JP2005244228A - ダイ取付け装置および方法 - Google Patents
ダイ取付け装置および方法 Download PDFInfo
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- JP2005244228A JP2005244228A JP2005046080A JP2005046080A JP2005244228A JP 2005244228 A JP2005244228 A JP 2005244228A JP 2005046080 A JP2005046080 A JP 2005046080A JP 2005046080 A JP2005046080 A JP 2005046080A JP 2005244228 A JP2005244228 A JP 2005244228A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 91
- 239000007769 metal material Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 42
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- 230000005496 eutectics Effects 0.000 claims abstract description 38
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- 238000000576 coating method Methods 0.000 claims abstract description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract 3
- 239000002184 metal Substances 0.000 claims description 38
- 230000009477 glass transition Effects 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 229920000307 polymer substrate Polymers 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 18
- 239000011521 glass Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 239000006023 eutectic alloy Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
【解決手段】非金属材と、共晶コーティングを有するダイ10を受けるよう構成された金属材とを含む基板上13へのダイの取付け用装置を提供する。ダイ取付けポジションにおけるダイと金属材との間の接合を容易にするべく共晶接合温度まで金属材を加熱するためにそれを通って基板が移動できる加熱管路22が設けられる。誘導加熱デバイス34はダイ取付けポジションにおいて基板の金属材を、ダイの金属材上への取付けに先立って共晶接合温度まで加熱する。
【選択図】図5
Description
11 はんだ
12 リードフレームキャリア
13 金属部
14 プラスチックハウジング
16 高分子基板
18 金属リードフレーム
20 プラスチック細片
22 ヒートトンネル
24 上面カバー
26 上部ホットプレート
27 ホットプレート
28 下部ホットプレート
30 加熱ブロック
32 埋込み型加熱要素
34 誘導コイル
36 セラミックプレート
Claims (17)
- 非金属材と、共晶コーティングを有するダイを受けるよう構成された金属材とを具備する基板上へのダイ取付けのための装置であって、
ダイ取付けポジションにおいて前記ダイと前記金属材との間の接合を容易にするべく共晶接合温度まで前記金属材を加熱するために、それを通って前記基板が移動可能である加熱管路と、
前記ダイ取付けポジションにおいて前記共晶接合温度まで前記金属材を加熱するための誘導加熱デバイスと、を具備してなることを特徴とするダイ取付け装置。 - 前記ダイ取付けポジションに前記基板用の非金属支持面を備えることを特徴とする請求項1に記載の装置。
- 前記非金属支持面はセラミック材からなることを特徴とする請求項2に記載の装置。
- 前記誘導加熱デバイスは、単巻線または多重巻線を備えた金属コイルからなる誘導コイルを具備してなることを特徴とする請求項1に記載の装置。
- 前記誘導加熱デバイスの出力は10キロワット以下であることを特徴とする請求項1に記載の装置。
- 前記誘導加熱デバイスは10メガヘルツ以下の周波数で作動させられることを特徴とする請求項1に記載の装置。
- 誘導加熱が生じる前記ダイ取付けポジションの外側に配置された一つ以上の誘導加熱デバイスを具備してなることを特徴とする請求項1に記載の装置。
- 非金属材と、ダイを受けるよう構成された金属材とを具備する基板への、共晶コーティングを有するダイの取付けのための方法であって、
加熱管路を設けるステップと、
前記加熱管路を通って前記基板を移動させる間に、ダイ取付けポジションにおいて前記ダイと前記金属材との間の接合を容易にするため、前記加熱管路内で共晶接合温度まで前記金属材を加熱するステップと、
前記ダイ取付けポジションにおいて前記共晶接合温度まで誘導加熱手段によって前記金属材を加熱するステップと、
前記ダイ取付けポジションにおいて前記金属材にダイを取り付けるステップと、を具備することを特徴とするダイ取付け方法。 - 前記ダイ取付けポジションでの誘導加熱に先立って、前記非金属材のガラス転移温度以下に前記金属材の温度を維持するステップを具備することを特徴とする請求項8に記載の方法。
- 前記ダイを前記金属材に接合するために十分な時間にわたって、ただし前記非金属材がそのガラス転移温度以上に加熱される前に、前記金属材を前記共晶接合温度で維持するステップを具備することを特徴とする請求項9に記載の方法。
- 前記ガラス転移温度以下から前記共晶接合温度まで前記金属材を加熱する速度は、実質的に、それを周囲温度から前記ガラス転移温度以下まで加熱する速度よりも高いことを特徴とする請求項9に記載の方法。
- 前記ダイ取付けポジションにおける前記ダイの取付け後、前記非金属材の前記ガラス転移温度以下の温度まで前記金属材を冷却するステップを具備することを特徴とする請求項9に記載の方法。
- 前記共晶接合温度から前記ガラス転移温度以下まで前記金属材を冷却する速度は、実質的に、前記ガラス転移温度から周囲温度まで前記金属材を冷却する速度よりも高いことを特徴とする請求項12に記載の方法。
- 前記誘導加熱手段は、単巻線または多重巻線を備えた金属コイルからなる誘導コイルを具備してなることを特徴とする請求項8に記載の方法。
- 前記ダイ取付けポジションにおいて非金属サポートを用いて前記基板を支持することを具備することを特徴とする請求項8に記載の方法。
- 前記非金属サポートはセラミック材からなることを特徴とする請求項15に記載の方法。
- 誘導加熱が生じる前記ダイ取付けポジションの外側で誘導加熱手段によって前記金属材を加熱することを具備することを特徴とする請求項8に記載の方法。
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JP2013175528A (ja) * | 2012-02-24 | 2013-09-05 | Stanley Electric Co Ltd | 発光装置及びその製造方法 |
US8796597B2 (en) | 2007-11-19 | 2014-08-05 | Samsung Electronics Co., Ltd. | In-line package apparatuses and methods |
JP2015056661A (ja) * | 2013-09-11 | 2015-03-23 | エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド | 活性化フォーミングガスを利用するダイ取付装置及び方法 |
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US8796597B2 (en) | 2007-11-19 | 2014-08-05 | Samsung Electronics Co., Ltd. | In-line package apparatuses and methods |
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JP4308161B2 (ja) | 2009-08-05 |
EP1569272A3 (en) | 2006-11-22 |
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US20050186019A1 (en) | 2005-08-25 |
SG114748A1 (en) | 2005-09-28 |
EP1569272A2 (en) | 2005-08-31 |
MY131043A (en) | 2007-07-31 |
TW200532815A (en) | 2005-10-01 |
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