CN103730390A - 引线接合机以及测试引线接合连接的方法 - Google Patents

引线接合机以及测试引线接合连接的方法 Download PDF

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CN103730390A
CN103730390A CN201210597852.4A CN201210597852A CN103730390A CN 103730390 A CN103730390 A CN 103730390A CN 201210597852 A CN201210597852 A CN 201210597852A CN 103730390 A CN103730390 A CN 103730390A
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wire
bonded
wire bonding
disc
joint
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张汉民
贺青春
许立强
宗飞
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NXP USA Inc
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Freescale Semiconductor Inc
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Priority to US13/865,185 priority patent/US20140103096A1/en
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Abstract

本发明涉及引线接合机以及使用该引线接合机测试引线接合连接的方法。该方法包括提供具有安装到衬底上的半导体管芯的半导体组件,所述衬底和所述管芯每一个具有接合垫盘。该方法包括将引线到接合垫盘中的一个以形成第一引线接合。然后施加剪切力到该第一引线接合。当传感器探测到第一引线接合在施加该剪切力期间发生移动时,产生故障信号。

Description

引线接合机以及测试引线接合连接的方法
技术领域
本发明总体上涉及半导体装置组件,尤其涉及引线接合机以及测试引线接合连接的方法。
背景技术
半导体装置常常形成有安装在非导电衬底(管芯(die)载体)上的半导体管芯。管芯上的接合垫盘(bonding pad)被引线接合到衬底上的接合垫盘,以允许管芯的到电路板等的外部电连接。在引线接合后,半导体管芯和接合引线被封装在化合物(诸如,塑料材料)中,而保留衬底的外部连接件暴露以用于外部电连接。
引线接合是广泛使用的技术,用于提供半导体管芯和衬底之间的电连接。形成在管芯接合垫盘和衬底接合垫盘之间的引线接合内部互连的完整性或质量,可以被可视地、电学地或机械地评估(测试)。
可视测试通常依赖于人的观测,并且由于操作者的疲劳,这种类型的测试可能允许劣质的接合被接受。相反地,电测试的可靠性不依赖于操作者的疲劳,然而,电测试不一定能识别出间歇性地给出合理的低阻抗特性的劣质接合。
机械测试可以有效地替换电测试,并且这样的测试包括剥离强度测试,其中引线接合的剥离强度提供了接合失败的可能性的提示。通常,通过将钩(hook)放置在接合引线下在靠近待测试的引线接合的位置,来进行剥离强度测试。钩拉接合引线,从而对正在测试的引线接合提供张力。
尽管引线接合的剥离强度测试为球接合等提供了相对可靠的测试质量,但是其未必适合于所有类型的接合,例如楔接合。另外,剥离强度测试需要额外的夹紧工具或钩,以提供张力到引线接合。这样的夹紧工具需要精确控制电路来精确定位,并且这样的定位可能会相对花时间。
发明概述
根据本发明一个方面,提供了一种引线接合机,包括:处理器;引线接合工具;引线接合工具控制器,操作地耦接到所述处理器和所述引线接合工具两者;以及力传感器,操作地耦接到所述处理器,并且与所述引线接合工具的引线接合夹具物理地相关联,其中,在工作中,在所述引线接合工具在接合垫盘上形成引线接合之后,所述引线接合工具控制器控制所述引线接合夹具来向该引线接合施加剪切力,并且作为响应,所述处理器测试来自所述力传感器的感测信号,以确定该感测信号是否已达到阈值级别,并且其中,当所述感测信号低于所述阈值级别时,所述处理器产生故障信号。
