CN116406331A - 感光性层叠树脂结构体、干膜、固化物和电子部件 - Google Patents
感光性层叠树脂结构体、干膜、固化物和电子部件 Download PDFInfo
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- CN116406331A CN116406331A CN202180067607.XA CN202180067607A CN116406331A CN 116406331 A CN116406331 A CN 116406331A CN 202180067607 A CN202180067607 A CN 202180067607A CN 116406331 A CN116406331 A CN 116406331A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Thermal Sciences (AREA)
- Architecture (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-170681 | 2020-10-08 | ||
| JP2020170681A JP2022062573A (ja) | 2020-10-08 | 2020-10-08 | 感光性積層樹脂構造体、ドライフィルム、硬化物および電子部品 |
| JP2020172141A JP2022063745A (ja) | 2020-10-12 | 2020-10-12 | 感光性積層樹脂構造体、ドライフィルム、硬化物および電子部品 |
| JP2020-172141 | 2020-10-12 | ||
| JP2021-005873 | 2021-01-18 | ||
| JP2021005873A JP2022110455A (ja) | 2021-01-18 | 2021-01-18 | 感光性積層樹脂構造体、ドライフィルム、硬化物および電子部品 |
| PCT/JP2021/037247 WO2022075432A1 (ja) | 2020-10-08 | 2021-10-07 | 感光性積層樹脂構造体、ドライフィルム、硬化物および電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116406331A true CN116406331A (zh) | 2023-07-07 |
Family
ID=81126508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180067607.XA Pending CN116406331A (zh) | 2020-10-08 | 2021-10-07 | 感光性层叠树脂结构体、干膜、固化物和电子部件 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20230084182A (ja) |
| CN (1) | CN116406331A (ja) |
| WO (1) | WO2022075432A1 (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224561A (ja) | 1993-01-25 | 1994-08-12 | Ibiden Co Ltd | 放熱構造プリント配線板及びその製造方法 |
| JP4711208B2 (ja) | 2006-03-17 | 2011-06-29 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。 |
| JP4927426B2 (ja) | 2006-03-27 | 2012-05-09 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物及びその硬化物 |
| JP5955787B2 (ja) * | 2012-06-20 | 2016-07-20 | 富士フイルム株式会社 | 転写フィルム、静電容量型入力装置の製造方法および静電容量型入力装置、並びに、これを備えた画像表示装置 |
| JP5514355B2 (ja) | 2012-09-28 | 2014-06-04 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法 |
| WO2016158362A1 (ja) * | 2015-03-27 | 2016-10-06 | 日立化成株式会社 | ドライフィルム、硬化物、積層体及びレジストパターンの形成方法 |
| JP2017211555A (ja) * | 2016-05-26 | 2017-11-30 | 日立化成株式会社 | ドライフィルム及びレジストパターンの形成方法 |
| JP6215497B1 (ja) * | 2017-02-23 | 2017-10-18 | 太陽インキ製造株式会社 | 感光性フィルム積層体およびそれを用いて形成された硬化物 |
| JP7007308B2 (ja) * | 2019-02-01 | 2022-01-24 | 富士フイルム株式会社 | 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 |
-
2021
- 2021-10-07 WO PCT/JP2021/037247 patent/WO2022075432A1/ja active Application Filing
- 2021-10-07 CN CN202180067607.XA patent/CN116406331A/zh active Pending
- 2021-10-07 KR KR1020237012944A patent/KR20230084182A/ko unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022075432A1 (ja) | 2022-04-14 |
| KR20230084182A (ko) | 2023-06-12 |
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