is used as the light emitting element 6.
- the light emitting element 6 may be a micro LED element. When the light emitting element 6 is a micro LED element, the light emitting element 6 has a rectangular shape having a side length of about 1 ⁇ m or more and about 100 ⁇ m or less or about 3 ⁇ m or more and about 10 ⁇ m or less in a state of being arranged on the first surface 2a. It may have a plan view shape of.
- the light emitting element 6 has an anode terminal and a cathode terminal
- the electrode pad 62 has an anode pad 62a and a cathode pad 62b.
- the anode terminal and the cathode terminal of the light emitting element 6 are electrically connected to the anode pad 62a and the cathode pad 62b, respectively, via a conductive bonding material such as a conductive adhesive or solder.
- Each pixel unit 3 may have a plurality of light emitting elements 6, a plurality of anode pads 62a, and a single unit or a plurality of cathode pads 62b.
- a plurality of anode terminals of the plurality of light emitting elements 6 are electrically connected to the plurality of anode pads 62a, respectively, and a plurality of cathode terminals of the plurality of light emitting elements 6 are electrically connected to the single or a plurality of cathode pads 62b.
- the cathode pad 62b is a single body, it can be a common cathode pad 62b for a plurality of light emitting elements 6.
- the plurality of light emitting elements 6 may be a light emitting element 61R that emits red light, a light emitting element 61G that emits green light, and a light emitting element 61B that emits blue light.
- each pixel unit 3 can display color gradation.
- Each pixel unit 3 may have a light emitting element that emits orange light, red-orange light, magenta light, or purple light instead of the light emitting element 61R that emits red light. Further, each pixel unit 3 may have a light emitting element that emits yellowish green light instead of the light emitting element 61G that emits green light.
- the power supply circuit 7 as the power supply unit is arranged on the second surface 2b, for example, as shown in FIG.
- the power supply circuit 7 generates the first power supply voltage VDD and the second power supply voltage VSS supplied to the plurality of pixel units 3.
- the power supply circuit 7 has a VDD terminal that outputs the first power supply voltage VDD and a VSS terminal that outputs the second power supply voltage VSS.
- the first power supply voltage VDD is, for example, an anode voltage of about 10V to 15V.
- the second power supply voltage VSS is lower than the first power supply voltage VDD, and is, for example, a cathode voltage of about 0V to 3V.
- the power supply circuit 7 may be configured by, for example, a flexible circuit board (Flexible Circuit Board: FPC).
- the power supply unit may be a circuit module including a semiconductor element such as an IC or LSI for controlling the power supply voltage. Further, the power supply unit has a power supply circuit 7 and a control element configured by an IC chip for generating a control signal for controlling light emission, non-light emission, light emission intensity, etc. of the light emitting element 6. May be good.
- the control element may be included in the power supply circuit 7 as a control unit.
- the drive circuit unit 13 is arranged on the second surface 2b.
- the drive circuit unit 13 is electrically connected to the source signal line 5 arranged on the first surface 2a via the second source signal line 17 arranged on the second surface 2b.
- the drive circuit unit 13 and the power supply circuit 7 may be electrically connected in order to synchronize their operations.
- the power supply connection pad 108 on the front surface side is arranged at the edge portion W on the second side m2 side on the first surface 2a.
- the edge portion W is an edge portion along the second side m2, and is a portion having a width of about 10 ⁇ m to 500 ⁇ m from the second side m2 on the first surface 2a toward the center side of the first surface 2a. There is, but it is not limited to the value of this width.
- the power supply connection pad 108 has a plurality of first power supply connection pads 181 and a plurality of second power supply connection pads 182.
- the first power supply connection pad 181 is a connection pad for supplying the first power supply voltage VDD to the plurality of pixel units 3, and the second power supply connection pad 182 supplies the second power supply voltage VSS to the plurality of pixel units 3. It is a connection pad for.
- the first power supply connection pad 181 and the second power supply connection pad 182 each have a rectangular shape having a side length of about 50 ⁇ m to 500 ⁇ m, preferably about 70 ⁇ m to 300 ⁇ m, and the length of one side is these values.
