Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B1/00—Cleaning by methods involving the use of tools
  • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
  • B08B1/12—Brushes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B1/00—Cleaning by methods involving the use of tools
  • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B1/00—Cleaning by methods involving the use of tools
  • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
  • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
  • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
  • B08B3/02—Cleaning by the force of jets or sprays
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
  • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
  • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
  • B23K20/004—Wire welding
  • B23K20/005—Capillary welding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
  • B23K20/004—Wire welding
  • B23K20/005—Capillary welding
  • B23K20/007—Ball bonding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
  • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/26—Auxiliary equipment
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
  • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
  • B23K31/125—Weld quality monitoring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P70/00—Cleaning of wafers, substrates or parts of devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/42—Printed circuits
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07118—Means for cleaning, e.g. brushes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07141—Means for applying energy, e.g. ovens or lasers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07168—Means for storing or moving the material for the connector
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07178—Means for aligning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07183—Means for monitoring
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
  • H10W72/07532—Compression bonding, e.g. thermocompression bonding
  • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

• the invention relates to the cleaning of wire bonding tools, and more particularly, to improved systems and methods for cleaning wire bonding tools on wire bonding machines.
• wire and ribbon bonding are widely adopted technologies using a wire bonding machine.
• various types of energy e.g., ultrasonic energy, thermosonic energy, thermocompressive energy, etc.
• ultrasonic energy e.g., ultrasonic energy, thermosonic energy, thermocompressive energy, etc.
• conventional wire bonding include aluminum, copper, gold, among others.
• a challenge in wire bonding is contamination of the wire bonding tool used in the wire bonding operation.
• the tool may become contaminated with bits of wire (e.g., aluminum wire). This contamination has an impact on the effectiveness of the wire bonding operation. Replacement and/or cleaning of the tool may result in operational delay and excessive costs.
• a wire bonding machine includes: (a) a wire bonding tool; (b) a wire guide for guiding a wire to a position beneath a bonding surface of the wire bonding tool, the wire guide being configured for movement between (i) an engagement position with respect to the wire bonding tool (e.g., see FIG. 3B) and (ii) a non-engagement position with respect to the wire bonding tool (see FIG. 3D); and (c) a cleaning station for cleaning at least a portion of a tip of the wire bonding tool when the wire guide is in the non-engagement position.
• the engagement position is a position whereby the wire guide guides an end portion of wire to the position beneath the bonding (working) surface of the wire bonding tool.
• the non-engagement position is a position whereby the wire guide has been moved away from (e.g., swiveled away from) the engagement position.
• a wire bonding machine includes: (a) a wire bonding tool; and (b) a cleaning station for cleaning the wire bonding tool, the cleaning station including at least one brush, wherein the at least one brush includes a stationary brush on the wire bonding machine, and wherein the wire bonding tool is configured to be moved such that a tip of the wire bonding tool is in contact with the stationary brush during a cleaning operation.
• a method of cleaning a tip of a wire bonding tool on a wire bonding machine includes the steps of: (a) moving a wire away from the wire bonding tool such that the tip of the wire bonding tool is accessible to a cleaning station of the wire bonding machine; and (b) cleaning at least a portion of the tip of the wire bonding tool with the cleaning station after step (a).
