Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
  • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
  • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
  • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
  • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/01—Manufacture or treatment
  • H10W72/015—Manufacture or treatment of bond wires
  • H10W72/01551—Changing the shapes of bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07141—Means for applying energy, e.g. ovens or lasers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07168—Means for storing or moving the material for the connector
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/0711—Apparatus therefor
  • H10W72/07183—Means for monitoring
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07521—Aligning
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/071—Connecting or disconnecting
  • H10W72/075—Connecting or disconnecting of bond wires
  • H10W72/07531—Techniques
  • H10W72/07532—Compression bonding, e.g. thermocompression bonding
  • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/531—Shapes of wire connectors
  • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/50—Bond wires
  • H10W72/531—Shapes of wire connectors
  • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Definitions

• the invention relates to the formation of wire loops and other wire bonded structures, and more particularly, to improved methods of detecting the status of a bonded portion of a wire.
• wire bonding e.g., ball bonding, wedge bonding, etc.
• wire bonder also known as a wire bonding machine
• wire loops are formed between respective locations to be electrically interconnected.
• An exemplary conventional wire bonding sequence (using ball bonding techniques) of a simple wire loop includes: (1) forming a free air ball on an end of a wire extending from a bonding tool; (2) forming a first bond of a wire loop on a die pad of a semiconductor die using the free air ball; (3) extending a length of wire in a desired shape between the die pad and a lead of a leadframe; (4) stitch bonding the wire to the lead of the leadframe to form a second bond of the wire loop; and (5) severing the supply wire from the now formed wire loop.
• varying types of bonding energy may be used including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy, amongst others.
• a method of determining a bonding status between a wire and at least one bonding location of a workpiece includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) determining a motion profile of the bonding tool (thus providing a predetermined motion profile) for determining if the portion of the wire is bonded to the bonding location, the motion profile being configured to result in the wire being broken during the motion profile if the portion of the wire is not bonded to the bonding location; and (c) moving the bonding tool along the motion profile to determine if the portion of the wire is bonded to the bonding location.
• Such methods may be used to check the bonding status of a plurality of portions of the wire bonded to a corresponding plurality of bonding locations of the workpiece.
• steps (b) and (c) described in the prior paragraph may be repeated for each of the plurality of portions of the wire to determine if each of the plurality of portions of the wire are bonded to their corresponding bonding location of the workpiece.
• another method of determining a bonding status between a wire and at least one bonding location of a workpiece includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) detecting, during step (a), at least two of (i) a deformation characteristic related to bonding the portion of wire, (ii) a bond force characteristic related to bonding the portion of wire, and (iii) a transducer characteristic of a transducer of the wire bonding machine; and (c) determining a bonding status of the portion of the wire that was bonded to the bonding location in step (a) using information detected in step (b).
• FIGS. 1A- 1H are a series of block diagram views of a wire bonding system, illustrating a method of determining that a bonded portion of wire is bonded to a bondi ng location, in accordance with an exemplary embodiment of the i nvention;
• FIGS. 2A-2F are a series of block diagram views of a wire bonding system, illustrating a method of determining that a bonded portion of wire is not bonded to a bonding location, in accordance with an exemplary embodiment of the invention
• FIG. 3 is a block diagram of a conventional wi re bonding machine useful for illustrating certain exemplary methods in accordance with the invention.
• FIG. 4 is a flow diagram illustrating exemplary methods of determi ning a bonding status of a portion of wire bonded to a bonding location on a wire bonding machine in accordance with various exemplary embodiments of the i nvention.
• real time bond lift detection for workpieces e.g ., semiconductor devices such as memory based semiconductor devices, stacked-die memory devices, etc.
• workpieces e.g ., semiconductor devices such as memory based semiconductor devices, stacked-die memory devices, etc.
• a portion of wire may be configured to be at least one of a power lead or a ground lead of the memory based semiconductor device.
• aspects of the invention are particularly applicable to multi-stitch bonding processes (i .e., wire loops i ncludi ng more than two bonded portions - for example, wi re loops including three, four, five, or more bonded portions) .
