TWI853032B - 引線接合機上的接合引線及接合位置之間的接合檢測方法 - Google Patents

引線接合機上的接合引線及接合位置之間的接合檢測方法 Download PDF

Info

Publication number
TWI853032B
TWI853032B TW109118695A TW109118695A TWI853032B TW I853032 B TWI853032 B TW I853032B TW 109118695 A TW109118695 A TW 109118695A TW 109118695 A TW109118695 A TW 109118695A TW I853032 B TWI853032 B TW I853032B
Authority
TW
Taiwan
Prior art keywords
bonding
wire
lead
bonded
tool
Prior art date
Application number
TW109118695A
Other languages
English (en)
Chinese (zh)
Other versions
TW202114008A (zh
Inventor
蓋瑞 Ｓ 吉洛帝
拉切利 赫斯科維特
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202114008A publication Critical patent/TW202114008A/zh
Application granted granted Critical
Publication of TWI853032B publication Critical patent/TWI853032B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Wire Bonding (AREA)
TW109118695A 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法 TWI853032B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962857027P 2019-06-04 2019-06-04
US62/857,027 2019-06-04

Publications (2)

Publication Number Publication Date
TW202114008A TW202114008A (zh) 2021-04-01
TWI853032B true TWI853032B (zh) 2024-08-21

Family

ID=73650765

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109118695A TWI853032B (zh) 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法
TW113130680A TWI880837B (zh) 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113130680A TWI880837B (zh) 2019-06-04 2020-06-03 引線接合機上的接合引線及接合位置之間的接合檢測方法

Country Status (6)

Country Link
US (2) US11581285B2 (https=)
JP (2) JP7579280B2 (https=)
KR (1) KR102788904B1 (https=)
CN (1) CN113939901B (https=)
TW (2) TWI853032B (https=)
WO (1) WO2020247424A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114341658B (zh) * 2020-08-04 2024-10-11 雅马哈智能机器控股株式会社 导线接合状态判定方法及导线接合状态判定装置
CN117337485A (zh) * 2021-05-20 2024-01-02 库利克和索夫工业公司 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机
US20240250063A1 (en) * 2023-01-20 2024-07-25 Kulicke And Soffa Industries, Inc. Methods of automatic recovery for process errors in operating wire bonding machines
CN121464751A (zh) * 2023-07-11 2026-02-03 库利克和索夫工业公司 检测半导体元件中的裂纹的方法以及相关的焊线系统
KR20250015211A (ko) * 2023-07-24 2025-02-03 주식회사 엘엑스세미콘 SiC 반도체 소자의 정션 프로파일 관찰 방법
US20250391812A1 (en) * 2024-06-21 2025-12-25 Kulicke And Soffa Industries, Inc. Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system
CN121358308B (zh) * 2025-12-18 2026-04-17 广东阿达半导体设备股份有限公司 一种焊线机的偏焊预防与自动纠准方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US20050133566A1 (en) * 2003-12-23 2005-06-23 Variyam Manjula N. Wire bonding simulation
TW200631112A (en) * 2005-02-24 2006-09-01 Shinkawa Kk Wire bonding method
US20140131425A1 (en) * 2012-11-09 2014-05-15 Asm Technology Singapore Pte Ltd Method of detecting wire bonding failures

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6189765B1 (en) * 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
JP3567884B2 (ja) * 2000-11-22 2004-09-22 松下電器産業株式会社 超音波ボンディング方法
JP4434623B2 (ja) * 2003-05-12 2010-03-17 パナソニック株式会社 ボンディング装置およびボンディング方法
CN101675510B (zh) * 2007-05-16 2011-12-14 库利克和索夫工业公司 金属线接合方法和接合力校准
WO2009002345A1 (en) 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4397408B2 (ja) * 2007-09-21 2010-01-13 株式会社新川 半導体装置及びワイヤボンディング方法
JP4275724B1 (ja) * 2008-07-16 2009-06-10 株式会社新川 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
KR20110129170A (ko) 2010-05-25 2011-12-01 삼성전기주식회사 와이어 본딩 장치 및 방법
US20120032354A1 (en) 2010-08-06 2012-02-09 National Semiconductor Corporation Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
CN202169438U (zh) * 2011-06-03 2012-03-21 长春光华微电子设备工程中心有限公司 全自动超声波铝丝压焊机送丝装置
KR101672510B1 (ko) * 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
TWI518814B (zh) 2013-04-15 2016-01-21 新川股份有限公司 半導體裝置以及半導體裝置的製造方法
KR102254026B1 (ko) 2014-08-18 2021-05-20 삼성전자주식회사 반도체 패키지의 제조 방법
JP6575161B2 (ja) * 2015-06-16 2019-09-18 富士電機株式会社 良否判断装置、ワイヤボンダ装置及び良否判断方法
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
KR102365682B1 (ko) * 2017-11-13 2022-02-21 삼성전자주식회사 반도체 패키지
US10755988B2 (en) 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US20050133566A1 (en) * 2003-12-23 2005-06-23 Variyam Manjula N. Wire bonding simulation
TW200631112A (en) * 2005-02-24 2006-09-01 Shinkawa Kk Wire bonding method
US20140131425A1 (en) * 2012-11-09 2014-05-15 Asm Technology Singapore Pte Ltd Method of detecting wire bonding failures

Also Published As

Publication number Publication date
WO2020247424A1 (en) 2020-12-10
JP2022534782A (ja) 2022-08-03
KR102788904B1 (ko) 2025-03-31
CN113939901B (zh) 2025-04-25
JP2024161600A (ja) 2024-11-19
JP7579280B2 (ja) 2024-11-07
TW202449936A (zh) 2024-12-16
CN113939901A (zh) 2022-01-14
TWI880837B (zh) 2025-04-11
US11581285B2 (en) 2023-02-14
TW202114008A (zh) 2021-04-01
US20200388589A1 (en) 2020-12-10
US20230170325A1 (en) 2023-06-01
KR20220005102A (ko) 2022-01-12
US12255172B2 (en) 2025-03-18

Similar Documents

Publication Publication Date Title
TWI853032B (zh) 引線接合機上的接合引線及接合位置之間的接合檢測方法
US9899348B2 (en) Wire bonding apparatus and method of manufacturing semiconductor device
US20120024089A1 (en) Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same
US20200006161A1 (en) Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
TW201436073A (zh) 引線接合操作中未黏接狀況下的自動重複工程流程
CN103730390A (zh) 引线接合机以及测试引线接合连接的方法
WO2009002345A1 (en) Method of determining a height profile of a wire loop on a wire bonding machine
US20220270937A1 (en) Methods of determining shear strength of bonded free air balls on wire bonding machines
TWI231367B (en) Method for checking the quality of a wedge bond
US12538759B2 (en) Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine
US20250391812A1 (en) Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system
JP2003332363A (ja) ボンディング装置および半導体装置の製造方法
CN100495695C (zh) 阵列线路基板
TW202333253A (zh) 在引線接合系統上校準超音波特性的方法
TW202607845A (zh) 在引線接合系統上的部分引線與工件之間的接合狀態的確定方法
JPH0521883Y2 (https=)