JP7688663B2 - ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 - Google Patents

ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 Download PDF

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JP7688663B2
JP7688663B2 JP2022577443A JP2022577443A JP7688663B2 JP 7688663 B2 JP7688663 B2 JP 7688663B2 JP 2022577443 A JP2022577443 A JP 2022577443A JP 2022577443 A JP2022577443 A JP 2022577443A JP 7688663 B2 JP7688663 B2 JP 7688663B2
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Prior art keywords
oven
workpiece
die
grooves
plate
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Japanese (ja)
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JP2023530706A (ja
JPWO2021257748A5 (https=
JP2023530706A5 (https=
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ルチンガー、クリストフ、ベンノ
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クリック アンド ソッファ インダストリーズ、インク．
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2022577443A 2020-06-18 2021-06-16 ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法 Active JP7688663B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063040576P 2020-06-18 2020-06-18
US63/040,576 2020-06-18
PCT/US2021/037705 WO2021257748A1 (en) 2020-06-18 2021-06-16 Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods

Publications (4)

Publication Number Publication Date
JP2023530706A JP2023530706A (ja) 2023-07-19
JPWO2021257748A5 JPWO2021257748A5 (https=) 2024-06-24
JP2023530706A5 JP2023530706A5 (https=) 2024-06-24
JP7688663B2 true JP7688663B2 (ja) 2025-06-04

Family

ID=79022925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022577443A Active JP7688663B2 (ja) 2020-06-18 2021-06-16 ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法

Country Status (5)

Country Link
US (1) US11465224B2 (https=)
JP (1) JP7688663B2 (https=)
CN (1) CN115702489B (https=)
TW (1) TWI861412B (https=)
WO (1) WO2021257748A1 (https=)

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JP2010161207A (ja) 2009-01-08 2010-07-22 Toyota Industries Corp 半田付け方法および半田付け装置
JP2011245527A (ja) 2010-05-28 2011-12-08 Yokota Technica:Kk 処理装置
WO2015097796A1 (ja) 2013-12-25 2015-07-02 千住金属工業株式会社 真空はんだ処理装置及びその制御方法

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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050186019A1 (en) 2004-02-23 2005-08-25 Asm Assembly Automation Ltd. Apparatus and method for die attachment
JP2005244228A (ja) 2004-02-23 2005-09-08 Asm Assembly Automation Ltd ダイ取付け装置および方法
JP2010161207A (ja) 2009-01-08 2010-07-22 Toyota Industries Corp 半田付け方法および半田付け装置
JP2011245527A (ja) 2010-05-28 2011-12-08 Yokota Technica:Kk 処理装置
WO2015097796A1 (ja) 2013-12-25 2015-07-02 千住金属工業株式会社 真空はんだ処理装置及びその制御方法

Also Published As

Publication number Publication date
JP2023530706A (ja) 2023-07-19
CN115702489B (zh) 2026-01-13
CN115702489A (zh) 2023-02-14
US20210394292A1 (en) 2021-12-23
TWI861412B (zh) 2024-11-11
WO2021257748A1 (en) 2021-12-23
US11465224B2 (en) 2022-10-11
TW202201605A (zh) 2022-01-01

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