- the shape is not limited to the above, and the shape may be various shapes such as a polygonal shape such as a pentagonal shape, a trapezoidal shape, a circular shape, and an elliptical shape.
- the same configuration can be adopted for the wiring pad.
- the display device 1 has a first routing wiring 11a and a second routing wiring 11b.
- the first routing wiring 11a and the second routing wiring 11b are located on the first surface 2a.
- the first routing wiring 11a and the second routing wiring 11b are composed of, for example, Mo / Al / Mo, MoNd / AlNd / MoNd, and the like.
- Mo / Al / Mo indicates a laminated structure in which the Al layer is laminated on the Mo layer and the Mo layer is laminated on the Al layer. The same applies to others.
- the first routing wiring 11a connects the anode terminal of the light emitting element 6 and the plurality of first power supply connection pads 181.
- the second routing wiring 11b connects the cathode terminal of the light emitting element 6 and the plurality of second power supply connection pads 182.
- the first routing wiring 11a and the second routing wiring 11b may have a planar wiring pattern.
- the first routing wiring 11a and the second routing wiring 11b are electrically isolated from each other by an insulating layer (not shown) arranged between them.
- the anode pad 62a of the electrode pad 62 may be formed as a part of the first routing wiring 11a.
- the power supply connection pad 9 on the back surface side is located on the second surface 2b.
- the power connection pad 9 may be arranged, for example, at the end edge portion on the second side m2 side. This edge portion may have the same configuration as the edge portion W described above.
- the power supply connection pad 9 has a plurality of third power supply connection pads 91 and a plurality of fourth power supply connection pads 92.
- the third power supply connection pad 91 is a connection pad for supplying the first power supply voltage VDD to the plurality of pixel portions 3, and the fourth power supply connection pad 92 supplies the second power supply voltage VSS to the plurality of pixel portions 3. It is a connection pad for.
- the number of the plurality of first power supply connection pads 181 and the number of the plurality of third power supply connection pads 91 are equal to each other, and the number of the plurality of second power supply connection pads 182 and the number of the plurality of fourth power supply connection pads 92 are equal to each other.
- the configuration is equal to the number.
- the plurality of first power supply connection pads 181 and the plurality of third power supply connection pads 91 may overlap each other in a plan view, that is, when viewed from a direction orthogonal to the first surface 2a.
- the plurality of second power supply connection pads 182 and the plurality of fourth power supply connection pads 92 may overlap each other in a plan view.
- the display device 1 has a third routing wiring 12.
- the third routing wiring 12 is located on the second surface 2b.
- the third routing wiring 12 is composed of, for example, Mo / Al / Mo, MoNd / AlNd / MoNd, Ag, and the like.
- the third routing wiring 12 connects the VDD terminal of the power supply circuit 7 to the plurality of third power supply connection pads 91, and connects the VSS terminal of the power supply circuit 7 to the plurality of fourth power supplies. It is connected to the pad 92.
- the plurality of side wirings 10 are arranged from the top of the first surface 2a to the top of the second surface 2b via the third surface 2c which is the side surface of the substrate 2.
- the plurality of side wirings 10 are arranged from the first surface 2a to the third surface 2c and the second surface 2b.
- the plurality of side wirings 10 connect the plurality of first power supply connection pads 181 and the plurality of third power supply connection pads 91, respectively.
- the plurality of side wirings 10 connect the plurality of second power supply connection pads 182 and the plurality of fourth power supply connection pads 92, respectively.
- the display device 1 may have a configuration having a plurality of through conductors penetrating from the first surface 2a to the second surface 2b instead of the plurality of side wiring 10. Further, the configuration may have a plurality of side wirings 10 and a plurality of through conductors. The display device 1 of the present embodiment may preferably have a configuration having at least a plurality of side wirings 10.
- the display device 1 is arranged from above the first surface 2a to above the second surface 2b, and has a gate wiring that connects a plurality of gate signal lines 4 and a control unit of the power supply circuit 7. As shown in FIGS. 9 and 10, the gate wiring includes a fifth connection pad 18, a sixth connection pad 19, a first gate wiring 20, a second gate wiring 21, and a third gate wiring 22.
