JP2021511664A5 - - Google Patents
Info
- Publication number
- JP2021511664A5 JP2021511664A5 JP2020539766A JP2020539766A JP2021511664A5 JP 2021511664 A5 JP2021511664 A5 JP 2021511664A5 JP 2020539766 A JP2020539766 A JP 2020539766A JP 2020539766 A JP2020539766 A JP 2020539766A JP 2021511664 A5 JP2021511664 A5 JP 2021511664A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- wire bonding
- patent application
- bonding apparatus
- application publication
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862624037P | 2018-01-30 | 2018-01-30 | |
| US62/624,037 | 2018-01-30 | ||
| PCT/US2019/015918 WO2019152561A1 (en) | 2018-01-30 | 2019-01-30 | Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021511664A JP2021511664A (ja) | 2021-05-06 |
| JP2021511664A5 true JP2021511664A5 (https=) | 2022-02-04 |
| JPWO2019152561A5 JPWO2019152561A5 (https=) | 2022-02-04 |
| JP7382120B2 JP7382120B2 (ja) | 2023-11-16 |
Family
ID=67391576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020539766A Active JP7382120B2 (ja) | 2018-01-30 | 2019-01-30 | ワイヤーボンディングツールのクリーニングシステム、そのシステムを含むワイヤーボンディング装置、および関連する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12390839B2 (https=) |
| EP (1) | EP3747044A4 (https=) |
| JP (1) | JP7382120B2 (https=) |
| KR (1) | KR102599764B1 (https=) |
| CN (1) | CN111656513B (https=) |
| WO (1) | WO2019152561A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017109990A1 (ja) * | 2015-12-25 | 2017-06-29 | 株式会社カイジョー | ワイヤボンディング装置 |
| KR102776047B1 (ko) * | 2019-12-20 | 2025-03-07 | 재단법인 포항산업과학연구원 | 마찰교반용접툴의 보수관리방법 |
| CN112122261A (zh) * | 2020-10-19 | 2020-12-25 | 深圳新控自动化设备有限公司 | 一种三轴激光清洗机 |
| CN114188884B (zh) * | 2021-12-14 | 2023-08-25 | 福州大学 | 可空中对接和分离的高压电线巡检和维护装置 |
| CN114406437B (zh) * | 2022-02-26 | 2024-05-28 | 东莞市福川车业有限公司 | 一种电动车载摄像头底座引脚组装装置 |
| DE102022001054A1 (de) * | 2022-03-25 | 2023-09-28 | Hesse Gmbh | Ultraschallbondvorrichtung und Drahtführungsmodul hierfür |
| US20250253286A1 (en) * | 2024-02-05 | 2025-08-07 | Kulicke And Soffa Industries, Inc. | Wedge bonding tools, wire bonding systems, and related methods |
| JP2026007300A (ja) | 2024-07-02 | 2026-01-16 | 株式会社新川 | クリーニング装置、クリーニング方法、及びワイヤボンディング装置 |
| CN119926872B (zh) * | 2025-01-24 | 2025-11-28 | 中国海洋大学 | 一种环形爬壁机器人及其清洁方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5190589A (https=) * | 1975-02-07 | 1976-08-09 | ||
| US4771930A (en) * | 1986-06-30 | 1988-09-20 | Kulicke And Soffa Industries Inc. | Apparatus for supplying uniform tail lengths |
| JPH02248055A (ja) * | 1989-03-22 | 1990-10-03 | Matsushita Electric Ind Co Ltd | ワイヤボンディング装置 |
| JP2551847B2 (ja) * | 1989-07-20 | 1996-11-06 | 株式会社ピーエフユー | 自動溶接機の溶接ノズルの清掃装置 |
| JP2827060B2 (ja) * | 1991-05-20 | 1998-11-18 | 株式会社新川 | ボンデイング装置 |
| JPH05190589A (ja) * | 1992-01-13 | 1993-07-30 | Fujitsu Ltd | 被覆付ワイヤボンディングツールの清浄方法 |
| JPH06318618A (ja) * | 1993-05-07 | 1994-11-15 | Shibuya Kogyo Co Ltd | ボンディングツールクリーニング装置 |
| JPH07321143A (ja) | 1994-05-25 | 1995-12-08 | Sumitomo Electric Ind Ltd | ワイヤボンディング方法およびその装置 |
| JP3540524B2 (ja) * | 1996-10-28 | 2004-07-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| US6638363B2 (en) * | 2000-11-22 | 2003-10-28 | Gunter Erdmann | Method of cleaning solder paste |
| JP3463043B2 (ja) * | 2001-01-24 | 2003-11-05 | Ｎｅｃセミコンダクターズ九州株式会社 | ワイヤボンディング装置のキャピラリを洗浄する洗浄方法及び洗浄装置 |
| JP2002313765A (ja) * | 2001-04-17 | 2002-10-25 | Sony Corp | ブラシ洗浄装置及びその制御方法 |
| JP2004006465A (ja) * | 2002-05-31 | 2004-01-08 | Renesas Technology Corp | 半導体装置の製造方法 |
| US7004373B1 (en) * | 2003-04-07 | 2006-02-28 | West Bond, Inc. | Wire bond fault detection method and apparatus |
| SG114754A1 (en) * | 2004-02-25 | 2005-09-28 | Kulicke & Soffa Investments | Laser cleaning system for a wire bonding machine |
| US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
| JP4840117B2 (ja) * | 2006-12-13 | 2011-12-21 | 株式会社デンソー | ワイヤボンディング方法 |
| US8578953B2 (en) * | 2006-12-20 | 2013-11-12 | Tokyo Electron Limited | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| US8464736B1 (en) * | 2007-03-30 | 2013-06-18 | Lam Research Corporation | Reclaim chemistry |
| KR100889297B1 (ko) * | 2008-09-12 | 2009-03-18 | 주식회사 코스마 | 와이어 본딩용 캐필러리의 크리닝 지그, 와이어 본딩용 캐필러리의 크리닝 장치, 그의 제조 방법 및 그를 이용한 캐필러리 크리닝 방법 |
| JP2012015262A (ja) | 2010-06-30 | 2012-01-19 | Nippon Avionics Co Ltd | 熱圧着用ヒータツールのクリーニング方法および装置 |
| CN104379292A (zh) * | 2011-11-24 | 2015-02-25 | 焊接机器人公司 | 用于模块化便携式焊接和焊缝跟踪的系统和方法 |
| US8657181B2 (en) * | 2012-06-26 | 2014-02-25 | Asm Technology Singapore Pte Ltd | Wedge bonder and a method of cleaning a wedge bonder |
| US20140076956A1 (en) * | 2012-09-20 | 2014-03-20 | Tyco Electronics Corporation | Soldering machine and method of soldering |
| US20140094650A1 (en) * | 2012-10-02 | 2014-04-03 | Covidien Lp | Laparoscopic lens wipe feature on surgical device shaft or jaw member |
| US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
-
2019
- 2019-01-30 WO PCT/US2019/015918 patent/WO2019152561A1/en not_active Ceased
- 2019-01-30 KR KR1020207024958A patent/KR102599764B1/ko active Active
- 2019-01-30 US US16/262,761 patent/US12390839B2/en active Active
- 2019-01-30 JP JP2020539766A patent/JP7382120B2/ja active Active
- 2019-01-30 CN CN201980010547.0A patent/CN111656513B/zh active Active
- 2019-01-30 EP EP19748156.7A patent/EP3747044A4/en active Pending
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