• multi-stitch bonding processes i .e., wire loops i ncludi ng more than two bonded portions - for example, wi re loops including three, four, five, or more bonded portions.
• aspects of the invention wil l force a bonding wi re to break if the bond is not stuck properly on a bonding location.
• Detecting the broken wire can be accomplished using existing detection systems (e.g., a BITS system) that detect electrical conti nuity (or a lack of electrical continuity) .
• detection is easy for a broken wire which exhibits a high impedance, making clear that the wire is not secure to the proper bondi ng location.
• the determi nation of whether the wire is broken may be made using a detection system of the wire bonding machi ne.
• the detection system detects whether a conductive path is established between (a) the wire, and (b) a portion of the wire bonding machine.
• the conductive path i n cludes at least one of (a) a wire clamp for clamping the wire, (b) a wi re spool for supplying the wire to the bonding tool, (c) a diverter element for assisting i n positioni ng of the wire between the wi re spool and the bondi ng tool, and (d) an air guide system for assisti ng in positioning of the wire between the wi re spool and the bonding tool .
• the detection system may detect whether the conductive path is established by detecting at least one of (a) a predetermined current flow in the conductive path, (b) a predetermined change i n capacitance between the conductive path and a ground connection of the wire bonding machine, and (c) a predetermined phase shift of current flowing in the conductive path.
• methods of determi ning/detecti ng a bondi ng status (e.g ., if a portion of wire is properly bonded, if a portion of wire is not properly bonded, etc.) of a wi re bond connection on a workpiece are provided.
• such methods may be performed in real ti me on a production wire bonding system (e.g., a wire bonding machi ne) .
• Wire bondi ng system 100 i n cludes a support structure 102 (e.g., a heat block, an anvi l, etc.) for supporti ng a workpiece 103.
• a support structure 102 e.g., a heat block, an anvi l, etc.
• workpiece 103 incl udes a substrate 104, and a pl urality of stacked semiconductor die 106a, 106b, and 106c.
• wire bonding system 100 also incl udes wire bonding tool 108 (e.g ., a capi llary wire bonding tool), a wire clamp 110, and a detection system 114 (e.g., a BITS system) .
• a length of wire 112 is provided to wire bonding tool 108 through wire clamp 110.
• a free air ball 112a i .e., a portion of wi re 112
• an electrical connection 113 is provided between wire clamp 110 and detection system 114.
• free air ball 112a is bonded to a bonding location (e.g., a die pad) of die 106c.
• a bonding location e.g., a die pad
• free air ball 112a has been transformed to bonded wire portion 112b.
• a portion of wire 112 is extended from bonded wire portion 112b and bonding tool 108.
• wire 112 has further been shaped to include kink 112c, and another wire bond is being formed between wire 112 and a bonding location of die 106b.
• this wire bond is shown as bonded wire portion 112d, and another length of wire 112 extends from bonded wire portion 112d to bonding tool 108 including kink 112e.
• wire bonding tool 108 is moved along a predetermined motion profile (where the motion profile may include a predetermined directions, distances, angles, etc.) (see dotted line bonding tool 108 having moved along the motion profile, stretching the wire as shown in the dotted line, but not disrupting bonded wire portion 112d).
• a predetermined motion profile where the motion profile may include a predetermined directions, distances, angles, etc.
• bonded wire portion 112d is still properly bonded to a bonding location of die 106b, as is detected using detection system 114.
• the remainder of a wire loop (labelled as wire loop 116 in FIG. 1H), including bonded wire portion 112f, is formed.
• FIGS. 2A-2F illustrate substantially similar elements as in FIGS. 1A-1H, but with a different result.
• bonded wire portion 112d shown in FIG. 2D
• the predetermined motion profile i .e., the dotted line arrow shown in FIG. 2E
• wire break 112g occurs as detected by detection system 114. Because wire break 112g is detected by detection system 114, the bonding status of bonded wire portion 112d is known as "unacceptable" or "unbonded” or "I ifted-off” or some similar status.
• FIGS. 1A-1H it has been determined that bonded portion 112d is bonded to a bonding location of die 106b.
