JP2022534782A5 - - Google Patents
Info
- Publication number
- JP2022534782A5 JP2022534782A5 JP2021571646A JP2021571646A JP2022534782A5 JP 2022534782 A5 JP2022534782 A5 JP 2022534782A5 JP 2021571646 A JP2021571646 A JP 2021571646A JP 2021571646 A JP2021571646 A JP 2021571646A JP 2022534782 A5 JP2022534782 A5 JP 2022534782A5
- Authority
- JP
- Japan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024146057A JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962857027P | 2019-06-04 | 2019-06-04 | |
| US62/857,027 | 2019-06-04 | ||
| PCT/US2020/035818 WO2020247424A1 (en) | 2019-06-04 | 2020-06-03 | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024146057A Division JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2022534782A JP2022534782A (ja) | 2022-08-03 |
| JPWO2020247424A5 JPWO2020247424A5 (https=) | 2023-05-29 |
| JP2022534782A5 true JP2022534782A5 (https=) | 2023-05-29 |
| JP7579280B2 JP7579280B2 (ja) | 2024-11-07 |
Family
ID=73650765
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021571646A Active JP7579280B2 (ja) | 2019-06-04 | 2020-06-03 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
| JP2024146057A Pending JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024146057A Pending JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11581285B2 (https=) |
| JP (2) | JP7579280B2 (https=) |
| KR (1) | KR102788904B1 (https=) |
| CN (1) | CN113939901B (https=) |
| TW (2) | TWI853032B (https=) |
| WO (1) | WO2020247424A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114341658B (zh) * | 2020-08-04 | 2024-10-11 | 雅马哈智能机器控股株式会社 | 导线接合状态判定方法及导线接合状态判定装置 |
| CN117337485A (zh) * | 2021-05-20 | 2024-01-02 | 库利克和索夫工业公司 | 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机 |
| US20240250063A1 (en) * | 2023-01-20 | 2024-07-25 | Kulicke And Soffa Industries, Inc. | Methods of automatic recovery for process errors in operating wire bonding machines |
| CN121464751A (zh) * | 2023-07-11 | 2026-02-03 | 库利克和索夫工业公司 | 检测半导体元件中的裂纹的方法以及相关的焊线系统 |
| KR20250015211A (ko) * | 2023-07-24 | 2025-02-03 | 주식회사 엘엑스세미콘 | SiC 반도체 소자의 정션 프로파일 관찰 방법 |
| US20250391812A1 (en) * | 2024-06-21 | 2025-12-25 | Kulicke And Soffa Industries, Inc. | Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system |
| CN121358308B (zh) * | 2025-12-18 | 2026-04-17 | 广东阿达半导体设备股份有限公司 | 一种焊线机的偏焊预防与自动纠准方法及系统 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4586642A (en) * | 1985-05-13 | 1986-05-06 | Kulicke And Soffa Industries Inc. | Wire bond monitoring system |
| US6189765B1 (en) * | 1998-04-14 | 2001-02-20 | Hyundai Electronics Industries Co., Ltd. | Apparatus and method for detecting double wire bonding |
| JP3567884B2 (ja) * | 2000-11-22 | 2004-09-22 | 松下電器産業株式会社 | 超音波ボンディング方法 |
| JP4434623B2 (ja) * | 2003-05-12 | 2010-03-17 | パナソニック株式会社 | ボンディング装置およびボンディング方法 |
| US7085699B2 (en) * | 2003-12-23 | 2006-08-01 | Texas Instruments Incorporated | Wire bonding simulation |
| JP4266369B2 (ja) | 2005-02-24 | 2009-05-20 | 株式会社新川 | ワイヤボンディング方法 |
| CN101675510B (zh) * | 2007-05-16 | 2011-12-14 | 库利克和索夫工业公司 | 金属线接合方法和接合力校准 |
| WO2009002345A1 (en) | 2007-06-28 | 2008-12-31 | Kulicke And Soffa Industries, Inc. | Method of determining a height profile of a wire loop on a wire bonding machine |
| JP4397408B2 (ja) * | 2007-09-21 | 2010-01-13 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
| JP4275724B1 (ja) * | 2008-07-16 | 2009-06-10 | 株式会社新川 | ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置 |
| KR20110129170A (ko) | 2010-05-25 | 2011-12-01 | 삼성전기주식회사 | 와이어 본딩 장치 및 방법 |
| US20120032354A1 (en) | 2010-08-06 | 2012-02-09 | National Semiconductor Corporation | Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds |
| CN202169438U (zh) * | 2011-06-03 | 2012-03-21 | 长春光华微电子设备工程中心有限公司 | 全自动超声波铝丝压焊机送丝装置 |
| US8919632B2 (en) | 2012-11-09 | 2014-12-30 | Asm Technology Singapore Pte. Ltd. | Method of detecting wire bonding failures |
| KR101672510B1 (ko) * | 2012-11-16 | 2016-11-03 | 가부시키가이샤 신가와 | 와이어 본딩 장치 및 와이어 본딩 방법 |
| TWI518814B (zh) | 2013-04-15 | 2016-01-21 | 新川股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
| KR102254026B1 (ko) | 2014-08-18 | 2021-05-20 | 삼성전자주식회사 | 반도체 패키지의 제조 방법 |
| JP6575161B2 (ja) * | 2015-06-16 | 2019-09-18 | 富士電機株式会社 | 良否判断装置、ワイヤボンダ装置及び良否判断方法 |
| US10121759B2 (en) * | 2015-11-04 | 2018-11-06 | Kulicke And Soffa Industries, Inc. | On-bonder automatic overhang die optimization tool for wire bonding and related methods |
| KR102365682B1 (ko) * | 2017-11-13 | 2022-02-21 | 삼성전자주식회사 | 반도체 패키지 |
| US10755988B2 (en) | 2018-06-29 | 2020-08-25 | Kulicke And Soffa, Industries, Inc. | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine |
-
2020
- 2020-06-02 US US16/890,823 patent/US11581285B2/en active Active
- 2020-06-03 CN CN202080041774.2A patent/CN113939901B/zh active Active
- 2020-06-03 WO PCT/US2020/035818 patent/WO2020247424A1/en not_active Ceased
- 2020-06-03 KR KR1020227000056A patent/KR102788904B1/ko active Active
- 2020-06-03 JP JP2021571646A patent/JP7579280B2/ja active Active
- 2020-06-03 TW TW109118695A patent/TWI853032B/zh active
- 2020-06-03 TW TW113130680A patent/TWI880837B/zh active
-
2023
- 2023-01-12 US US18/096,179 patent/US12255172B2/en active Active
-
2024
- 2024-08-28 JP JP2024146057A patent/JP2024161600A/ja active Pending