CN116161982A - 一种抛釉洞石陶瓷薄板及其制备方法 - Google Patents
一种抛釉洞石陶瓷薄板及其制备方法 Download PDFInfo
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- CN116161982A CN116161982A CN202310039051.4A CN202310039051A CN116161982A CN 116161982 A CN116161982 A CN 116161982A CN 202310039051 A CN202310039051 A CN 202310039051A CN 116161982 A CN116161982 A CN 116161982A
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- Prior art keywords
- layer
- glaze
- green brick
- ceramic sheet
- polished
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 239000011449 brick Substances 0.000 claims abstract description 71
- 239000000843 powder Substances 0.000 claims abstract description 23
- 239000004575 stone Substances 0.000 claims abstract description 16
- 238000007641 inkjet printing Methods 0.000 claims abstract description 11
- 230000006835 compression Effects 0.000 claims abstract description 4
- 238000007906 compression Methods 0.000 claims abstract description 4
- 239000002689 soil Substances 0.000 claims description 25
- 238000005507 spraying Methods 0.000 claims description 17
- 229910052573 porcelain Inorganic materials 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000002537 cosmetic Substances 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 10
- 239000000454 talc Substances 0.000 claims description 10
- 235000012222 talc Nutrition 0.000 claims description 10
- 229910052623 talc Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 6
- 239000005995 Aluminium silicate Substances 0.000 claims description 5
- 229910052656 albite Inorganic materials 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 5
- DLHONNLASJQAHX-UHFFFAOYSA-N aluminum;potassium;oxygen(2-);silicon(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Si+4].[Si+4].[Si+4].[K+] DLHONNLASJQAHX-UHFFFAOYSA-N 0.000 claims description 5
- 229910001570 bauxite Inorganic materials 0.000 claims description 5
- 239000000440 bentonite Substances 0.000 claims description 5
- 229910000278 bentonite Inorganic materials 0.000 claims description 5