• FIGS. 2A-2F it has been determined that bonded portion 112d is not bonded to a bonding location of die 106b.
• FIGS. 1A- 1H and i n FIGS. 2A-2F only one bonded portion (i .e. , bonded portion 112d) is checked usi ng the inventive bondi ng status check.
• mutliple bonded portions may be checked using the i nvention.
• each bonded portion of wire loop 116 shown in FIG. 1H i .e., bonded wire portion 112b, bonded portion 112d, and bonded portion 112f
• a predetermined motion profile may be used to check the bonding status of bonded wire portion 112b.
• bonded portion 112d may be formed (see FIG. ID) .
• the predetermi ned motion profile of FIG. IE may be used to check the bonding status of bonded wire portion 112d.
• bonded portion 112f may be formed (see FIG. 1G) .
• a predetermined motion profi le may be used to check the bondi ng status of bonded wire portion 112f.
• inventive techniques described above in connection with FIGS. 1A- 1H and FIGS. 2A-2F may be used to check the bonding status of any number of bonded portions of a wire loop.
• a step of determini ng a motion profile of the bonding tool for determining if the portion of the wire is bonded to the bonding location may be incl uded . That is, prior to forming a bonded portion of a wi re loop (such as bonded portion 112d in FIG. ID), a motion profile may be determined . That is, prior to followi ng the motion profi le (as in FIG. IE), the motion profi le should be determined .
• Such a motion profile may be configured to result i n the wire being broken (e.g ., see FIG. 2F) during the motion profile if the portion of the wi re is not bonded to the bonding location.
• the motion profile may be determined through a trial and error process (or other process such as an iterative process), usi ng information relevant to the specific application (e.g., bondi ng locations of the various bonded portions of the wire loops, wire looping parameters, etc.) .
• FIGS. 1A- 1H and FIGS. 2A-2F illustrate certain exemplary methods of determining a bonding status of bonded portions of a wire (e.g., a wi re loop) bonded to a workpiece.
• the invention contemplates additional methods of determining the bondi ng status of the bonded wi re portions.
• information detected by a wire bonding machine e.g., a deformation characteristic related to bonding a portion of wire, a bond force characteristic related to bonding the portion of wire, a transducer characteristic of a transducer of the wire bonding machine, etc.
• a wire bonding machine e.g., a deformation characteristic related to bonding a portion of wire, a bond force characteristic related to bonding the portion of wire, a transducer characteristic of a transducer of the wire bonding machine, etc.
• a wire bonding machine e.g., a deformation characteristic related to bonding a portion of wire, a bond force characteristic related to bonding the portion of wire, a transducer characteristic of a transducer of the wire bonding machine, etc.
• FIG. 3 is a side view of a simplified wire bonding machine 100a (which may be similar to, or the same as, wire bonding machine 100 of FIGS. 1A-1H) which may be used to detect the information described in the immediately preceding paragraph, and in other parts of the present application.
• Wire bonding machine 100a includes support structure 102 (e.g., a heat block, an anvil, etc.) for supporting a semiconductor element 304 during a wire bonding operation.
• semiconductor element 304 includes a plurality of semiconductor die 304a on a leadframe 304b.
• other types of semiconductor elements e.g., such as memory based semiconductor devices, stacked die devices, among others are contemplated within the scope of the invention.
• Wire bonding machine 100a also includes wire bonding tool 108 (e.g., a capillary wire bonding tool, etc.) for bonding wire portions to semiconductor element 304.
• wire bonding tool 108 (carried by bond head assembly 300) is moveable along a plurality of axes of wire bonding machine 100a to perform wire bonding operations. For example, wire bonding tool 108 is moved along the x-axis and y-axis through movement of bond head assembly 300.
• a linkage 300a is carried by bond head assembly 300 and wire bonding tool 108.
• This linkage 110a is configured for movement along the z-axis of wire bonding machine 100a.
• Additional elements carried by bond head assembly 300 includes: a moveable portion of z-axis motor 300a l which moves along the z-axis with linkage 300a; a transducer 300a2 for carrying wire bonding tool 108, and for providing ultrasonic scrub to tip portion 108a of wire bonding tool 108; a force sensor 300a3 for sensing a bonding force applied during wire bonding operations; and a z-axis position detector 300a4 (e.g., a z-axis encoder).
