JP7136389B2 - 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 - Google Patents

積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 Download PDF

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Publication number
JP7136389B2
JP7136389B2 JP2022523252A JP2022523252A JP7136389B2 JP 7136389 B2 JP7136389 B2 JP 7136389B2 JP 2022523252 A JP2022523252 A JP 2022523252A JP 2022523252 A JP2022523252 A JP 2022523252A JP 7136389 B2 JP7136389 B2 JP 7136389B2
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JP
Japan
Prior art keywords
laminate
composite layer
layers
glass
glass fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022523252A
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English (en)
Japanese (ja)
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JPWO2021256516A1 (ko
Inventor
徳昭 村上
伸治 島岡
広明 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021256516A1 publication Critical patent/JPWO2021256516A1/ja
Priority to JP2022130410A priority Critical patent/JP2022171670A/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/08Impregnating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/14Semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP2022523252A 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法 Active JP7136389B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022130410A JP2022171670A (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Related Child Applications (1)

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JP2022130410A Division JP2022171670A (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Publications (2)

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JPWO2021256516A1 JPWO2021256516A1 (ko) 2021-12-23
JP7136389B2 true JP7136389B2 (ja) 2022-09-13

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JP2022523252A Active JP7136389B2 (ja) 2020-06-17 2021-06-16 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法
JP2022130410A Pending JP2022171670A (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

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JP2022130410A Pending JP2022171670A (ja) 2020-06-17 2022-08-18 積層板、プリント配線板、半導体パッケージ及び積層板の製造方法

Country Status (5)

Country Link
JP (2) JP7136389B2 (ko)
KR (1) KR20230025395A (ko)
CN (1) CN115835956A (ko)
TW (1) TW202212119A (ko)
WO (1) WO2021256516A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140907A (ja) 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) 2013-10-11 2015-04-20 パナソニックIpマネジメント株式会社 積層板
WO2015079820A1 (ja) 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物-樹脂組成物積層体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (ja) 1991-11-26 1998-04-15 株式会社日立製作所 低熱膨張性加圧成形用樹脂組成物
JPH05261861A (ja) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd 積層板
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
JP6844298B2 (ja) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
KR20210104695A (ko) * 2018-12-18 2021-08-25 쇼와덴코머티리얼즈가부시끼가이샤 적층판, 프린트 배선판, 반도체 패키지 및 적층판의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140907A (ja) 2012-01-06 2013-07-18 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2015076589A (ja) 2013-10-11 2015-04-20 パナソニックIpマネジメント株式会社 積層板
WO2015079820A1 (ja) 2013-11-29 2015-06-04 日東紡績株式会社 ガラス繊維織物-樹脂組成物積層体

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
南条尚志,日本複合材料学会誌,2007年,Vol.33, No.4,p.141-149

Also Published As

Publication number Publication date
CN115835956A (zh) 2023-03-21
JP2022171670A (ja) 2022-11-11
JPWO2021256516A1 (ko) 2021-12-23
TW202212119A (zh) 2022-04-01
KR20230025395A (ko) 2023-02-21
WO2021256516A1 (ja) 2021-12-23

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