根据本发明另一方面,提供了一种测试引线接合连接的方法,该方法利用引线接合机进行,该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,其中所述管芯和所述衬底每一个都具有与其相关联的接合垫盘;将引线接合到接合垫盘的第一接合垫盘,以形成第一引线接合;利用与该第一引线接合啮合的夹具,对第一引线接合施加第一剪切力;以及,当传感器提供表示该第一引线接合在剪切力的施加期间移动的信号时,产生第一故障信号。
根据本发明再一方面,提供了一种测试引线接合连接的方法,该方法在引线接合机上进行,该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,并且所述管芯和衬底每一个都具有与其相关联的接合垫盘;利用接合引线将管芯接合垫盘中的要给电连接到衬底接合垫盘中的一个,其中所述接合引线的一端和管芯接合垫盘中的一个形成第一引线接合,而所述接合引线相对的另一端与衬底接合垫盘中的一个形成第二引线接合;对引线接合中的选定的一个施加剪切力;以及在传感器提供表示引线接合中所述选定的的一个在剪切力施加期间移动的情况下,产生故障信号。
附图说明
通过下面对优选实施例以及附图的详细描述,可以更好地理解本发明及其诸目的及优点,在附图中:
图1是常规的半导体组件的平面图;
图2是图1的半导体组件的侧面图;
图3是根据本发明优选实施例的引线接合机的示意性框图;
图4示出了在执行图1的半导体组件的引线接合时的图3的机器的引线接合工具的部分;
图5示出了根据本发明的优选实施例的执行引线接合的引线接合工具头的部分;
图6是图5中的引线接合工具头部的部分沿着6-6’的剖面图;
图7示出了根据本发明优选实施例的用于测试引线接合连接的方法的流程图;和
图8是示出了根据本发明另一个优选实施例的用于测试引线接合连接的方法的流程图。
具体实施方式
下面结合附图作出的详细描述意图作为对本发明当前优选的实施例的描述,并不代表可以践行本发明的仅有的形式。应当认识到,可以通过不同实施例实现相同或等同的功能,并意图将这些实施例包含在本发明的精神和范围之内。在附图中,通篇使用相同的附图标记来指示类同的部件。另外,术语“包括”、“包含”或任何其它变型意图覆盖非排除性的包含,从而,包括一系列要件或步骤的系统、电路、装置部件和方法步骤并不仅仅包含这些要件,而是可以包括没有明确列出或该系统、电路、装置部件或步骤所固有的其它要件或步骤。在没有更多约束的情况下,通过“包括...”引述的要件或步骤并不排除其它相同要件或步骤(包括前面所述的更件或步骤)的存在。
在本发明的一个实施例中,提供了一种测试引线接合连接的方法。该方法在引线接合机上执行,并且该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,并且其中所述管芯和所述衬底每一都具有与其相关联的接合垫盘。该方法执行将引线接合到接合垫盘中的第一接合垫盘,以形成第一引线接合,然后执行利用与该第一引线接合啮合的夹具对第一引线接合施加剪切力的处理。然后,当传感器提供表示该第一引线接合在施加剪切力期间移动的信号时,该方法产生故障信号。
在本发明的另一实施例中,提供了一种测试引线接合连接的方法。该方法在引线接合机上执行,并且该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,并且其中所述管芯和所述衬底每一都具有与其相关联的接合垫盘。还执行通过接合引线将衬底上接合垫盘中的一个电连接到管芯上的接合垫盘中的一个的处理。所述接合引线的一端和管芯上的接合垫盘中的一个形成第一引线接合,而该接合引线的相对一端与衬底上的接合垫盘中的一个形成第二引线接合。然后,施加剪切力到所述引线接合中选定的一个引线接合。当传感器提供表示引线接合中所选定的引线接合在施加剪切力期间移动时,产生故障信号。
在本发明的另一实施例中,提供了一种引线接合机,其具有:处理器,引线接合工具,和操作地耦接到所述处理器和所述引线接合工具两者的引线接合工具控制器。还具有力传感器,其操作地连接到所述处理器,并且与所述引线接合工具的引线接合夹具物理地相关联。在工作中,在引线接合工具在接合垫盘上形成引线接合之后,引线接合工具控制器控制引线接合夹具向该引线接合施加剪切力,并且作为响应,处理器测试来自力传感器的感测信号以确定该感测信号是否已达到阈值级别。当该感测信号低于阈值级别时,处理器产生故障信号。