• FIG. 1 is a block diagram view of elements of a wire bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 2A-2C are block diagrams illustrating a bond off station of a wire bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 3A-3D are block diagrams illustrating a separation station of a wire bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 4A-4B are block diagrams illustrating a cleaning station of a wire bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 5A-5C are block diagrams illustrating another cleaning station of a wire bonding machine in accordance with another exemplary embodiment of the invention.
• FIG. 6 is a block diagram illustrating yet another cleaning station of a wire bonding machine in accordance with another exemplary embodiment of the invention.
• FIG. 7 is a block diagram illustrating yet another cleaning station of a wire bonding machine in accordance with another exemplary embodiment of the invention.
• FIGS. 8A-8D are block diagrams illustrating yet another cleaning station of a wire bonding machine in accordance with another exemplary
• FIGS. 9A-9E are block diagrams illustrating a discard station of a wire bonding machine in accordance with an exemplary embodiment of the invention.
• FIGS. 10A-10E are block diagrams illustrating a realignment station of a wire bonding machine in accordance with an exemplary embodiment of the invention.
• wire bonding tool may refer to any type of tool used to bond a portion of wire against a workpiece.
• exemplary wire bonding tools include wedge bonding tools (sometimes referred to as wedge tools, or wedges), ball bonding tools (sometimes referred to as capillary tools or capillaries), and ribbon bonding tools.
• wire bonding machine as recited herein, may refer to wedge bonding machines, ball bonding machines, ribbon bonding machines, stud bumping machines, etc.
• tool buildup e.g., debris, contaminants, etc.
• a cleaning sequence may be automatic (e.g., triggered by the occurrence of a predetermined event, such as completion of a predetermined time interval or a predetermined number of operations or triggering of process signals).
• the cleaning sequence may be user-triggered.
• a specific exemplary sequence is as follows: the bonding tool is moved (e.g., using the bond head assembly) to a wire handling location; the wire is moved away from the wire bonding tool (e.g., either manually or automatically); and the wire bonding tool is moved to a cleaning station of the wire bonding machine (e.g., where the cleaning station may include one or more brushes, a laser, a pre-form, among other mechanisms). At the cleaning station, a portion of the wire bonding tool (e.g., the tip portion, including the working surface of the wire bonding tool) is cleaned using the cleaning station.
• the wire bonding tool may be moved to a location on top of the brush.
• the wire bonding machine may determine a "first touch" position. After determining the "first touch” position, the wire bonding tool is is lowered in the Z-direction by a certain distance or until a certain force is measured.
• the wire bonding machine performs brushing motions of the tool against the brush (e.g., zig-zag motions or some other predetermined motion profile), for example, until a certain time or number of brush moves have been completed. It is noteworthy that the motions may be completed by the wire bonding tool, the brush, or both.
• the wire bonding tool may be moved to an inspection location on the wire bonding machine where the level of cleanliness of the wire bonding tool tip may be evaluated (e.g., manually by an operator, automatically using a vision system and a computer, etc.).
• the wire bonding tool may then move to a wire handling location, and the wire is moved back in position in connection with the wire bonding tool (e.g., under the tool tip or working face of the wire bonding tool).
• a manual or automated bond off e.g., a single-bond including a pull-test
• the wire bonding machine may then return to production.
• FIG. 1 a block diagram of a wire bonding machine 100 is provided.
• Wire bonding machine 100 is exemplary in nature, and the invention is not limited to the details shown in FIG. 1.
• FIG. 1 illustrates a specific type of wire bonding tool (a wedge bonding tool for ultrasonic wedge bonding) and bond head elements; however, the invention is not limited to this specific type of wire bonding tool or bond head elements.
• FIG. 1 illustrates a plurality of "stations" of wire bonding machine 100. It is understood that the invention does not require each of these stations. Rather, selected ones of these stations (or other stations or mechanisms within the scope of the invention) may be selected for a given application. Further, the stations are not limited to use in the order shown. Rather, a station (e.g., an inspection station) may be used at any time during the proces as desired.
• a station e.g., an inspection station
• Wire bonding machine 100 includes a bond head assembly 102.
• Bond head assembly 102 carries wire bonding tool 104, cutter 106 (for cutting wire), and wire guide assembly 108 (including wire guide 108a, shown, for example, in FIG.