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 5
- 238000000748 compression moulding Methods 0.000 claims description 5
- 239000010459 dolomite Substances 0.000 claims description 5
- 229910000514 dolomite Inorganic materials 0.000 claims description 5
- 239000010433 feldspar Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 3
- 239000011591 potassium Substances 0.000 claims description 3
- 229910052700 potassium Inorganic materials 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005201 scrubbing Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000019738 Limestone Nutrition 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000006028 limestone Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 2
- 229910001950 potassium oxide Inorganic materials 0.000 description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 2
- 229910001948 sodium oxide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- Finishing Walls (AREA)
Abstract
本发明涉及陶瓷砖技术领域,公开了一种抛釉洞石陶瓷薄板及其制备方法,包括由内之外的砖坯层、底釉层、图案层和面釉层;所述砖坯层为由粉料通过模具一次性压制成型的砖坯;所述砖坯的表面分布有间距不均、大小不一、深浅不一,并且形状不同的多个凹坑和/或凸块;所述底釉层由涂覆于所述砖坯层的表面的透明釉形成;所述图案层通过喷墨打印形成图案;所述面釉层由喷淋于所述图案层表面的釉料形成;所述凹坑的开口为不带侧边遮挡的敞口,所述凸块裸露于所述砖坯层的表面。凹坑的敞口没有侧边遮挡,凸块裸露于砖坯层的表面,凹坑和/或凸块的表面从内至外依次覆盖有涂覆透明釉、喷墨打印的墨水和釉料,既具有装饰效果,又具有良好的耐擦洗性能。
Description
技术领域
本发明涉及陶瓷砖技术领域,尤其涉及一种抛釉洞石陶瓷薄板及其制备方法。
背景技术
随着生活水平的提高,具有个性化的装饰效果的陶瓷砖受到消费者的追捧。
天然洞石的纹理清晰、温和丰富、疏密有致、凹凸和谐,具有仿佛深藏着史前文明的痕迹的质感,古罗马斗兽场是天然洞石的标志性建筑。天然洞石的颜色丰富,纹理独特,更有特殊的孔洞结构,具有良好的装饰性能。
由于天然洞石的孔洞具有内孔大洞口小的特点,容易藏纳脏污,具有清洁打理不方便的缺陷。
发明内容
针对上述问题,本发明的第一目的在于提出一种抛釉洞石陶瓷薄板,表面分布有凹坑和/或凸块,具有类似天然洞石的装饰效果;凹坑没有侧边遮挡,凸块裸露于砖坯的表面,具有清洁打理更为方便的优点。
本发明的另一目的在于提出一种制备抛釉洞石陶瓷薄板的方法,带有凹坑和/或凸块的砖坯通过一次性的压制成型,具有制备工艺简单,制造成本低的优点。
为达此目的,本发明采用以下技术方案:
一种抛釉洞石陶瓷薄板,包括由内之外的砖坯层、底釉层、图案层和面釉层;
所述砖坯层为由粉料通过模具一次性压制成型的砖坯;所述砖坯的表面分布有间距不均、大小不一、深浅不一,并且形状不同的多个凹坑和/或凸块;
所述底釉层由涂覆于所述砖坯层的表面的透明釉形成;所述图案层通过喷墨打印形成图案;所述面釉层由喷淋于所述图案层表面的釉料形成;
所述凹坑的开口为不带侧边遮挡的敞口,所述凸块裸露于所述砖坯层的表面。
具体的,按照重量百分比计算,所述粉料的原料包括:钾钠长石30-35%、中温钾砂13-16%、膨润土2.5-5%、透灰石4-6%、滑石4-6%、高岭土20-25%、原矿泥4-5%、瓷土8-12%和铝矾土2-4%。