- the third gate wiring 22 is formed as side wiring.
- the fifth connection pad 18 is arranged at the end edge portion on the first surface 2a on the second side m2 side.
- the sixth connection pad 19 is arranged at the end edge portion on the second surface 2b on the second side m2 side.
- the fifth connection pad 18 and the sixth connection pad 19 may overlap each other in a plan view.
- the first gate wiring 20 is arranged on the first surface 2a, for example, as shown in FIG. 9, and connects the plurality of gate signal lines 4 and the fifth connection pad 18.
- the second gate wiring 21 is arranged on the second surface 2b, for example, as shown in FIG. 10, and connects the control unit of the power supply circuit 7 and the sixth connection pad 19.
- the third gate wiring 22 is arranged from the first surface 2a to the third surface 2c and the second surface 2b, and the fifth connection pad 18 and the sixth connection pad 19 are arranged. Is connected to.
- connection pad 8 (for example, the first connection pad 81) and the corresponding seventh connection pad 80 on the back surface side are made of a conductive material.
- the first connection pad 8 and the seventh connection pad 80 may be made of a single metal layer, or may be made by laminating a plurality of metal layers.
- the first connection pad 8 and the seventh connection pad 80 are made of, for example, Al, Al / Ti, Ti / Al / Ti, Mo, Mo / Al / Mo, MoNd / AlNd / MoNd, Cu, Cr, Ni, Ag and the like. It may be made up.
- connection pad 8 may be configured by laminating two conductor layers 8a1 and 8ba2.
- the conductor layer 8a1 may be composed of Al, Al / Ti, Ti / Al / Ti, Mo, Mo / Al / Mo, MoNd / AlNd / MoNd, Cu, Cr, Ni, Ag, etc., and may be formed on the conductor layer 8a1.
- the conductor layer 8a2 may be composed of a transparent conductive layer made of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or the like.
- the insulating layers 25 and 26 may be arranged at the inner end of the first surface 2a of the connection pad 8.
- connection pad 8 it is possible to prevent the connection pad 8 from being short-circuited with the wiring conductor or the like arranged on the inner side of the first surface 2a.
- the insulating layers 25 and 26 are made of a polymer material such as SiO 2 , Si 3 N 4 , acrylic resin or the like.
- the surface of the seventh connection pad 80 may be covered with a transparent conductive layer made of ITO, IZO, or the like.
- Each pixel unit 3 has a first thin film (Thin Film Transistor: TFT) as a switch element for inputting a light emitting signal to each of the light emitting elements 6 and a light emitting control signal (image signal line SL) on the substrate 2.
- the light emitting element 6 is current-driven from the potential difference (light emitting signal) between the positive voltage (anode voltage: about 10V to 15V) and the negative voltage (cathode voltage: about 0V to 3V) according to the level (voltage) of the transmitted signal).
- a second thin film as a driving element for the purpose.
- the first and second TFTs have a semiconductor film made of, for example, amorphous silicon (a-Si), low-Temperature Poly Silicon (LTPS), etc., and are used as a gate electrode, a source electrode, and a drain electrode. It has a configuration having three terminals. Further, as the first and second TFTs, a configuration in which both are n-channel TFTs, a configuration in which both are p-channel TFTs, and a configuration in which one is an n-channel TFT and the other is a p-channel TFT can be adopted.
- a-Si amorphous silicon
- LTPS low-Temperature Poly Silicon
- the driving element is a thin film forming method such as a CVD (Chemical Vapor Deposition) method in which the TFT is formed on the substrate 2. Can be formed directly by.
- FIG. 14 is a diagram showing an embodiment of the composite display device of the present disclosure, and is a partial plan view of a main part.
- a plurality of display devices 1 of the present disclosure can be used to configure the composite display device 100.
- the composite display device 100 is configured by connecting the side surfaces of a plurality of display devices 1 to each other.
