CN116348511A - 粘接剂组合物、接合体及粘接剂组合物的制造方法 - Google Patents

粘接剂组合物、接合体及粘接剂组合物的制造方法 Download PDF

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Publication number
CN116348511A
CN116348511A CN202280007060.9A CN202280007060A CN116348511A CN 116348511 A CN116348511 A CN 116348511A CN 202280007060 A CN202280007060 A CN 202280007060A CN 116348511 A CN116348511 A CN 116348511A
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CN
China
Prior art keywords
adhesive composition
meth
polymer particles
composition according
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202280007060.9A
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English (en)
Chinese (zh)
Inventor
高桥佑辅
高野千亚纪
栗村启之
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Denka Co Ltd
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Denka Co Ltd
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Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN116348511A publication Critical patent/CN116348511A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/126—Polymer particles coated by polymer, e.g. core shell structures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202280007060.9A 2021-03-31 2022-03-23 粘接剂组合物、接合体及粘接剂组合物的制造方法 Pending CN116348511A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-059627 2021-03-31
JP2021059627 2021-03-31
PCT/JP2022/013513 WO2022210166A1 (ja) 2021-03-31 2022-03-23 接着剤組成物、接合体および接着剤組成物の製造方法

Publications (1)

Publication Number Publication Date
CN116348511A true CN116348511A (zh) 2023-06-27

Family

ID=83456753

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280007060.9A Pending CN116348511A (zh) 2021-03-31 2022-03-23 粘接剂组合物、接合体及粘接剂组合物的制造方法

Country Status (7)

Country Link
US (1) US20240174893A1 (https=)
EP (1) EP4310118A4 (https=)
JP (2) JP7768977B2 (https=)
KR (1) KR102933707B1 (https=)
CN (1) CN116348511A (https=)
TW (2) TW202513738A (https=)
WO (1) WO2022210166A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2026066776A (ja) * 2024-10-07 2026-04-17 デンカ株式会社 組成物、物品およびモータ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04226579A (ja) * 1990-07-05 1992-08-17 Illinois Tool Works Inc <Itw> 低温用接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
CN103094582A (zh) * 2012-02-02 2013-05-08 Jsr株式会社 电极用粘结剂组合物、电极用糊料、电极和蓄电设备
JP2014201688A (ja) * 2013-04-08 2014-10-27 アイカ工業株式会社 光硬化樹脂組成物
WO2017170957A1 (ja) * 2016-03-31 2017-10-05 デンカ株式会社 組成物
US20180215954A1 (en) * 2015-07-30 2018-08-02 Denka Company Limited Composition
WO2020110911A1 (ja) * 2018-11-27 2020-06-04 株式会社イーテック ２液混合型接着剤

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8202281A (nl) * 1982-06-04 1984-01-02 Dow Chemical Nederland Met rubber versterkte polymeren van aromatische monovinylideenverbindingen en werkwijze voor de bereiding daarvan.
US7485680B2 (en) 2003-09-18 2009-02-03 Kaneka Corporation Process for producing rubbery polymer particle and process for producing resin composition containing the same
JP4707320B2 (ja) 2003-12-22 2011-06-22 電気化学工業株式会社 二剤型アクリル系接着剤組成物とそれを用いた接合体
JP5243965B2 (ja) * 2005-12-15 2013-07-24 ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー 多相アクリル系接着剤
JP2016104834A (ja) 2014-12-01 2016-06-09 株式会社カネカ コアシェルポリマーにより改質された変性熱可塑性ウレタンエラストマー
JP2016155892A (ja) * 2015-02-23 2016-09-01 スリーエム イノベイティブ プロパティズ カンパニー ２液型接着剤
CN110461594B (zh) * 2017-03-22 2021-02-12 住友电木株式会社 脱模膜及挠性印刷电路基板的制造方法
FR3068979B1 (fr) * 2017-07-12 2020-07-31 Arkema France Composition d'adhesif (meth)acrylique, son procede de preparation et son utilisation
US20210340346A1 (en) * 2018-09-11 2021-11-04 Mitsubishi Engineering-Plastics Corporation Metal film-coated molded resin articles and production method therefor
JP7364880B2 (ja) 2019-10-03 2023-10-19 横浜ゴム株式会社 スチールコード接着用ゴム組成物及びコンベヤベルト

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04226579A (ja) * 1990-07-05 1992-08-17 Illinois Tool Works Inc <Itw> 低温用接着剤
WO2007046190A1 (ja) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
CN103094582A (zh) * 2012-02-02 2013-05-08 Jsr株式会社 电极用粘结剂组合物、电极用糊料、电极和蓄电设备
JP2014201688A (ja) * 2013-04-08 2014-10-27 アイカ工業株式会社 光硬化樹脂組成物
US20180215954A1 (en) * 2015-07-30 2018-08-02 Denka Company Limited Composition
WO2017170957A1 (ja) * 2016-03-31 2017-10-05 デンカ株式会社 組成物
WO2020110911A1 (ja) * 2018-11-27 2020-06-04 株式会社イーテック ２液混合型接着剤

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Publication number Publication date
EP4310118A4 (en) 2024-07-31
EP4310118A1 (en) 2024-01-24
TW202513738A (zh) 2025-04-01
JP7768977B2 (ja) 2025-11-12
US20240174893A1 (en) 2024-05-30
JPWO2022210166A1 (https=) 2022-10-06
JP2024032758A (ja) 2024-03-12
WO2022210166A1 (ja) 2022-10-06
TW202246436A (zh) 2022-12-01
KR20230150341A (ko) 2023-10-30
KR102933707B1 (ko) 2026-03-03
TWI870654B (zh) 2025-01-21

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