CN115835956A - 层叠板、印刷电路板、半导体封装及层叠板的制造方法 - Google Patents

层叠板、印刷电路板、半导体封装及层叠板的制造方法 Download PDF

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Publication number
CN115835956A
CN115835956A CN202180042350.2A CN202180042350A CN115835956A CN 115835956 A CN115835956 A CN 115835956A CN 202180042350 A CN202180042350 A CN 202180042350A CN 115835956 A CN115835956 A CN 115835956A
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CN
China
Prior art keywords
layers
laminate
composite
glass fiber
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180042350.2A
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English (en)
Chinese (zh)
Inventor
村上德昭
岛冈伸治
藤田广明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of CN115835956A publication Critical patent/CN115835956A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
CN202180042350.2A 2020-06-17 2021-06-16 层叠板、印刷电路板、半导体封装及层叠板的制造方法 Pending CN115835956A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (1)

Publication Number Publication Date
CN115835956A true CN115835956A (zh) 2023-03-21

Family

ID=79268020

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042350.2A Pending CN115835956A (zh) 2020-06-17 2021-06-16 层叠板、印刷电路板、半导体封装及层叠板的制造方法

Country Status (5)

Country Link
JP (2) JP7136389B2 (ko)
KR (1) KR20230025395A (ko)
CN (1) CN115835956A (ko)
TW (1) TW202212119A (ko)
WO (1) WO2021256516A1 (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体
JP2018130938A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
CN113195219A (zh) * 2018-12-18 2021-07-30 昭和电工材料株式会社 层叠板、印刷线路板、半导体封装体及层叠板的制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP5223973B1 (ja) * 2012-01-06 2013-06-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 積層板
WO2015079820A1 (ja) * 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物－樹脂組成物積層体
JP2018130938A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
CN113195219A (zh) * 2018-12-18 2021-07-30 昭和电工材料株式会社 层叠板、印刷线路板、半导体封装体及层叠板的制造方法

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Publication number Publication date
JP2022171670A (ja) 2022-11-11
JP7136389B2 (ja) 2022-09-13
JPWO2021256516A1 (ko) 2021-12-23
TW202212119A (zh) 2022-04-01
KR20230025395A (ko) 2023-02-21
WO2021256516A1 (ja) 2021-12-23

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Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.