- the plurality of display devices 1 include a first display device 1A and a second display device 1B, a first side surface 2c1 adjacent to a first side m1 in the first display device 1A, and a first side surface 2c1 in the second display device 1B.
- the second side surface 2c2 facing the above surface is coupled to the second side surface 2c2.
- the binder 90 that binds the first side surface 2c1 of the first display device 1A and the second side surface 2c2 of the second display device 1B may be a resin adhesive.
- the resin adhesive is made of a photocurable or thermocurable resin material such as an epoxy resin, a polyamide resin, a resin obtained by mixing an epoxy resin and a polyamide resin, an acrylic resin, a silicone resin, and a urethane resin.
- the resin adhesive may be a black resin material in which a black inorganic pigment is mixed with the resin material. In this case, since the joint portion (tiling portion) between the first display device and the second display device is inconspicuous, the continuity of the displayed image can be easily maintained.
- the inorganic pigments are carbon-based pigments such as carbon black, nitride-based pigments such as titanium black, Cr-Fe-Co-based, Cu-Co-Mn (manganese) -based, Fe-Co-Mn-based, and Fe-Co-Ni.
- -It may be a metal oxide pigment such as Cr.
- the composite display device 100 may be configured by combining three or more display devices 1. Further, the composite display device 100 may include a base substrate, and a plurality of display devices 1 may be fixed on the base substrate via fixing members.
- the fixing member may include a mechanical fixing element such as a screw, a clip, a fitting member, or a chemical fixing element such as an adhesive. Further, the fixing member includes a frame in which the edge portion of the substrate 2 of the display device 1 is fitted, and the frame is fixed to the base substrate by a mechanical fixing element or a chemical fixing element. good.
- the binder may be black and have an uneven structure on the surface that absorbs incident light.
- the binder is a black resin formed by mixing a black pigment such as carbon black into a base material such as a silicone resin, and the surface of the black resin has an arithmetic average roughness of about 10 ⁇ m to 50 ⁇ m, preferably.
- An uneven structure of about 20 ⁇ m to 30 ⁇ m may be formed by a transfer method or the like. In this case, the light absorption of the binder is significantly improved.
- the front surface side and the back surface side of each display device 1 are electrically connected by a side wiring 10 made of Ag or the like. Connecting.
- a single metal light-shielding layer that shields laser light is arranged at the formation portion of the side wiring 10 of the substrate 2 as in the conventional case, there is a possibility that adjacent side wiring 10s may be short-circuited via the metal light-shielding layer.
- the adjacent side wirings 10 are second to each other. 1 It is possible to prevent short-circuiting via the metal light-shielding layer 31. Further, in the present embodiment, when the overlapping portion LW is provided so that the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are in a series in a plan view, from the side of the second surface 2b of the substrate 2.
- the second insulating layer 32i and the like can be effectively suppressed from being affected by the heat of the laser beam. Further, when the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are electrically floating (floating state), the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are deteriorated by electrolytic corrosion. You can prevent that. Further, since the metal light-shielding layer is divided into the first metal light-shielding layer 31 and the second metal light-shielding layer 32, the metal light-shielding layer has a structure in which electrostatic discharge is unlikely to occur.
- the first metal light-shielding layer 31 and the second metal light-shielding layer 32 are not only the second insulating layer 32i but also an insulating layer (organic insulation) which is an organic layer as a thick flattening layer or the like. Since the layer) is located closer to the laser beam L than the layers 24 and 26, the influence of the heat of the laser beam L on not only the second insulating layer 32i but also the organic insulating layers 24 and 26 can be suppressed. That is, it is possible to prevent the organic insulating layers 24 and 26 from sublimating due to the heat of the laser beam L and then solidifying and adhering to the wiring or the like on the first surface 2a as foreign matter.
- each of the first metal light-shielding layer 31 and the second metal light-shielding layer 32 is about 50 nm to 1 ⁇ m, but even if the thickness of the first metal light-shielding layer 31 is made thicker than the thickness of the second metal light-shielding layer 32. good.