具体的,按照重量百分比计算,所述釉面层含有的面釉的原料包括:钠长石20-33%、钾长石15-25%、石英8-15%、烧土10-15%、白云石2-5%、水洗土5-9%、氧化铝8-12%、硅酸锆6-12%和滑石2-3%。
优选的,所述砖坯的抗折强度≥40MPa。
进一步的,在压制成为砖坯之前,所述粉料的表面还通过布料装置布有化妆土。
进一步的,本发明提出了一种抛釉洞石陶瓷薄板的制备方法,用于制备以上所述的抛釉洞石陶瓷薄板,包括以下步骤:
S1)在粉料的表面布料化妆土,然后将布有化妆土的粉料填充在带有凹坑和/或凸块的模具中,压制成型,制得表面带有凹坑和/或凸块的所述砖坯;
S2)待砖坯的表面干燥后,在砖坯的表面施透明釉,形成底釉层,制得涂覆有透明釉的砖坯;
S3)待所述底釉层的表面干燥后,采用喷墨打印机在所述底釉层的表面打印图案,制得带有图案层的砖坯;
S4)待图案层的表面干燥后,在图案层的表面喷施面釉,形成面釉层;
S5)在面釉的表面喷淋干粒保护釉,然后将喷淋有干粒保护釉的砖坯放入窑中烧制,切边抛光,即制得所述抛釉洞石陶瓷薄板。
进一步的,步骤S4)和S5)之间还包括:步骤S4.1)在所述面釉层的表面喷墨印刷图案,以形成纹理。
优选的,步骤S1)中,压制的压力45000-55000KN。
优选的,步骤S4)中,面釉的釉料比重为1.45-1.62g/cm3,流速为25-40s,面釉的喷釉量为250-400g/m2;
步骤S5)中,烧制温度为1050-1180℃。
本发明的上述技术方案的有益效果为:所述抛釉洞石陶瓷薄板,通过在模具的表面设置凸块和/或凹坑,使得压制成型的砖坯表面分布有对应的凹坑和/或凸块,形成具有起伏面的洞石陶瓷薄板,从而获得类似天然洞石表面的波浪起伏面的装饰效果;凹坑的敞口没有侧边遮挡,凸块裸露于砖坯层的表面,可以通过冲洗或擦拭清除藏纳在凹坑或凸块表面的脏污,具有清洁打理更为方便的优点,凹坑和/或凸块的表面从内至外依次覆盖有涂覆透明釉、喷墨打印的墨水和釉料,既具有装饰效果,又具有良好的耐擦洗性能。
进一步的,本发明提出了制备抛釉洞石陶瓷薄板的方法,带有凹坑和/或凸块的砖坯通过一次性的压制成型,具有制备工艺简单,制造成本低的优点。
附图说明
图1为本发明的一个实施例的抛釉洞石陶瓷薄板的实物照片;
图2为本发明的另一个实施例的抛釉洞石陶瓷薄板的实物照片。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。
在本说明书的描述中,参考术语“实施例”、“示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例,本领域的普通技术人员可以理解:在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由权利要求及其等同物限定。
一种抛釉洞石陶瓷薄板,包括由内之外的砖坯层、底釉层、图案层和面釉层;
所述砖坯层为由粉料通过模具一次性压制成型的砖坯;所述砖坯的表面分布有间距不均、大小不一、深浅不一,并且形状不同的多个凹坑和/或凸块;
所述底釉层由涂覆于所述砖坯层的表面的透明釉形成;所述图案层通过喷墨打印形成图案;所述面釉层由喷淋于所述图案层表面的釉料形成;
所述凹坑的开口为不带侧边遮挡的敞口,所述凸块裸露于所述砖坯层的表面。
本发明的所述抛釉洞石陶瓷薄板,通过在模具的表面设置凸块和/或凹坑,使得压制成型的砖坯表面分布有对应的凹坑和/或凸块,形成具有起伏面的洞石陶瓷薄板,从而获得类似天然洞石表面的波浪起伏面的装饰效果;凹坑的敞口没有侧边遮挡,凸块裸露于砖坯层的表面,可以通过冲洗或擦拭清除藏纳在凹坑或凸块表面的脏污,具有清洁打理更为方便的优点,凹坑和/或凸块的表面从内至外依次覆盖有涂覆透明釉、喷墨打印的墨水和釉料,既具有装饰效果,又具有良好的耐擦洗性能。
具体的,按照重量百分比计算,所述粉料的原料包括:钾钠长石30-35%、中温钾砂13-16%、膨润土2.5-5%、透灰石4-6%、滑石4-6%、高岭土20-25%、原矿泥4-5%、瓷土8-12%和铝矾土2-4%;
使以上的粉料的化学成分构成为:二氧化硅60-75wt%、氧化铝15-20wt%、氧化钾1.5-5.0wt%、氧化钠1.5-5.0wt%、氧化钙0.2-2.0wt%、氧化镁0.2-2.0wt%、氧化铁0.1-1.5wt%和氧化钛0.01-0.1wt%,其中的二氧化硅的含量较高,可确保砖坯的强度满足质量要求。
具体的,按照重量百分比计算,所述釉面层含有的面釉的原料包括:钠长石20-33%、钾长石15-25%、石英8-15%、烧土10-15%、白云石2-5%、水洗土5-9%、氧化铝8-12%、硅酸锆6-12%和滑石2-3%。