参考图1,示出了已知的常用的半导体组件100的平面图。组件100包括安装到衬底102的半导体管芯101,并且管芯101和衬底102每一都具有在其各自的接合垫盘表面105、106上的并且通常从其各自的接合垫盘表面105、106突出的相关联的接合垫盘103、104。
图2示出了半导体组件100的侧面图。如图所示,利用环氧树脂或其它形式的粘结剂201将半导体管芯101安装在衬底102上。与衬底102相关联的接合垫盘104耦接到衬底102的外部连接器表面203上或者从衬底102的外部连接器表面203突出的相应的外部连接垫盘202。外部连接器表面203与接合垫盘表面204相反,并且如本领域技术人员将容易理解的,接合垫盘104通过导电通孔(via)或导电走线(runner)(未图示)耦接到其各自的外部连接垫盘203。
图3示出了根据本发明优选实施例的引线接合机300的示意框图。引线接合机300包括处理器301和引线接合工具302。还包括引线接合工具控制器模块303,其操作地连接到处理器301和引线接合工具302两者。还具有位置识别模块304、警报模块305、剪切力传感器306、和用户界面308,其全部操作地耦接到处理器301。剪切力传感器306还与引线接合工具302的引线接合夹具307物理地关联(机械地连接到)。另外,在这个实施例中,剪切力传感器306是应变计(stain gauge),其测量应变并提供感测信号St,感测信号St与夹具307上的剪切力Fs成比例。
在工作中,在引线接合工具302在接合垫盘(103,104)上形成引线接合之后,引线接合工具控制器模块303控制引线接合夹具307以向引线接合施加剪切力Fs。作为响应,处理器301测试来自剪切力传感器306的感测信号St以确定感测信号St是否已达到阈值级别Th。感测信号St表示了剪切力Fs,并且当感测信号St低于阈值级别Th时,处理器301产生剪切测试不合格信号Sf。剪切测试不合格信号Sf被发送到警报模块305,警报模块305从而通常警报操作者,或者替代地,自动确定适当的行动。
位置识别模块304通常利用成像来确定夹具307相对于接合垫盘(103,104)的位置。位置识别模块304由此发送位置信息到处理器301,其发送信息或指令到引线接合工具控制器模块303,以精确地放置接合引线并将接合引线接合到接合垫盘(103,104)。
图4示出了执行半导体组件100的引线接合时的引线接合工具302的部分。引线接合工具302的该部分是引线接合工具头401,其包括夹具307。如图所示,引线接合工具头401已完成接合引线402到选定的接合垫盘(103,104)对的接合。该接合过程对本领域技术人员来说是已知的,因此不需要进一步描述。
图5示出了根据本发明优选实施例的执行引线接合的引线接合工具头401的部分。引线接合工具头401包括引线接合夹具307和适当放置的毛细管(引线分配器)501。另外,剪切力传感器306安装在引线接合工具头401的侧面,在临近夹具307的位置。引线接合工具头401形成具有纵轴L的接合502。
参考图6,示出了引线接合工具头401部分沿着6-6’的剖面侧视图。如图所示,引线接合夹具307被成形来执行楔接合(wedge bonding)。更特别的,引线接合夹具307具有接合尖端601,其凹入有尖顶腔602,从而使得接合引线402的接合部分603被成形为类似楔形。剪切力传感器306位置紧密靠近接合尖端601,在引线接合工具头401的侧面,以通过在所示的任一方向上施加剪切力Fs来检测施加到引线接合工具头401和引线接合的接合夹具307的剪切力。该剪切力Fs在与接合502的纵轴L成法向的角度,并且在与接合垫盘104的接合表面的平面P平行的平面施加。尽管如图所示,引线接合工具头部401在接合垫盘104之一的引线接合502之上,但是本领域技术人员将容易知道,引线接合工具头401也可以在接合垫盘103之一上的引线接合502之上。