• Wire 103 (e.g., see FIG. 2A) is guided by wire guide assembly 108 to a position beneath a bonding surface of wire bonding tool 104.
• Bond head assembly 102 also carries locking mechanism 110 (explained in greater detail below). Bond head assembly 102 is configured for motion along the x-axis of wire bonding machine 100, along the y-axis of wire bonding machine 100, along the z-axis of wire bonding machine 100, and about the theta axis of wire bonding machine 100.
• wire bonding tool 104 may be moved along (and about) these axes as is desired in connection with the cleaning operations (and related operations) described herein.
• Wire bonding machine 100 includes bonding area 112. At bonding area 112, wire bonding tool 104 bonds wire 103 (e.g., see FIG 2A) to provide electrical interconnections for the given application. In the example shown in FIG. 1, bonding wire 103 will be bonded between first workpiece 112a (e.g., a
• semiconductor element such as a semiconductor die
• second workpiece 112b e.g., a substrate, such as a leadframe, another semiconductor element, etc.
• wire bonding machine 100 includes bond off station 114, separation station 116, cleaning station 118, discard station 120, realign station 122, and inspection station 124. Examples of various of these "stations” are provided throughout the subsequent drawings. It will be appreciated that the term “station” shall be broadly defined as an area of the wire bonding machine adapted for a specific function/operation.
• FIGS. 2A-2C a "bond off process" is illustrated. In connection with the cleaning of a wire bonding tool, it is desirable to have access to the bonding surface at the tip of the wire bonding tool. So the wire needs to be moved away from the working surface. An exemplary approach to this process is described in connection with FIGS. 3A-3D.
• additional clearance between the working surface of the tip and the end portion of the wire is desirable.
• This specifics of this additional clearance depend on the specific type of cleaning operation. For example, it may be desirable to have the end portion of the wire bent to one side or the other of the working surface. In another example, it may be desirable to have the end portion of the wire bent downward away from the working surface. In any event, it may be desirable to establish some additional level of clearance between the working surface of the tip of the wire bonding tool and the end portion fo the wire. In accordance with exemplary aspects of the invention, use of bond off station 114 may be used to provide such additional clearance.
• bond off station 114 In connection with bond off station 114, an end portion of wire is "bonded" (e.g., ultrasonically bonded) to a substrate provided at the bond off station 114. Then, after the bonding, the wire is torn (or otherwise separated) from the bonded end portion of the wire. The motions of bond head assembly 102, in connection with this tearing operation, will establish a bend (or other change) in the end portion of the wire carried by wire guide assembly 108. Referring specifically to FIG. 2A, bond off subtrate 114a of bond off station 114 is carried by wire bonding machine support structure 101. Bond off substrate 114a may be considered a consummable substrate, in that after a number of "bond off” operations, bond off substrate 114a may be replaced.
• Bond off substrate 114a may be considered a consummable substrate, in that after a number of "bond off” operations, bond off substrate 114a may be replaced.
• FIG. 2A an end portion of wire 103 is being ultrasonically bonded to bond off substrate 114a.
• FIG. 2B is a simplified top view of this ultrasonic bonding (with certain elements removed for clarity). After the bonding shown in FIGS. 2A-2B, wire 103 is torn (or otherwise separated) from the last bonded end portion 103a, based on the motions of bond head assembly 102.
• FIG. 2C there is another separate bonded end portion 103a (now there are 4 bonded end portions 103a, as opposed to 3 bonded end portions 103a in FIG. 2B), and a bent end portion 103b carried by wire guide assembly 108.
• bent end portion 103b is offset from supply of wire 103 (and offset from groove 104b of wire bonding tool 104, see FIG. 5C for example of groove 104b)
• additional clearance toward the working surface of wire bonding tool 104 is provided.
• the bond off process accomplished at bond off station 114 may result in the wire being bent (or otherwise offset from the supply of wire 103 from wire guide assembly 108) in any direction desired given the specifics of the cleaning operation.
• bond off station 114 may be desirable to provide separation between an end portion of wire 103 and working surface 104a (e.g., see FIGS. 3B and 3D) of wire bonding tool 104.
• FIGS. 3A-3D illustrate an example of an exemplary separation station 116.
• wire bonding machine 100 may be provided with a moveable (e.g., swivel based) wire guide assembly 108. More specifically, wire guide assembly 108 may be swiveled away from wire bonding tool 104 to provide the desired separation.