- the first metal light-shielding layer 31 on the side closer to the laser light L can efficiently absorb the heat of the laser light, and the second metal light-shielding layer 32 can be less affected by the heat of the laser light.
- the thickness of the first metal light-shielding layer 31 may be more than 1 times and 5 times or less the thickness of the second metal light-shielding layer 32, but is not limited to this value. If it exceeds 5 times, it tends to hinder the thinning of the display device 1.
- connection pads that are difficult to miniaturize can be arranged on a substrate without causing an electrical short circuit between them and increasing the size of the frame portion. .. It is also possible to arrange a plurality of connection pads on a substrate with a smaller frame portion.
- the display device of the present disclosure can be configured as a light emitting display device such as an LED display device and an organic EL display device, and a liquid crystal display display device. Further, the display device of the present disclosure can be applied to various electronic devices.
- the electronic devices include a complex and large display device (multi-display), an automobile route guidance system (car navigation system), a ship route guidance system, an aircraft route guidance system, a smartphone terminal, a mobile phone, a tablet terminal, and a personal digital assistant.
- PDAs video cameras, digital still cameras, electronic notebooks, electronic books, electronic dictionaries, personal computers, copying machines, terminal devices for game machines, televisions, product display tags, price display tags, industrial programmable display devices, Car audio, digital audio players, facsimiles, printers, automated cash deposit and payment machines (ATMs), vending machines, head-mounted displays (HMDs), digital display watches, smart watches, etc.
- ATMs automated cash deposit and payment machines
- HMDs head-mounted displays
- digital display watches smart watches, etc.
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Abstract
Description
2 基板
2a 第1面
2b 第2面
2c 第3面(側面)
3 画素部
6 発光素子
8 接続パッド
81 第1接続パッド
82 第2接続パッド
83 第3接続パッド
10 側面配線
L1 第1発光制御信号線
L2 第2発光制御信号線
L3 第3発光制御信号線
m1 第1辺
m2 第2辺
m3 第3辺
Claims (18)
- 第1辺およびそれに隣接する第2辺を有する基板と、
前記基板上に位置する複数の発光素子と、
前記基板上に位置し、前記発光素子の発光/非発光を制御する複数の発光制御信号線と、
前記基板上の前記第1辺側の端縁部および前記第2辺側の端縁部に位置し、前記複数の発光制御信号線のそれぞれに接続される接続パッドと、を備える、表示装置。 - 複数の前記接続パッドは、前記基板上の前記第1辺側の端縁部に前記第1辺に沿って位置し、前記複数の発光素子のうち第1群の前記発光素子のそれぞれの発光/非発光を制御する第1発光制御信号線に接続される複数の第1接続パッドと、前記基板上の前記第2辺側の端縁部に位置し、前記複数の発光素子のうち第2群の前記発光素子の発光/非発光を制御する第2発光制御信号線に接続される第2接続パッドと、を含む請求項1に記載の表示装置。