图7是示出了根据本发明一个优选实施例的测试引线接合连接的方法700的流程图。该方法700在块702处通过提供包括安装在衬底102上的半导体管芯101的半导体组件100开始。在执行第一端引线接合块704,方法700执行将接合引线(例如,402)接合到接合垫盘103中的第一接合垫盘,以形成第一引线接合B1。通过引线接合夹具307来进行接合引线的接合,在这个实施例中,引线接合夹具307执行接合引线到接合垫盘103中的第一接合垫盘的楔接合。
在剪切测试不合格检测块706,方法700利用与第一引线接合B1啮合的引线接合夹具307执行对第一引线接合B1施加剪切力Fs的处理。通过引线接合夹具307,在与第一引线接合B1的纵轴L成法向的角度,并且在与接合垫盘103所在的接合表面的平面P平行的平面,施加该剪切力Fs。如果剪切力传感器306提供实现阈值级别Th之上的信号级别的感测信号St,则处理器301确定第一引线接合B1通过了剪切测试,并且该方法700因此继续在移动块708的通常的引线接合工艺。然而,如果剪切力传感器306提供具有低于阈值级别Th的信号级别的感测信号St,则处理器301确定第一引线接合B1剪切测试不合格。本领域技术人员将容易理解,当夹具307没有充分受应力(由此,这表示第一引线接合B1在剪切力Fs的施加期间移动(切变))时,该第一引线接合B1剪切测试不合格。
当剪切测试不合格检测块706确定第一引线接合B1剪切测试不合格时,处理器301对报警模块305发出剪切测试不合格信号Sf。因此,在块722,方法700产生故障信号。在接合可接受测试块724,执行接合评估测试,在这里操作者可以通过用户界面308输入接受接合或拒绝接合的指令。如果第一引线接合B1是可接受的,则处理器301给工具控制器模块303信号,以在移动块708中移动楔接合夹具307。替代地,如果第一引线接合B1是不可接受的(并因此被拒绝),则处理器301给工具控制器模块303信号以在修复接合块728通过尝试再接合第一引线接合B1来修复该接合。修复接合块728的该修复仅在其是第一引线接合B1的第一次修复(如通过在第一修复测试块726评估的简单计数而确定的)的情况下才执行。
在通过再执行引线接合尝试修复第一引线接合B1之后,方法700回到剪切测试不合格检测块706,以评估第一引线接合B1的剪切测试的完整性。当方法700到达移动块708,引线接合夹具307移动到接合垫盘104中的第二接合垫盘,并且通过毛细管501分配接合引线402。相应的,接合引线402桥接接合B1的接合垫盘103和接合垫盘104的第二接合垫盘。
在第二端引线接合块710,方法700进行接合引线402到接合垫盘104中的第二接合垫盘的接合,以形成第二引线接合B2。在块710的接合完成之后,接合引线402将接合垫盘103中的第一接合垫盘和接合垫盘104中的第二接合垫盘电连接。然后,在剪切测试不合格检测块712,方法700利用与第二引线接合B2啮合的引线接合夹具307执行时第二引线接合B2施加剪切力Fs的处理。如同上面的,通过引线接合夹具307,以与第二引线接合B2的纵轴L成法向的角度,并且在与接合垫盘104的接合表面的平面P平行的平面,施加剪切力Fs。如果剪切力传感器306提供实现阈值级别Th之上的信号级别的感测信号St,则处理器301确定第二引线接合B2通过了剪切测试,并因此,在切断尾部块714方法700继续通常的引线接合工艺。然而,如果剪切力传感器306提供具有低于阈值级别Th的信号级别的感测信号St,则处理器301确定第二引线接合B2剪切测试不合格。就这一点而言,当夹具307没有充分受应力(这因此表示该第二引线接合B2在剪切力Fs的施加期间移动(切变))时,该第二引线接合B2剪切测试不合格。
当剪切测试不合格检测块712确定第二引线接合B2剪切测试不合格时,处理器301对报警模块305发出剪切测试不合格信号Sr。因此,在块732,方法700产生故障信号。在接合可接受测试块734,执行接合评估测试,在这里操作者可以通过用户界面308输入接受接合或拒绝接合的指令。如果第二引线接合B2是可接受的,则在这两个垫盘103和104之间的引线接合完成时,处理器301给工具控制器模块303信号,以在切断尾部块714切断接合引线402的尾部。替代地,如果第二引线接合B2是不可接受的(并因此,被拒绝),则处理器301给工具控制器模块303信号以在修复接合块738通过尝试再接合第二引线接合B2来修复该接合。在修复接合块738的修复仅在其是第二引线接合B2的第一次修复(如由在第一修复测试块736评估的简单计数而确定的)的情况下才执行。