• the action of wire guide assembly 108 may be automatic (or automated) or may be manual. In the case of automated movement of wire guide assembly 108 away from wire bonding tool 104, the movement may be provided by a mechanical interlock, a motion system (e.g., a motor, a cylinder, etc), etc. In the example shown in FIGS.
• Locking mechanism 110 locks wire guide assembly 108 in position with respect to wire bonding tool 104. In order to enable the swivel action of wire guide assembly 108, locking mechanism 110 must be actuated to the "unlock" position. Block portions 116a and 116b are provided in separation station 116. Through movements of bond head assembly 102, locking mechanism 110 is actuated through engagement with one or both of block portions 116a and 116b.
• locking mechanism 110 is unlocked, and wire guide assembly 108 may move (e.g., swivel) away from wire bonding tool 104 (e.g., see FIGS. 3C-3D).
• wire guide assembly 108 may move (e.g., swivel) away from wire bonding tool 104 (e.g., see FIGS. 3C-3D).
• FIGS. 3A-3D illustrate just one type of separation station 116; alternative configurations are contemplated within the scope of the invention.
• a tip portion 104' (also referred to herein as a "tip” or “tool tip”) of wire bonding tool 104 may be ready for cleaning at cleaning station 118 (e.g., see FIG. 1).
• cleaning station 118 e.g., see FIG. 1.
• FIGS. 4A-4B illustrate cleaning station 118a
• FIGS. 5A-5C illustrate cleaning station 118b
• FIG. 6 illustrate cleaning station 118c
• FIG. 7 illustrate cleaning station 118d
• FIGS. 8A-8D illustrate cleaning station 118e.
• Any of cleaning stations 118a, 118b, 118c, 118d, and 118e may be used as cleaning station 118 in FIG. 1.
• cleaning station 118a includes at least one brush 108al.
• Brush 108al may be a stationary brush (as described below), or may be a moveable brush (moved with a motion system, not shown).
• Brush 108al includes bristles 108alb held together by bound portion 108ala.
• Brush 108al is supported by wire bonding machine support structure 101.
• Cleaning station 118a also includes debris collection system 105.
• debris collection system 105 may be a vacuum based system for collecting debris (e.g., debris released from wire bonding tool 104, debris resulting from broken bristles 108alb, etc.) resulting from cleaning of wire bonding tool 104 at cleaning station 118a.
• Alternative types of debris collection systems e.g., magnetic systems for attracting ferrous debris, vessels for at least partially surrounding the cleaning operation for collecting debris, etc. are contemplated within the scope of the invention.
• Bond head assembly 102 moves wire bonding tool 104 into a position such that working surface 104a of tip 104' of wire bonding tool 104 is in contact with bristles 108alb of brush 108al. While tip 104' of wire bonding tool 104 is in contact with bristles 108alb of brush 108al, bond head assembly 102 follows a
• FIG. 4B illustrates (from a simplified top view perspective) a predetermined motion profile including a zig-zag motion path 104".
• FIG. 4B illustrates (from a simplified top view perspective) a predetermined motion profile including a zig-zag motion path 104".
• alternative predetermined motion profiles are contemplated within the scope of the invention.
• a force control e.g., closed loop control
• a force sensor e.g., a load cell, etc., not shown
• Such a force sensor may be used to measure a force during the cleaning operation.
• Force data from the force sensor may be provided to a controller or other computer of wire bonding machine 100.
• adjustments may be made to the cleaning operation in a closed loop force control mode, using the force data.
• cleaning station 118b includes at least one brush 118bl.
• Brush 118bl is a rotary brush (e.g., a motor driven brush configured to be actuated in connection with a cleaning operation of wire bonding tool 104), and is driven by motion controller 118b2.
• FIG. 5B illustrates wire bonding tool 104 rotated 90 degrees with respect to the position shown in FIG. 5A (this change is arbitary, and is not required within the scope of the invention).
• FIG. 5B illustrates debris 104c deposited within groove 104b of tip 104' of wire bonding tool 104.
• Brush 118bl (including the illustrated bristles) is rotated and used to loosen debris 104c (see clean tool 104, substantially without debris 104c in groove 104b, shown in FIG. 5C).
• Debris collection system 105 is provided in cleaning station 118b.
• Debris collection system 105 may be a vacuum based system, or other type of collection system, for collecting debris (e.g., debris released from wire bonding tool 104, debris resulting from broken bristles of brush 118bl, etc.) resulting from cleaning of wire bonding tool 104 with cleaning station 118b.
• a force control e.g., closed loop control
• a force sensor e.g., a load cell, etc., not shown