以上的面釉的化学成分为:二氧化硅35-45wt%、氧化铝20-35wt%、氧化钾5-10wt%、氧化钠5-10wt%、氧化钙0.2-1.5wt%、氧化镁0.2-1.5wt%、氧化钡0.2-1.5wt%、氧化锌0.2-1.5wt%和氧化锆0.4-4.0wt%;面釉含有35-45wt%的二氧化硅成分,高温熔融时具有较好的黏度,使面釉可以保持一定的厚度,因此面釉具有较好的遮盖力和耐磨性。
优选的,所述砖坯的抗折强度≥40MPa。
使所述抛釉洞石陶瓷薄板保持有较高的抗折强度,即使带有凹坑的厚度较薄的部位也不容易发生折断的不良现象。
进一步的,在压制成为砖坯之前,所述粉料的表面还通过布料装置布有化妆土。
常用的化妆土有白色或灰色,具体还可根据客户或产品设计的要求通过添加色粉调整化妆土的颜色。
进一步的,本发明提出了一种抛釉洞石陶瓷薄板的制备方法,用于制备以上所述的抛釉洞石陶瓷薄板,包括以下步骤:
S1)在粉料的表面布料化妆土,然后将布有化妆土的粉料填充在带有凹坑和/或凸块的模具中,压制成型,制得表面带有凹坑和/或凸块的所述砖坯;
S2)待砖坯的表面干燥后,在砖坯的表面施透明釉,形成底釉层,制得涂覆有透明釉的砖坯;
S3)待所述底釉层的表面干燥后,采用喷墨打印机在所述底釉层的表面打印图案,制得带有图案层的砖坯;
S4)待图案层的表面干燥后,在图案层的表面喷施面釉,形成面釉层;
S5)在面釉的表面喷淋干粒保护釉,然后将喷淋有干粒保护釉的砖坯放入窑中烧制,切边抛光,即制得所述抛釉洞石陶瓷薄板。
所述抛釉洞石陶瓷薄板的制备方法,带有凹坑和/或凸块的砖坯通过一次性的压制成型,具有制备工艺简单,制造成本低的优点。
步骤S1)中,化妆土为白色或灰色,具体颜色可根据需要选择,图1为实施例1的抛釉洞石陶瓷薄板的实物照片。
步骤S4)中,喷淋干粒保护釉的作用在于防滑,并在烧制后通过抛光获得所需的手感,使所述抛釉洞石陶瓷薄板具有更好的触摸质感。
进一步的,步骤S4)和S5)之间还包括:步骤S4.1)在所述面釉层的表面喷墨印刷图案,以形成纹理。
还可以根据客户或设计的需要在面釉的表面上喷墨,以获得需要的纹理图案,喷墨的墨水中可以增加一些色料,如坯体黑(钴铁系)、纯黄(钛锆系)或橘红等。
优选的,步骤S1)中,压制的压力45000-55000KN。
在45000-55000KN的压力的压制成型的砖坯的强度不低于40MPa。
优选的,步骤S4)中,面釉的釉料比重为1.45-1.62g/cm3,流速为25-40s,面釉的喷釉量为250-400g/m2;
步骤S5)中,烧制温度为1050-1180℃。
面釉的釉料满足以上的工艺参数,具有较适合的流动性,可提高釉料喷施的工作效率。
实施例1和2
1.采用模具一,按照以下步骤制备实施例1的抛釉洞石陶瓷薄板:
S1)在粉料的表面布料化妆土,然后将布有化妆土的粉料填充在带有凹坑或者凸块的模具中,压制成型,制得表面带有凹坑或者凸块的的砖坯;
S2)待砖坯的表面干燥后,在砖坯的表面透明釉,制得涂覆有底釉的砖坯;
S3)待底釉的表面干燥后,采用喷墨打印机在底釉的表面打印图案,制得带有图案层的砖坯;
S4)待图案层的表面干燥后,在图案层的表面喷施面釉;
S5)在面釉的表面喷淋干粒保护釉,然后将喷淋有干粒保护釉的砖坯放入窑中烧制,切边抛光,即制得所述抛釉洞石陶瓷薄板。
2.步骤S1)中,压制的压力45000-47000KN;步骤S4)中,面釉的釉料比重为1.45-1.62g/cm3,流速为25-40s,面釉的喷釉量为250-400g/m2;步骤S5)中,烧制温度为1050-1180℃。
3.步骤S1)中的粉料的原材料的组成为:钾钠长石32%、中温钾砂14.8%、膨润土3.2%、透灰石4%、滑石4.5%、高岭土24%、原矿泥5%、瓷土9.5%和铝矾土3%;
步骤S4)的面釉的原材料的组成为:钠长石22.5%、钾长石20%、石英10.5%、烧土12%、白云石3.5%、水洗土9%、氧化铝9%、硅酸锆11%和滑石2.5%。
制得的表面带有凹坑的实施例1的抛釉洞石陶瓷薄板的实物照片如图1所示。
实施例2
1.采用模具二,按照以上步骤制备实施例2的抛釉洞石陶瓷薄板:
S1)在粉料的表面布料化妆土,然后将布有化妆土的粉料填充在带有凹坑或者凸块的模具中,压制成型,制得表面带有凹坑或者凸块的的砖坯;
S2)待砖坯的表面干燥后,在砖坯的表面透明釉,制得涂覆有底釉的砖坯;
S3)待底釉的表面干燥后,采用喷墨打印机在底釉的表面打印图案,制得带有图案层的砖坯;
S4)待图案层的表面干燥后,在图案层的表面喷施面釉;
S4.1)在面釉的表面喷墨印刷图案,以形成纹理;