在通过再次执行引线接合来尝试修复第二引线接合B2之后,方法700回到剪切测试不合格检测块712,以评估第二引线接合B2的剪切测试完整性。当方法700到达切断层部块714时,工具头401切断接合引线402的尾部,以完成两个垫盘103和104之间的引线接合。然后,在完成测试块716,方法700确定是否已完成半导体组件100的全部引线接合。如果方法700确定已经完成了半导体组件100的所有引线接合,其在结束块720终止(或者替代的,移动来引线接合并剪切测试另半导体组件100)。然而,如果当前组件100还有需要接合的另外的引线接合,则方法700在移动块718移动接合夹具307到还需要引线接合的另一垫盘103(选定的垫盘)。然后,方法700回到块704,以对选定的垫盘进行引线接合。
应当注意,如果第一修复测试块726确定已经有先前的修复第一引线接合B1的尝试,则方法700转移到块730的尾部切断工艺。类似地,如果第一修复测试块736确定已经有先前的修复第二引线接合B2的尝试,则方法700将也转移到块730的尾部切断工艺。块730的尾部切断工艺利用工具头401执行接合引线402的切断,以从被确定为差质量的引线接合垫盘移除接合引线402。因此需要该切断以允许引线接合机继续引线接合另外的半导体组件,并且因此,方法700在结束块720终止。
在将引线402接合到接合垫盘104的第二垫盘的工艺之前,方法700对第一引线接合B1施加剪切力Fs。然而,在图8种,示出了根据本发明的另一个优选实施例的测试引线接合连接的方法800的流程图。在方法800中,在将接合引线402接合到接合垫盘104的第二垫盘的工艺之后,进行对第一引线接合B1施加剪切力Fs。方法800在块802通过提供包括安装在衬底102上的半导体管芯101的半导体细件100开始。在执行第一端引线接合块804,方法800执行接合引线402到接合垫盘103的第一接合垫盘的接合,以形成第一引线接合B1。接合引线的接合通过引线接合夹具307来进行,在这个实施例中,引线接合夹具307执行接合引线到接合垫盘103中的第一接合挚盘的楔接合。
在移动块806,引线接合夹具307移动到接合垫盘104中的第二接合垫盘,并且通过毛细管501分配接合引线402。因此,接合引线402桥接接合B1的接合垫盘103和接合垫盘104中的第二接合垫盘。然后,在执行第二端引线接合块808,方法800执行接合引线402到接合垫盘104中的第二接合垫盘的接合,以形成第二引线接合B2。在完成块808的接合后,接合引线402电连接接合垫盘103的第一接合垫盘到接合垫盘104的第二接合垫盘。
当方法800到达切断尾部块810,工具头401切断接合引线402的尾部,以完成两个垫盘103和104之间的引线接合。然后,在完成测试块812,方法800确定是否已完成半导体组件100的全部引线接合。如果确定还有其它垫盘103,103需要引线接合,则在移动块814,将引线接合夹具307移动到另个垫盘103。然后方法800回到第一端引线接合块804以进行另外的引线接合。替代地,如果完成测试块812确定方法800已经完成半导体组件100所有的引线接合,则在剪切测试块816,方法800执行剪切测试。在剪切测试块816执行的剪切测试和前面描述的剪切测试处理类似,并且为了避免重复就不再进行描述。在下列情况之后,剪切测试工艺终止:a)半导体组件的所有引线接合通过剪切测试(如果需要的话,在再接合之后);或者,未被或者不能被修复的引线接合的剪切测试不合格。然后,方法800在结束块818终止。
总之,方法800执行利用接合引线402将衬底102上的接合垫盘104中的一个与管芯101上的接合垫盘103中的一个电连接的工艺过程。因此,接合引线402的一端和接合垫盘103或104中的一个形成第一引线接合B1,而该接合引线相对的另一端和接合垫盘103或104中的一个形成第二引线接合。之后,
在所有的垫盘103、104已经被引线接合之后,或者替代地,在两个垫盘通过接合引线402电连接在一起之后,对每一个引线接合施加剪切力Fs测试。
有利地,本发明提供了引线接合的强度测试而不需要抓取工具或钩。本发明对于楔式接合的连接是特别有利的,楔式接合的连接具有适合的轮廓以允许施加剪切力Fs到正在测试的接合。
