TWI861412B - 用於如晶粒附接系統、覆晶接合系統、及片夾附接系統之設備的烤箱及相關方法 - Google Patents

用於如晶粒附接系統、覆晶接合系統、及片夾附接系統之設備的烤箱及相關方法 Download PDF

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Publication number
TWI861412B
TWI861412B TW110122176A TW110122176A TWI861412B TW I861412 B TWI861412 B TW I861412B TW 110122176 A TW110122176 A TW 110122176A TW 110122176 A TW110122176 A TW 110122176A TW I861412 B TWI861412 B TW I861412B
Authority
TW
Taiwan
Prior art keywords
oven
workpiece
die
plate
chamber
Prior art date
Application number
TW110122176A
Other languages
English (en)
Chinese (zh)
Other versions
TW202201605A (zh
Inventor
克里斯托 本諾 盧辛格
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202201605A publication Critical patent/TW202201605A/zh
Application granted granted Critical
Publication of TWI861412B publication Critical patent/TWI861412B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
TW110122176A 2020-06-18 2021-06-17 用於如晶粒附接系統、覆晶接合系統、及片夾附接系統之設備的烤箱及相關方法 TWI861412B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063040576P 2020-06-18 2020-06-18
US63/040,576 2020-06-18

Publications (2)

Publication Number Publication Date
TW202201605A TW202201605A (zh) 2022-01-01
TWI861412B true TWI861412B (zh) 2024-11-11

Family

ID=79022925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110122176A TWI861412B (zh) 2020-06-18 2021-06-17 用於如晶粒附接系統、覆晶接合系統、及片夾附接系統之設備的烤箱及相關方法

Country Status (5)

Country Link
US (1) US11465224B2 (https=)
JP (1) JP7688663B2 (https=)
CN (1) CN115702489B (https=)
TW (1) TWI861412B (https=)
WO (1) WO2021257748A1 (https=)

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US20120285295A1 (en) * 2004-12-07 2012-11-15 Nu-Iron Technology, Llc Method for producing metallic iron nuggets

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US20060006210A1 (en) * 2002-07-31 2006-01-12 Matsushita Electric Industrial Co., Ltd. Method, apparatus and program of thermal analysis, heat controller and heating furnace using the same
US20120285295A1 (en) * 2004-12-07 2012-11-15 Nu-Iron Technology, Llc Method for producing metallic iron nuggets

Also Published As

Publication number Publication date
JP2023530706A (ja) 2023-07-19
JP7688663B2 (ja) 2025-06-04
CN115702489B (zh) 2026-01-13
CN115702489A (zh) 2023-02-14
US20210394292A1 (en) 2021-12-23
WO2021257748A1 (en) 2021-12-23
US11465224B2 (en) 2022-10-11
TW202201605A (zh) 2022-01-01

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