JP7579280B2 - ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 - Google Patents

ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 Download PDF

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JP7579280B2
JP7579280B2 JP2021571646A JP2021571646A JP7579280B2 JP 7579280 B2 JP7579280 B2 JP 7579280B2 JP 2021571646 A JP2021571646 A JP 2021571646A JP 2021571646 A JP2021571646 A JP 2021571646A JP 7579280 B2 JP7579280 B2 JP 7579280B2
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wire
bonding
bonded
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bond
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JP2022534782A (ja
JPWO2020247424A5 (https=
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ジロッティ、ゲイリー、エス．
ハースコウィッツ、レイチェリ
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クリック アンド ソッファ インダストリーズ、インク．
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

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  • Wire Bonding (AREA)
JP2021571646A 2019-06-04 2020-06-03 ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 Active JP7579280B2 (ja)

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JP2024146057A JP2024161600A (ja) 2019-06-04 2024-08-28 ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962857027P 2019-06-04 2019-06-04
US62/857,027 2019-06-04
PCT/US2020/035818 WO2020247424A1 (en) 2019-06-04 2020-06-03 Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

Related Child Applications (1)

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JP2024146057A Division JP2024161600A (ja) 2019-06-04 2024-08-28 ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法

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JP2022534782A JP2022534782A (ja) 2022-08-03
JPWO2020247424A5 JPWO2020247424A5 (https=) 2023-05-29
JP2022534782A5 JP2022534782A5 (https=) 2023-05-29
JP7579280B2 true JP7579280B2 (ja) 2024-11-07

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JP2021571646A Active JP7579280B2 (ja) 2019-06-04 2020-06-03 ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法
JP2024146057A Pending JP2024161600A (ja) 2019-06-04 2024-08-28 ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法

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US (2) US11581285B2 (https=)
JP (2) JP7579280B2 (https=)
KR (1) KR102788904B1 (https=)
CN (1) CN113939901B (https=)
TW (2) TWI853032B (https=)
WO (1) WO2020247424A1 (https=)

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CN114341658B (zh) * 2020-08-04 2024-10-11 雅马哈智能机器控股株式会社 导线接合状态判定方法及导线接合状态判定装置
CN117337485A (zh) * 2021-05-20 2024-01-02 库利克和索夫工业公司 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机
US20240250063A1 (en) * 2023-01-20 2024-07-25 Kulicke And Soffa Industries, Inc. Methods of automatic recovery for process errors in operating wire bonding machines
CN121464751A (zh) * 2023-07-11 2026-02-03 库利克和索夫工业公司 检测半导体元件中的裂纹的方法以及相关的焊线系统
KR20250015211A (ko) * 2023-07-24 2025-02-03 주식회사 엘엑스세미콘 SiC 반도체 소자의 정션 프로파일 관찰 방법
US20250391812A1 (en) * 2024-06-21 2025-12-25 Kulicke And Soffa Industries, Inc. Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system
CN121358308B (zh) * 2025-12-18 2026-04-17 广东阿达半导体设备股份有限公司 一种焊线机的偏焊预防与自动纠准方法及系统

Citations (2)

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US4586642A (en) 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
WO2014077232A1 (ja) 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法

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JP3567884B2 (ja) * 2000-11-22 2004-09-22 松下電器産業株式会社 超音波ボンディング方法
JP4434623B2 (ja) * 2003-05-12 2010-03-17 パナソニック株式会社 ボンディング装置およびボンディング方法
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JP4266369B2 (ja) 2005-02-24 2009-05-20 株式会社新川 ワイヤボンディング方法
CN101675510B (zh) * 2007-05-16 2011-12-14 库利克和索夫工业公司 金属线接合方法和接合力校准
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4397408B2 (ja) * 2007-09-21 2010-01-13 株式会社新川 半導体装置及びワイヤボンディング方法
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WO2014077232A1 (ja) 2012-11-16 2014-05-22 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法

Also Published As

Publication number Publication date
WO2020247424A1 (en) 2020-12-10
JP2022534782A (ja) 2022-08-03
KR102788904B1 (ko) 2025-03-31
CN113939901B (zh) 2025-04-25
JP2024161600A (ja) 2024-11-19
TWI853032B (zh) 2024-08-21
TW202449936A (zh) 2024-12-16
CN113939901A (zh) 2022-01-14
TWI880837B (zh) 2025-04-11
US11581285B2 (en) 2023-02-14
TW202114008A (zh) 2021-04-01
US20200388589A1 (en) 2020-12-10
US20230170325A1 (en) 2023-06-01
KR20220005102A (ko) 2022-01-12
US12255172B2 (en) 2025-03-18

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