项目1.一种引线接合机,包括:处理器;引线接合工具;引线接合工具控制器,操作地耦接到所述处理器和所述引线接合工具两者;以及力传感器,操作地耦接到所述处理器,并且与所述引线接合工具的引线接合夹具物理地相关联,其中,在工作中,在所述引线接合工具在接合垫盘上形成引线接合之后,所述引线接合工具控制器控制所述引线接合夹具来向该引线接合施加剪切力,并且作为响应,所述处理器测试来自所述力传感器的感测信号,以确定该感测信号是否已达到阈值级别,并且其中,当所述感测信号低于所述阈值级别时,所述处理器产生故障信号。
项目2.如项目1所述的引线接合机,其中,所述引线接合夹具被成形来执行楔接合。
项目3.如项目1所述的引线接合机,其中,所述传感器是应变计,其测量与所述夹具上的剪切力成比例的应变。
项目4.如项目1所述的引线接合机,其中,在工作中,以与接合的纵轴成法向的角度施加剪切力。
项目5.如项目1所述的引线接合机,其中,在工作中,在与所述接合垫盘的接合表面平行的平面施加剪切力。
项目6.一种测试引线接合连接的方法,该方法利用引线接合机进行,该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,其中所述管芯和所述衬底每一个都具有与其相关联的接合垫盘;将引线接合到接合垫盘的第一接合垫盘,以形成第一引线接合;利用与该第一引线接合啮合的夹具,对第一引线接合施加第一剪切力;以及,当传感器提供表示该第一引线接合在剪切力的施加期间移动的信号时,产生第一故障信号。
项目7.如项目6所述的测试引线接合连接的方法,其中,通过所述夹具执行所述接合。
项目8.如项目7所述的测试引线接合连接的方法,其中,所述夹具执行引线的楔接合。
项目9.如项目6所述的测试引线接合连接的方法,其中,以与接合的纵轴成法向的角度施加所述第一剪切力。
项目10.如项目9所述的测试引线接合连接的方法,其中,在与接合垫盘的接合表面的平面上施加所述第一剪切力。
项目11.如项目6所述的测试引线接合连接的方法,还包括:将所述引线接合到接合垫盘中的第二接合垫盘以形成第二引线接合,其中所述引线将接合垫盘中的第一接合垫盘电连接到接合垫盘中的第二接合垫盘;通过该第二引线接合啮合的夹具,对第二引线接合施加第二剪切力;以及,当所述传感器提供表示该第二引线接合在剪切力施加期间移动的信号时,产生第二故障信号。
项目12.如项目11所述的测试引线接合连接的方法,其中,对第一引线接合施加第一剪切力发生在将所述引线接合到接合垫盘的第二接合垫盘的工艺之前。
项目13.如项目11所述的测试引线接合连接的方法,其中,对第一引线接合施加第一剪切力发生在将所述引线接合到接合垫盘的第二接合垫盘的工艺之后。
项目14.如项目11所述的测试引线接合连接的方法,其中,响应于第二故障信号,该方法执行对第二引线接合的再接合步骤。
项目15.如项目6所述的测试引线接合连接的方法,其中,响应于第一故障信号,该方法执行对第一引线接合的再接合步骤。
项目16.一种测试引线接合连接的方法,该方法在引线接合机上进行,该方法包括:提供半导体组件,该组件包括安装到衬底上的半导体管芯,并且所述管芯和衬底每一个都具有与其相关联的接合垫盘;利用接合引线将管芯接合垫盘中的要给电连接到衬底接合垫盘中的一个,其中所述接合引线的一端和管芯接合垫盘中的一个形成第一引线接合,而所述接合引线相对的另一端与衬底接合垫盘中的一个形成第二引线接合;对引线接合中的选定的一个施加剪切力;以及在传感器提供表示引线接合中所述选定的的一个在剪切力施加期间移动的情况下,产生故障信号。
项目17.如项目16所述的测试引线接合连接的方法,其中,所述接合是通过夹具执行的楔接合,还通过所述夹具施加剪切力。
项目18.如项目16所述的测试引线接合连接的方法,其中,以与接合的纵轴成法向的角度施加所述剪切力。
项目19.如项目16所述的测试引线接合连接的方法,其中,该传感器是应变计,其测量与所述夹具上的剪切力成比例的应变。
项目20.如项目16所述的测试引线接合连接的方法,其中,响应于故障信号,该方法对引线接合中所述选定的的一个执行再接合步骤。
本发明优选实施例的详细描述,其目的在于阐明和描述,而不是穷尽本发明或将本发明限制到所公开的形式。本领域技术人员将理解,可以进行改变上面描述的实施例,而不偏离本发明的宽泛的发明概念。因此,应当理解,本发明不限于公开的特定实施例,而是覆盖了在如权利要求所限定的本发明的精神和范围之内的修改。

Claims (5)

1.一种引线接合机,包括:
处理器;
引线接合工具;
