|
US1599589A
(en)
*
|
1924-09-16 |
1926-09-14 |
Willard D Richardson |
Method and apparatus for burning clayware
|
|
US1747067A
(en)
*
|
1926-10-06 |
1930-02-11 |
Major E Gates |
Heat-treating furnace
|
|
US2375771A
(en)
*
|
1941-12-24 |
1945-05-15 |
Ferro Enamel Corp |
Furnace
|
|
US3756868A
(en)
*
|
1971-05-04 |
1973-09-04 |
Allegheny Ludlum Ind Inc |
Method of annealing steel coils moving through a furnace
|
|
US4589843A
(en)
*
|
1976-04-07 |
1986-05-20 |
Smith Thomas M |
Infra-red irradiation
|
|
US4441003A
(en)
*
|
1982-04-16 |
1984-04-03 |
Raytheon Company |
Conveyorized microwave oven with multiple lanes
|
|
JPH0510357Y2
(https=)
*
|
1985-08-17 |
1993-03-15 |
|
|
|
JPS6339937U
(https=)
*
|
1986-08-29 |
1988-03-15 |
|
|
|
JPS6471571A
(en)
*
|
1987-09-11 |
1989-03-16 |
Senju Metal Industry Co |
Reflow furnace
|
|
JPH0619546Y2
(ja)
*
|
1989-09-11 |
1994-05-25 |
ソニー株式会社 |
加熱硬化装置
|
|
JPH06310759A
(ja)
*
|
1993-04-26 |
1994-11-04 |
Kyocera Corp |
画像装置
|
|
JP3106341B2
(ja)
*
|
1994-11-25 |
2000-11-06 |
株式会社新川 |
キュア装置
|
|
JPH08191059A
(ja)
*
|
1995-01-09 |
1996-07-23 |
Hitachi Ltd |
プラズマ処理装置
|
|
KR100238998B1
(ko)
*
|
1995-07-26 |
2000-01-15 |
우치가사키 기이치로 |
가열로
|
|
US5914088A
(en)
*
|
1997-08-21 |
1999-06-22 |
Vijai Electricals Limited |
Apparatus for continuously annealing amorphous alloy cores with closed magnetic path
|
|
JPH11121921A
(ja)
*
|
1997-10-09 |
1999-04-30 |
Fuji Electric Co Ltd |
電子部品のはんだ付け方法および装置
|
|
US6289972B1
(en)
*
|
1999-05-21 |
2001-09-18 |
Danieli Technology Inc. |
Integrated plant for the production of rolled stock
|
|
US6264769B1
(en)
*
|
1999-05-21 |
2001-07-24 |
Danieli Technology, Inc. |
Coil area for in-line treatment of rolled products
|
|
US6336980B1
(en)
*
|
1999-05-21 |
2002-01-08 |
Danieli Technology, Inc. |
Method for in-line heat treatment of hot rolled stock
|
|
US6799712B1
(en)
*
|
2001-02-21 |
2004-10-05 |
Electronic Controls Design, Inc. |
Conveyor oven profiling system
|
|
JP3770237B2
(ja)
*
|
2002-03-22 |
2006-04-26 |
セイコーエプソン株式会社 |
電子デバイス製造装置および電子デバイスの製造方法
|
|
JP2004025274A
(ja)
*
|
2002-06-27 |
2004-01-29 |
Aisin Aw Co Ltd |
加熱炉
|
|
JP4226855B2
(ja)
*
|
2002-07-31 |
2009-02-18 |
パナソニック株式会社 |
熱解析方法及び熱解析装置、並びに前記熱解析方法を実施するプログラム
|
|
DE102004008621A1
(de)
*
|
2004-02-21 |
2005-09-08 |
Jeschar, Rudolf, Prof. Dr.-Ing. Dr.-Ing. E.h. |
Herdofenreaktoren und Verfahren zur Umwandlung fester und pastöser, organischer Stoffe in Prozessgas
|
|
US6991967B2
(en)
|
2004-02-23 |
2006-01-31 |
Asm Assembly Automation Ltd. |
Apparatus and method for die attachment
|
|
US20120285295A1
(en)
*
|
2004-12-07 |
2012-11-15 |
Nu-Iron Technology, Llc |
Method for producing metallic iron nuggets
|
|
JP4593381B2
(ja)
*
|
2005-06-20 |
2010-12-08 |
東京エレクトロン株式会社 |
上部電極、プラズマ処理装置およびプラズマ処理方法
|
|
TW200729361A
(en)
*
|
2006-01-16 |
2007-08-01 |
Advanced Semiconductor Eng |
Package structure and method for fabricating the same
|
|
KR100724587B1
(ko)
*
|
2006-12-12 |
2007-06-04 |
(주)파워벨리 |
솔더 다이본딩 및 에폭시 다이본딩 겸용 다이본딩 장치 및이를 이용한 다이본딩 방법
|
|
US8012866B2
(en)
*
|
2008-05-30 |
2011-09-06 |
Asm Assembly Automation Ltd |
Method of bonding semiconductor devices utilizing solder balls
|
|
JP2010161207A
(ja)
|
2009-01-08 |
2010-07-22 |
Toyota Industries Corp |
半田付け方法および半田付け装置
|
|
JP2011245527A
(ja)
|
2010-05-28 |
2011-12-08 |
Yokota Technica:Kk |
処理装置
|
|
KR101660622B1
(ko)
*
|
2012-04-25 |
2016-09-27 |
오리진 일렉트릭 캄파니 리미티드 |
납땜 장치 및 납땜 제품의 제조방법
|
|
US9029740B2
(en)
*
|
2013-01-15 |
2015-05-12 |
Nordson Corporation |
Air impingement heater
|
|
JP6144495B2
(ja)
*
|
2013-01-24 |
2017-06-07 |
オリジン電気株式会社 |
加熱接合装置及び加熱接合製品の製造方法
|
|
US9093549B2
(en)
*
|
2013-07-02 |
2015-07-28 |
Kulicke And Soffa Industries, Inc. |
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
|
|
US20150027372A1
(en)
*
|
2013-07-26 |
2015-01-29 |
First Solar, Inc. |
Vapor Deposition Apparatus for Continuous Deposition of Multiple Thin Film Layers on a Substrate
|
|
EP3088116B1
(en)
|
2013-12-25 |
2018-06-27 |
Senju Metal Industry Co., Ltd. |
Vacuum soldering apparatus and control method therefor
|
|
DE112015004107B4
(de)
*
|
2014-12-26 |
2025-03-27 |
Fuji Electric Co., Ltd. |
Heiz- und Kühlvorrichtung
|
|
CN107134422A
(zh)
*
|
2016-02-29 |
2017-09-05 |
上海微电子装备（集团）股份有限公司 |
芯片键合装置及方法
|
|
FR3055771B1
(fr)
*
|
2016-09-14 |
2018-08-24 |
Mecatherm |
Module de cuisson de four tunnel lineaire pour produits de boulangerie, viennoiserie et similaires et four tunnel lineaire comportant au moins un tel module
|
|
JP7241286B2
(ja)
*
|
2018-06-27 |
2023-03-17 |
パナソニックＩｐマネジメント株式会社 |
リフロー炉およびはんだ付け処理方法
|