• Such a force sensor may be used to measure a force during the cleaning operation.
• Force data from the force sensor may be provided to a controller or other computer of wire bonding machine 100.
• adjustments may be made to the cleaning operation in a closed loop force control mode, using the force data.
• Cleaning station 118c includes an energy source delivery system 118cl (e.g., a laser light source, another light source, a plasma source, a heat source, etc.), and an energy source controller 118c2 for controlling operation of energy source delivery system 118cl.
• energy 118c3 e.g., laser light energy, other light energy, plasma energy, heat energy, etc.
• Debris collection system 105 is included in cleaning station 118c.
• Debris collection system 105 may be a vacuum based system, or other type of collection system, for collecting debris (e.g., debris released from wire bonding tool 104, etc.) resulting from cleaning of wire bonding tool 104 with cleaning station 118c.
• Cleaning station 118d includes a jet based cleaning mechanism/source 118dl (e.g., a gas pressure based cleaning mechanism for cleaning wire bonding tool 104, a CO2 based cleaning mechanism for cleaning wire bonding tool 104, a sand blasting based cleaning mechanism for cleaning wire bonding tool 104, a bead blasting based cleaning mechanism for cleaning wire bonding tool 104, etc.), and a controller 118d2 for controlling operation of jet based cleaning mechanism/source 118dl.
• Cleaning station 118d also includes vessel 118d3.
• a portion of wire bonding tool 104 (and perhaps other bond head elements such as a portion of wire guide assembly 108 and/or blade 106) are brought into vessel 118d3 through an aperture thereof.
• a jet (see the arrow-headed line pointing out of jet based cleaning mechanism 118d 1) (e.g., a gas jet such as an air jet, a CO2 jet, a jet of sand blasting material, a jet of bead blast material, etc.) is directed toward tip 104' of wire bonding tool 104 within vessel 118d3 for cleaning debris from tip 104' of wire bonding tool 104 (and/or the other bond head elements within vessel 118d3).
• a jet e.g., a gas jet such as an air jet, a CO2 jet, a jet of sand blasting material, a jet of bead blast material, etc.
• Cleaning station 118e includes a plurality of pre-form structures 118e2 on substrate 118el.
• Pre-form structures 118e2 may have a shape corresponding to at least a portion of tip 104' of the wire bonding tool 104 (e.g., groove 104b of tip 104').
• Pre- form structures 118e2 are configured to remove debris 104c from wire bonding tool 104.
• the cleaning operation of cleaning station 118e may utilize an ultrasonic generator carrying wire bonding tool 104, where the ultrasonic generator is part of bond head assembly 102 (such ultrasonic generators are well known to be included in bond head assemblies of wire bonding machines, for ultrasonically bonding wire to a bonding location).
• FIG. 8B illustrates wire bonding tool 104 rotated 90 degrees with respect to the position shown in FIG. 8A (this change is arbitary, and is not required within the scope of the invention).
• FIG. 8B illustrates debris 104c deposited within groove 104b of tip 104' of wire bonding tool 104.
• FIG. 8C illustrates groove 104b engaging one of pre-form structures 118e2 (e.g., through the motion of bond head assembly 102).
• Ultrasonic energy may be applied (e.g., using an ultrasonic generator included in bond head assembly 102), and then wire bonding tool 104 is raised (e.g., through the motion of bond head assembly 102) above pre-form structure 118e2 as shown in FIG. 8D.
• Debris 104c has been transferred to the right- most pre-form structure 118e2, and channel 104b is shown substantially free from debris 104c.
• pre-form structures 118e2 may be copper structures (e.g., formed of copper wire or the like) which are particularly suited for removal of, for example, aluminum debris from groove 104b of wire bonding tool 104.
• Substrate 118el of cleaning station 118e may be considered a consummable substrate, in that after a number of cleaning operations (e.g., one cleaning operation per pre-form structure 118e2 included on substrate 118el), substrate 118el may be replaced.
• a flat plate or substrate e.g., a ceramic plate, a plate with suitable surface roughness, etc.
• ultrasonic energy and/or a motion profile provided by bond head assembly 102 may be applied to remove certain debris from tip 104' of wire bonding tool 104.
• an additional step in cleaning may be utilized at a discard station 120 (e.g., see FIG. 1).
• a discard station may be used to remove (e.g., using a forced gas such as air, or vacuum, or other systems) debris from tip 104' of wire bonding tool 104.
• debris may be (i) debris released from wire bonding tool 104 during the previously described cleaning operations, (ii) debris resulting from broken bristles of a brush in applications where the cleaning station includes at least one brush, etc.), etc.