• z-axis position detector 300a4 detects the z-axis position of linkage 300a (and hence a relative z-axis position of bonding tool 108), and provides data corresponding to this z-axis position (e.g., real time) to computer 302 of wire bonding machine 100a.
• computer 302 has information related to the z-axis position of bonding tool 108 through its motions. Certain information from each of z-axis motor 300al, transducer 300a2, force sensor 300a3, and z-axis position detector 300a4 may be provided to computer 302 (as shown by the arrow extending from bond head assembly 300 and computer 302) .
• Computer 302 may also provide information (e.g ., instructions) back to elements of bond head assembly 300 (as shown by the arrow extending from computer 302 to bond head assembly 300).
• information e.g ., instructions
• computer 302 provides control signals to one z-axis motor 300a l and/or transducer 300a2.
• FIG. 4 is a flow diagram illustrating exemplary methods in accordance with the invention. As is understood by those skil led in the art, certai n steps included in the flow diagram may be omitted ; certai n additional steps may be added ; and the order of the steps may be altered from the order illustrated - al l within the scope of the invention.
• FIG. 4 is a flow diagram illustrating exemplary methods of determi ning a bonding status of a portion of wire bonded to a bonding location on a wire bonding machine, such as wi re bondi ng machine 100 of FIGS. 1A- 1H and FIGS. 2A-2F (or wire bonding machi ne 100a of FIG. 3, or other wire bonding machines within the scope of the invention) .
• relationshi ps are determined between (i) characteristics to be detected during a wire bonding process, and (ii) a bondi ng status of a portion of wire to be bonded to a workpiece.
• the characteristics may include, for example, any two or more of: a deformation characteristic related to bonding the portion of wire; a bond force characteristic related to bonding the portion of wire; and a transducer
• the bonding status may include a simple status (e.g. , "bonded” or “not bonded”), or may be somewhat more specific (e.g ., a "good” bond, an "acceptable” bond, an "unacceptable” bond, "a lift off condition", among other labels as determined by the user) .
• operations may continue (e.g., in the case of a good bond or an acceptable bond), operations may stop (e.g ., the wire bonding operation may stop in the event of an "unacceptable” bond or a "lift off condition"), an alarm or other notification may be provided (e.g ., in the case of acceptable bond, an unacceptable bond, a lift off condition, etc.), etc.
• the specific labels appl ied (the bonding status), and the action taken related to such a label e.g ., continuing wi re bondi ng operations, stopping wire bonding operations, providing an alarm of other notification, etc. ), may be customized for the application and/or user.
• testing/experimentation may be done on one or more wi re bondi ng appl ications (e.g. , using a specific die, specific wire, specific wi re bonding parameters - which may be optimized using a closed loop process, specific wi re looping parameters - which may be optimized using a closed loop process, etc.) ⁇
• val ues of the aforementioned characteristics e.g., deformation characteristics, bond force characteristics, tranducer characteristics, etc.
• Various ranges for each of the characteristics, and combined ranges for the multiple characteristics may be determi ned.
• a range for each bonding status (e.g., a good bond, an acceptable bond, an unacceptable bond, a lift off condition, etc.) may be provided by the testi ng/experimentation.
• each bonding status may be assigned to combined ranges of the characteristics.
• a "good bond” bondi ng status may be applied to a situation when each of the three characteristics falls withi n a predetermined range for that characteristic.
• acceptable bond bondi ng status may be applied when one or more of the three characteristics falls withi n a predetermined range for that characteristic that is not in the "good” range, but is in an “acceptable” range.
• An “unacceptable bond” bondi ng status may be applied when one or more of the three characteristics fal ls within a predetermined range for that characteristic that is not i n the "good” range or the “acceptable” range, but is in an "unacceptable” range. And so on.
• a portion of a wi re is bonded to a bonding location of a workpiece using a bonding tool of a wire bonding machine.