S5)在面釉的表面喷淋干粒保护釉,然后将喷淋有干粒保护釉的砖坯放入窑中烧制,切边抛光,即制得所述抛釉洞石陶瓷薄板。
2.步骤S1)中,压制的压力47000-49000KN;步骤S4)中,面釉的釉料比重为1.45-1.62g/cm3,流速为25-40s,面釉的喷釉量为250-400g/m2;步骤S5)中,烧制温度为1050-1180℃。
3.步骤S1)中的粉料的原材料的组成为:钾钠长石34.5%、中温钾砂13.5%、膨润土3%、透灰石5%、滑石5%、高岭土20.5%、原矿泥4.5%、瓷土11%和铝矾土3%;
步骤S4)的面釉的料的原材料的组成为:钠长石31%、钾长石21%、石英11%、烧土10%、白云石3%、水洗土6%、氧化铝9%、硅酸锆7%和滑石2%。
制得的表面带有凸起的实施例2的抛釉洞石陶瓷薄板的实物照片如图2所示。
综上所述,所述抛釉洞石陶瓷薄板,通过在模具的表面设置凸块和/或凹坑,使得压制成型的砖坯表面分布有对应的凹坑和/或凸块,形成具有起伏面的洞石陶瓷薄板,从而获得类似天然洞石表面的波浪起伏面的装饰效果;凹坑的敞口没有侧边遮挡,凸块裸露于砖坯层的表面,可以通过冲洗或擦拭清除藏纳在凹坑或凸块表面的脏污,具有清洁打理更为方便的优点,凹坑和/或凸块的表面从内至外依次覆盖有涂覆透明釉、喷墨打印的图案和釉料,既具有装饰效果,又具有良好的耐擦洗性能。
进一步的,本发明提出了制备抛釉洞石陶瓷薄板的方法,带有凹坑和/或凸块的砖坯通过一次性的压制成型,具有制备工艺简单,制造成本低的优点。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理,而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释,本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式,这些方式都将落入本发明的保护范围之内。
Claims (9)
1.一种抛釉洞石陶瓷薄板,其特征在于,包括由内之外的砖坯层、底釉层、图案层和面釉层;
所述砖坯层为由粉料通过模具一次性压制成型的砖坯;所述砖坯的表面分布有间距不均、大小不一、深浅不一,并且形状不同的多个凹坑和/或凸块;
所述底釉层由涂覆于所述砖坯层的表面的透明釉形成;所述图案层通过喷墨打印形成图案;所述面釉层由喷淋于所述图案层表面的釉料形成;
所述凹坑的开口为不带侧边遮挡的敞口,所述凸块裸露于所述砖坯层的表面。
2.根据权利要求1所述的抛釉洞石陶瓷薄板,其特征在于,按照重量百分比计算,所述粉料的原料包括:钾钠长石30-35%、中温钾砂13-16%、膨润土2.5-5%、透灰石4-6%、滑石4-6%、高岭土20-25%、原矿泥4-5%、瓷土8-12%和铝矾土2-4%。
3.根据权利要求1所述的抛釉洞石陶瓷薄板,其特征在于,按照重量百分比计算,所述釉面层含有的面釉的原料包括:钠长石20-33%、钾长石15-25%、石英8-15%、烧土10-15%、白云石2-5%、水洗土5-9%、氧化铝8-12%、硅酸锆6-12%和滑石2-3%。
4.根据权利要求1所述的抛釉洞石陶瓷薄板,其特征在于,所述砖坯的抗折强度≥40MPa。
5.根据权利要求1所述的抛釉洞石陶瓷薄板,其特征在于,在压制成为砖坯之前,所述粉料的表面还通过布料装置布有化妆土。
6.一种抛釉洞石陶瓷薄板的制备方法,其特征在于,用于制备权利要求1-5任一项所述的抛釉洞石陶瓷薄板,包括以下步骤:
S1)在粉料的表面布料化妆土,然后将布有化妆土的粉料填充在带有凹坑和/或凸块的模具中,压制成型,制得表面带有凹坑和/或凸块的所述砖坯;
S2)待砖坯的表面干燥后,在砖坯的表面施透明釉,形成底釉层,制得涂覆有透明釉的砖坯;
S3)待所述底釉层的表面干燥后,采用喷墨打印机在所述底釉层的表面打印图案,制得带有图案层的砖坯;
S4)待图案层的表面干燥后,在图案层的表面喷施面釉,形成面釉层;
S5)在面釉的表面喷淋干粒保护釉,然后将喷淋有干粒保护釉的砖坯放入窑中烧制,切边抛光,即制得所述抛釉洞石陶瓷薄板。
7.根据权利要求6的所述的抛釉洞石陶瓷薄板,其特征在于,步骤S4)和S5)之间还包括:步骤S4.1)在所述面釉层的表面喷墨印刷图案,以形成纹理。
8.根据权利要求6的所述的抛釉洞石陶瓷薄板,其特征在于,步骤S1)中,压制的压力45000-55000KN。
9.根据权利要求6的所述的抛釉洞石陶瓷薄板,其特征在于,步骤S4)中,面釉的釉料比重为1.45-1.62g/cm3,流速为25-40s,面釉的喷釉量为250-400g/m2;
步骤S5)中,烧制温度为1050-1180℃。
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