• Discard station 120 includes a vessel 120a (including a lid 120al), and gas/vacuum source 120b (e.g., air piping, gas piping, vacuum piping, etc).
• FIG. 9B illustrates debris 104c on tip 104', wire guide 108a, and blade 106.
• FIG. 9C through motions of bond head assembly 102, a portion of wire bonding tool 104 (and perhaps other bond head elements such as a portion of wire guide assembly 108 and/or blade 106) have been brought into vessel 120a through an aperture of lid 120al.
• gas/vacuum source 120b e.g., air or other gas forced into vessel 120a from gas/vacuum source 120b
• debris 104c is removed from tip 104', wire guide 108a, and blade 106 (see FIGS. 9D-9E, where such elements are free from debris 104c as compared to FIG. 9B).
• alternative discard stations 120 are contemplated (as opposed to the illustrated forced gas/vacuum based systems), such as, for example, magnetic based systems for attracting ferrous based debris.
• FIGS. 10A-10D illustrate an exemplary realign station 122.
• Realign station 122 includes block 122a supported by wire bonding machine support structure 101.
• Block 122a defines v-shaped groove 122al which extends into linear groove 122a2.
• FIGS. 10B-10C are top views illustrating a process of re-aligning an end portion of wire 103 (e.g., to be in line with groove 104b of tip 104' of wire bonding tool 104).
• wire 103 including the "bent" end portion 103'
• FIGS. 10C-10D As shown in FIG. 10D, the end portion 103' of wire 103 is now realigned to be in line with groove 104b of tip 104' of wire bonding tool 104.
• inspection station 124 may be used to inspect various elements. For example, inspection station 124 may be used to confirm that wire bonding tool 104 (e.g., tip 104' of wire bonding tool 104) is now clean. Further, inspection station 124 may be used to determine that the end portion of wire 103 is properly aligned for entry into groove 104b of tip 104' of wire bonding tool 104. Inspection station 124 may include one or more vision system elements (e.g., cameras, optical elements such as lenses, mirrors, etc.) to image the desired elements.
• vision system elements e.g., cameras, optical elements such as lenses, mirrors, etc.
• Inspection station 124 may be in communication with a computer of wire bonding machine 104, for example, to allow for image processing of images generated by vision system elements of inspection station 124. Through this image processing, determinations may be made regarding such as, for example: whether tip 104' of wire bonding tool 104) is now clean; whether tip 104' of wire bonding tool 104) needs cleaning in the first place; whether the end portion of wire 103 is properly aligned for entry into groove 104b of tip 104'; etc. While inspection station 124 is shown downstream of realign station 122 in FIG. 1, it is understood that inspection station 124 may be used at any time.
• inspection station 124 may be used to determine that realignment of end portion of wire 103 is needed - thereby initiating the realignment at realignment station 122. In another example, inspection station 124 may be used to determine that a further cleaning operation (e.g., at discard station 120) should be performed.
• an ultrasonic generator e.g., carrying the wire bonding tool, and included as part of the bond head assembly, as known to those skilled in the art
• the wire guide may now desirably be returned to the engagement position. For example, this maybe accomplished by reversing the process described above with respect to FIGS. 3A-3D. That is, locking mechanism 110 may be actuated as described above to lock the wire guide assembly 108 back into the engagement position. Following this action, and any other desired checks (e.g., a bond off prior to resuming wire bonding, a pull test of the bond off prior to resuming wire bonding, etc.), the wire bonding machine may now be ready to resume wire bonding operations.
• any other desired checks e.g., a bond off prior to resuming wire bonding, a pull test of the bond off prior to resuming wire bonding, etc.

Landscapes

• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Quality & Reliability (AREA)
• Wire Bonding (AREA)
• Cleaning In General (AREA)
• Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (2)

Family

ID=67391576

Family Applications (1)

Country Status (6)

Cited By (1)

Families Citing this family (8)

Citations (5)

Family Cites Families (21)

• 2019
  • 2019-01-30 WO PCT/US2019/015918 patent/WO2019152561A1/en not_active Ceased
  • 2019-01-30 KR KR1020207024958A patent/KR102599764B1/ko active Active
  • 2019-01-30 US US16/262,761 patent/US12390839B2/en active Active
  • 2019-01-30 JP JP2020539766A patent/JP7382120B2/ja active Active
  • 2019-01-30 CN CN201980010547.0A patent/CN111656513B/zh active Active
  • 2019-01-30 EP EP19748156.7A patent/EP3747044A4/en active Pending

Patent Citations (5)

Also Published As

Similar Documents

Legal Events