引线接合工具控制器,操作地耦接到所述处理器和所述引线接合工具两者;以及
力传感器,操作地耦接到所述处理器,并且与所述引线接合工具的引线接合夹具物理地相关联,
其中,在工作中,在所述引线接合工具在接合垫盘上形成引线接合之后,所述引线接合工具控制器控制所述引线接合夹具来向该引线接合施加剪切力,并且作为响应,所述处理器测试来自所述力传感器的感测信号,以确定该感测信号是否已达到阈值级别,并且其中,当所述感测信号低于所述阈值级别时,所述处理器产生故障信号。
2.如权利要求1所述的引线接合机,其中,所述引线接合夹具被成形来执行楔接合。
3.如权利要求1所述的引线接合机,其中,所述传感器是应变计,其测量与所述夹具上的剪切力成比例的应变。
4.如权利要求1所述的引线接合机,其中,在工作中,以与接合的纵轴成法向的角度施加剪切力。
5.如权利要求1所述的引线接合机,其中,在工作中,在与所述接合垫盘的接合表面平行的平面施加剪切力。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109069033A (zh) * 2016-02-03 2018-12-21 哈钦森技术股份有限公司 具有集成引线的微型压力/力传感器

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
KR102127892B1 (ko) * 2013-06-03 2020-06-29 삼성전자주식회사 와이어 본딩 기계의 동작 조건 오류 검출 방법 및 이를 수행하기 위한 장치
JP2022082887A (ja) * 2020-11-24 2022-06-03 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN115356205B (zh) * 2022-07-27 2024-04-09 苏州信息职业技术学院 半导体芯片的打线质量测试系统与测试方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2836212B2 (ja) * 1990-07-17 1998-12-14 富士通株式会社 ワイヤボンディング方法及びワイヤボンダ
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
DE10315639A1 (de) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
US20050029328A1 (en) * 2003-06-18 2005-02-10 Esec Trading Sa Method for checking the quality of a wedge bond
DE102006049624B4 (de) * 2006-10-20 2016-07-14 Hesse Gmbh Ultraschallbonder
JP5616739B2 (ja) * 2010-10-01 2014-10-29 新日鉄住金マテリアルズ株式会社 複層銅ボンディングワイヤの接合構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109069033A (zh) * 2016-02-03 2018-12-21 哈钦森技术股份有限公司 具有集成引线的微型压力/力传感器
US11243127B2 (en) 2016-02-03 2022-02-08 Hutchinson Technology Incorporated Miniature pressure/force sensor with integrated leads
CN109069033B (zh) * 2016-02-03 2023-08-29 哈钦森技术股份有限公司 具有集成引线的微型压力/力传感器
US11867575B2 (en) 2016-02-03 2024-01-09 Hutchinson Technology Incorporated Miniature pressure/force sensor with integrated leads

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