CN115884996A - 膜 - Google Patents

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Publication number
CN115884996A
CN115884996A CN202180050813.XA CN202180050813A CN115884996A CN 115884996 A CN115884996 A CN 115884996A CN 202180050813 A CN202180050813 A CN 202180050813A CN 115884996 A CN115884996 A CN 115884996A
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China
Prior art keywords
film
group
polymer
solvent
less
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CN202180050813.XA
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English (en)
Chinese (zh)
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CN115884996B (zh
Inventor
小沼勇辅
西冈宏司
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Publication of CN115884996A publication Critical patent/CN115884996A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • C08F32/08—Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having two condensed rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/205—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase
    • C08J3/21—Compounding polymers with additives, e.g. colouring in the presence of a continuous liquid phase the polymer being premixed with a liquid phase
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202180050813.XA 2020-08-31 2021-08-31 膜 Active CN115884996B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2020146414 2020-08-31
JP2020146415 2020-08-31
JP2020-146414 2020-08-31
JP2020146413 2020-08-31
JP2020-146415 2020-08-31
JP2020-146413 2020-08-31
JP2020-196125 2020-11-26
JP2020196125 2020-11-26
PCT/JP2021/031950 WO2022045359A1 (ja) 2020-08-31 2021-08-31 フィルム

Publications (2)

Publication Number Publication Date
CN115884996A true CN115884996A (zh) 2023-03-31
CN115884996B CN115884996B (zh) 2024-08-23

Family

ID=80353556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180050813.XA Active CN115884996B (zh) 2020-08-31 2021-08-31 膜

Country Status (5)

Country Link
JP (1) JP2022041944A (ko)
KR (1) KR20230059170A (ko)
CN (1) CN115884996B (ko)
TW (1) TW202219176A (ko)
WO (1) WO2022045359A1 (ko)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10259212A (ja) * 1997-01-14 1998-09-29 Sumitomo Chem Co Ltd オレフィン（共）重合体の製造方法
JPH10279630A (ja) * 1997-04-04 1998-10-20 Sumitomo Chem Co Ltd オレフィン系重合体の製造方法
JP2004359931A (ja) * 2002-12-27 2004-12-24 Ist:Kk ポリイミド前駆体液組成物及びポリイミド被膜
JP2008248067A (ja) * 2007-03-30 2008-10-16 Du Pont Toray Co Ltd ポリイミドフィルムおよびフレキシブル回路基板
JP2010195891A (ja) * 2009-02-24 2010-09-09 Sanyo Chem Ind Ltd 多層構造球状粒子
JP2012185393A (ja) * 2011-03-07 2012-09-27 Fuji Xerox Co Ltd 円筒状成形体及びその製造方法、円筒状成形体ユニット、画像形成装置用部材、並びに画像形成装置
EP2551865A2 (en) * 2011-07-29 2013-01-30 Konica Minolta Business Technologies, Inc. Photoelectric conversion element and solar cell
JP2013018962A (ja) * 2011-06-13 2013-01-31 Polyplastics Co 環状オレフィン系樹脂
JP2013031964A (ja) * 2011-08-02 2013-02-14 Nitto Denko Corp 樹脂部材の接合方法
JP2016183333A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 樹脂粒子分散ポリイミド前駆体溶液の製造方法、樹脂粒子分散ポリイミド前駆体溶液、樹脂粒子含有ポリイミドフィルム、多孔質ポリイミドフィルムの製造方法、及び多孔質ポリイミドフィルム
JP2017125175A (ja) * 2016-08-31 2017-07-20 三井化学株式会社 硬化性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP2018185471A (ja) * 2017-04-27 2018-11-22 キヤノン株式会社 トナー
JP2020111713A (ja) * 2019-01-16 2020-07-27 旭化成株式会社 ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498750B2 (ja) * 1992-11-20 2004-02-16 日本ゼオン株式会社 熱硬化性樹脂成形材料、成形品、及び熱可塑性ノルボルネン系樹脂粒子
JP3499974B2 (ja) * 1995-06-07 2004-02-23 富士写真フイルム株式会社 偏光膜保護フイルム
TWI354807B (en) * 2007-06-12 2011-12-21 Eternal Chemical Co Ltd Optical film
JP5985940B2 (ja) * 2012-09-18 2016-09-06 東レ・デュポン株式会社 タブレット端末向けｃｏｆ用基板
JP6404028B2 (ja) * 2013-08-08 2018-10-10 東京応化工業株式会社 多孔質ポリイミド膜の製造方法、セパレータの製造方法、及びワニス
JP6899636B2 (ja) 2016-08-31 2021-07-07 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP7439534B2 (ja) * 2020-01-28 2024-02-28 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体溶液及び多孔質ポリイミドフィルムの製造方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10259212A (ja) * 1997-01-14 1998-09-29 Sumitomo Chem Co Ltd オレフィン（共）重合体の製造方法
JPH10279630A (ja) * 1997-04-04 1998-10-20 Sumitomo Chem Co Ltd オレフィン系重合体の製造方法
JP2004359931A (ja) * 2002-12-27 2004-12-24 Ist:Kk ポリイミド前駆体液組成物及びポリイミド被膜
JP2008248067A (ja) * 2007-03-30 2008-10-16 Du Pont Toray Co Ltd ポリイミドフィルムおよびフレキシブル回路基板
JP2010195891A (ja) * 2009-02-24 2010-09-09 Sanyo Chem Ind Ltd 多層構造球状粒子
JP2012185393A (ja) * 2011-03-07 2012-09-27 Fuji Xerox Co Ltd 円筒状成形体及びその製造方法、円筒状成形体ユニット、画像形成装置用部材、並びに画像形成装置
JP2013018962A (ja) * 2011-06-13 2013-01-31 Polyplastics Co 環状オレフィン系樹脂
EP2551865A2 (en) * 2011-07-29 2013-01-30 Konica Minolta Business Technologies, Inc. Photoelectric conversion element and solar cell
JP2013031964A (ja) * 2011-08-02 2013-02-14 Nitto Denko Corp 樹脂部材の接合方法
JP2016183333A (ja) * 2015-03-26 2016-10-20 富士ゼロックス株式会社 樹脂粒子分散ポリイミド前駆体溶液の製造方法、樹脂粒子分散ポリイミド前駆体溶液、樹脂粒子含有ポリイミドフィルム、多孔質ポリイミドフィルムの製造方法、及び多孔質ポリイミドフィルム
JP2017125175A (ja) * 2016-08-31 2017-07-20 三井化学株式会社 硬化性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP2018185471A (ja) * 2017-04-27 2018-11-22 キヤノン株式会社 トナー
JP2020111713A (ja) * 2019-01-16 2020-07-27 旭化成株式会社 ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SHEN, JL: "Light Scattering in Nanoparticle Doped Transparent Polyimide Substrates", ACS APPLIED MATERIALS & INTERFACES, vol. 9, no. 17, 31 December 2017 (2017-12-31), pages 14990 - 14997 *
赵婧;: "溶液缩聚法含氟化聚酰亚胺的制备及薄膜性能研究(下)", 橡塑技术与装备, no. 06, 15 March 2020 (2020-03-15), pages 16 - 21 *

Also Published As

Publication number Publication date
WO2022045359A1 (ja) 2022-03-03
TW202219176A (zh) 2022-05-16
JP2022041944A (ja) 2022-03-11
CN115884996B (zh) 2024-08-23
KR20230059170A (ko) 2023-05-03

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