• FIG. IF illustrates a bonded wire portion 112d (of the to be formed wire loop 116, as shown i n FIG. 1H) bonded to a bonding location of die 106b.
• a deformation characteristic related to the bonded portion of wire is detected duri ng Step 402.
• the deformation characteristic relates to a vertical deformation of the portion of wire duri ng Step 402, for example, as measured by a z- axis position detector (e.g., see z-axis position detector 300a4 in FIG. 3) .
• the deformation may be considered the measured deformation between (i) contact of the wi re portion with the bondi ng location, and (ii) the completion of the bondi ng process of Step 402.
• the deformation characteristic may relate to single value (i .e.
• Step 402 a single z- axis measurement/val ue taken during Step 402, or may relate to a series of values (i .e., a series of measurements/values versus time, such as a deformation profile) taken during Step 402.
• a series of values i .e., a series of measurements/values versus time, such as a deformation profile
• a bond force characteristic related to bonding the portion of wire is detected .
• the bond force characteristic may relate to a bond force measured by at least one of (i) a force sensor in a bond head of the wire bonding machine (e.g ., see force sensor 300a3 in FIG. 3), and (i i) a z-axis motor characteristic of a z-axis motor of the wire bonding machine (see z-axis motor 300a l i n FIG. 3).
• the bond force characteristic may relate to single value (i .e., a single bond force measurement/value) taken during Step 402, or may relate to a series of val ues (i .e., a series of
• a transducer characteristic of a transducer of the wire bonding machi ne is detected.
• a typical wi re bondi ng machine includes an ultrasonic transducer carried by a bond head assembly.
• the ultrasonic transducer typically carries a wire bonding tool (e.g ., see wire bonding tool 108 in FIGS. 1A- 1H), and applies an ultrasonic scrub to a tip portion of the wi re bondi ng tool to bond wire portions to bonding locations.
• the transducer characteristic may relate to any of a number of characteristics such as, for example: (i) an impedance of the transducer; and (ii) an electrical characteristic of the transducer (e.g. , a voltage measurement, a current measurement, etc.) .
• the transducer characteristic may relate to single value (i .e., a single transducer measurement/val ue) taken during Step 402, or may relate to a series of values (i .e., a series of measurements/values versus time, such as a transducer profile) taken during Step 402.
• Step 406 a bonding status of the portion of the wi re bonded to the bonding location in Step 402 is determi ned using i nformation detected in at least two of Steps 404a, 404b, and 404c (e.g ., using the deformation characteristic and the bond force characteristic, using the deformation characteristic a nd the transducer
• the bonding status may be a "good” bond, an "acceptable” bond, an "unacceptable” bond, a "lift off condition", or any other bonding status.
• Step 408 a plural ity of portions of the wire are bonded to a corresponding plurality of bonding locations of the workpiece, and Steps 404 (incl uding at least two of Steps 404a, 404b, and 404c) and Step 406 are repeated for each of the plura lity of portions of the wire to determine if each of the plurality of portions of the wi re are bonded to their corresponding bonding location of the workpiece.
• each of the wire bonded portions i .e. , wi re bonded portions 112b, 112d, and 112f
• FIGS. 1A-1H and FIGS. 2A- 2F simply illustrate exemplary workpieces. Any type of workpiece may be utilized that i ncorporates wire bonding.
• the invention has been ill ustrated with respect to certain wire loop shapes, it is not limited thereto. Aspects of the invention may be uti lized to detect bonding (or non bonding, or another bonding status) of any wi re portions such as, for example: stud bumps; simple wire loops including a first bond and a second bond only; complex wire loops includi ng multiple tiers and devices; etc.
• any or all of the bonded portions may be checked for proper bonding utilizi ng aspects of the invention.
• conventional techniques may be adequate to detect proper bonding of certai n bonded portions, while aspects of the invention may be used for other bonded portions.
• data related to the one or more characteristics may also be saved in memory (e.g., memory of the wi re bondi ng machine, or remote memory) for later analysis (e.g., to confirm the ranges for each bonding status are correct when analyzing specific workpieces that have completed a wire bonding operation) .

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