CN115702489B - 用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法 - Google Patents

用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法

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Publication number
CN115702489B
CN115702489B CN202180042399.8A CN202180042399A CN115702489B CN 115702489 B CN115702489 B CN 115702489B CN 202180042399 A CN202180042399 A CN 202180042399A CN 115702489 B CN115702489 B CN 115702489B
Authority
CN
China
Prior art keywords
oven
workpiece
plate
grains
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180042399.8A
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English (en)
Chinese (zh)
Other versions
CN115702489A (zh
Inventor
C·B·卢钦格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Publication of CN115702489A publication Critical patent/CN115702489A/zh
Application granted granted Critical
Publication of CN115702489B publication Critical patent/CN115702489B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN202180042399.8A 2020-06-18 2021-06-16 用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法 Active CN115702489B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063040576P 2020-06-18 2020-06-18
US63/040,576 2020-06-18
PCT/US2021/037705 WO2021257748A1 (en) 2020-06-18 2021-06-16 Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods

Publications (2)

Publication Number Publication Date
CN115702489A CN115702489A (zh) 2023-02-14
CN115702489B true CN115702489B (zh) 2026-01-13

Family

ID=79022925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180042399.8A Active CN115702489B (zh) 2020-06-18 2021-06-16 用于如晶粒附接系统、覆晶接合系统、及片夹附接系统之设备的烤箱及相关方法

Country Status (5)

Country Link
US (1) US11465224B2 (https=)
JP (1) JP7688663B2 (https=)
CN (1) CN115702489B (https=)
TW (1) TWI861412B (https=)
WO (1) WO2021257748A1 (https=)

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CN107112247A (zh) * 2014-12-26 2017-08-29 富士电机株式会社 加热冷却设备
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法

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US2375771A (en) * 1941-12-24 1945-05-15 Ferro Enamel Corp Furnace
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US6336980B1 (en) * 1999-05-21 2002-01-08 Danieli Technology, Inc. Method for in-line heat treatment of hot rolled stock
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TW200729361A (en) * 2006-01-16 2007-08-01 Advanced Semiconductor Eng Package structure and method for fabricating the same
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08191059A (ja) * 1995-01-09 1996-07-23 Hitachi Ltd プラズマ処理装置
CN107112247A (zh) * 2014-12-26 2017-08-29 富士电机株式会社 加热冷却设备
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法

Also Published As

Publication number Publication date
JP2023530706A (ja) 2023-07-19
JP7688663B2 (ja) 2025-06-04
CN115702489A (zh) 2023-02-14
US20210394292A1 (en) 2021-12-23
TWI861412B (zh) 2024-11-11
WO2021257748A1 (en) 2021-12-23
US11465224B2 (en) 2022-10-11
TW202201605A (zh) 2022-01-01

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