- 前記基板上の前記第2辺側の端縁部に、前記第2発光制御信号線以外の配線に接続される他の接続パッドが位置しており、
前記第2接続パッドは、前記他の接続パッドよりも前記第1辺に近接する位置にある、請求項2に記載の表示装置。 - 前記複数の発光素子は、前記基板上の前記第1辺側の端縁部に前記第1辺に沿って位置する複数の最外部発光素子を含み、
前記第1接続パッドは、前記複数の最外部発光素子同士の間に位置している、請求項2または3に記載の表示装置。 - 前記第2群の発光素子は、前記第2辺側の端縁部に沿って位置し、
前記第2接続パッドは、前記第2群の発光素子同士の間に位置している、請求項2~4のいずれか1項に記載の表示装置。 - 前記第2接続パッドの大きさが前記第1接続パッドの大きさよりも大きい、請求項2~5のいずれか1項に記載の表示装置。
- 前記第2接続パッドは、前記第2辺に沿って前記第1辺側に向かって延出する延出部を有する、請求項6に記載の表示装置。
- 前記基板は、前記複数の発光素子が位置する側の第1面と、前記第1面と反対側の第2面と、前記第1面と前記第2面をつなぐ側面と、前記第1面の端縁部から前記側面を介して前記第2面の端縁部にかけて位置する側面配線と、を有し、
前記第1接続パッドおよび前記第2接続パッドは、それぞれ前記側面配線に接続されている、請求項2~7のいずれか1項に記載の表示装置。 - 前記基板は、前記第1辺に隣接するとともに前記第2辺に対向する第3辺を有し、
前記基板上の前記第3辺側の端縁部に位置し、前記複数の発光素子のうち第3群の前記発光素子の発光/非発光を制御する第3発光制御信号線に接続される第3接続パッドを備える、請求項2~8のいずれか1項に記載の表示装置。 - 前記基板上の前記第3辺側の端縁部に、前記第3発光制御信号線以外の配線に接続される他の接続パッドが位置しており、
前記第3接続パッドは、前記他の接続パッドよりも前記第1辺に近接する位置にある、請求項9に記載の表示装置。 - 前記第3群の発光素子は、前記第3辺側の端縁部に沿って位置し、
前記第3接続パッドは、前記第3群の発光素子同士の間に位置している、請求項9または10に記載の表示装置。 - 前記第3接続パッドの大きさが前記第1接続パッドの大きさよりも大きい、請求項9~11のいずれか1項に記載の表示装置。
- 前記第3接続パッドは、前記第3辺に沿って前記第1辺側に向かって延出する延出部を有する、請求項8または12に記載の表示装置。
- 前記基板は、前記複数の発光素子が位置する側の第1面と、前記第1面と反対側の第2面と、前記第1面と前記第2面をつなぐ側面と、前記第1面の端縁部から前記側面を介して前記第2面の端縁部にかけて位置する側面配線と、を有し、
前記第3接続パッドは、前記側面配線に接続されている、請求項9~13のいずれか1項に記載の表示装置。 - 前記基板は、前記第2面側に前記側面配線に電気的に接続される駆動部を備える、請求項8または14に記載の表示装置。
- 前記第2辺側の端縁部に、前記複数の発光素子に電源電流を供給する電源配線に接続される電源接続パッドが位置する、請求項1~15のいずれか1項に記載の表示装置。
- 前記発光素子は、マイクロ発光ダイオード素子である、請求項1~16のいずれか1項に記載の表示装置。
- 請求項1~17のいずれか1項に記載の複数の表示装置と、
前記複数の表示装置の側面同士を結合させることによって構成される複合型表示装置であって、
前記複数の表示装置は、第1表示装置および第2表示装置を含み、
前記第1表示装置における前記第1辺に隣接する第1側面と、前記第2表示装置における前記第1側面と対向する第2側面と、が結合されている複合型表示装置。
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JP2003121867A (ja) * | 2001-10-11 | 2003-04-23 | Samsung Electronics Co Ltd | ビジュアルインスペクション手段を備えた薄膜トランジスタ基板及びビジュアルインスペクション方法 |
JP2005221598A (ja) * | 2004-02-04 | 2005-08-18 | Hitachi Displays Ltd | 表示装置 |
JP2010232276A (ja) * | 2009-03-26 | 2010-10-14 | Casio Computer Co Ltd | 発光装置及びその製造方法 |
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WO2019167966A1 (ja) * | 2018-02-28 | 2019-09-06 | 京セラ株式会社 | 表示装置、ガラス基板およびガラス基板の製造方法 |
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JP2003121867A (ja) * | 2001-10-11 | 2003-04-23 | Samsung Electronics Co Ltd | ビジュアルインスペクション手段を備えた薄膜トランジスタ基板及びビジュアルインスペクション方法 |
JP2005221598A (ja) * | 2004-02-04 | 2005-08-18 | Hitachi Displays Ltd | 表示装置 |
JP2010232276A (ja) * | 2009-03-26 | 2010-10-14 | Casio Computer Co Ltd | 発光装置及びその製造方法 |
US20180188579A1 (en) * | 2016-12-30 | 2018-07-05 | Lg Display Co., Ltd. | Display device, multi-screen display device using the same and method for manufacturing the same |
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