CN1154180C - 冷却半导体管芯的方法和装置 - Google Patents

冷却半导体管芯的方法和装置 Download PDF

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Publication number
CN1154180C
CN1154180C CNB988070995A CN98807099A CN1154180C CN 1154180 C CN1154180 C CN 1154180C CN B988070995 A CNB988070995 A CN B988070995A CN 98807099 A CN98807099 A CN 98807099A CN 1154180 C CN1154180 C CN 1154180C
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CN
China
Prior art keywords
semiconductor die
cooling plate
cooling
block
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB988070995A
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English (en)
Chinese (zh)
Other versions
CN1263638A (zh
Inventor
P��������
P·维纳
M·J·帕尼斯尔
K·J·马
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Intel Corp
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Intel Corp
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Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1263638A publication Critical patent/CN1263638A/zh
Application granted granted Critical
Publication of CN1154180C publication Critical patent/CN1154180C/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CNB988070995A 1997-05-14 1998-04-14 冷却半导体管芯的方法和装置 Expired - Fee Related CN1154180C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/856,267 US5923086A (en) 1997-05-14 1997-05-14 Apparatus for cooling a semiconductor die
US08/856,267 1997-05-14

Publications (2)

Publication Number Publication Date
CN1263638A CN1263638A (zh) 2000-08-16
CN1154180C true CN1154180C (zh) 2004-06-16

Family

ID=25323202

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB988070995A Expired - Fee Related CN1154180C (zh) 1997-05-14 1998-04-14 冷却半导体管芯的方法和装置

Country Status (7)

Country Link
US (1) US5923086A (https=)
JP (1) JP4040695B2 (https=)
KR (1) KR100381431B1 (https=)
CN (1) CN1154180C (https=)
AU (1) AU6971898A (https=)
MY (1) MY114590A (https=)
WO (1) WO1998052223A1 (https=)

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US6364669B1 (en) * 2000-07-12 2002-04-02 Advanced Micro Devices, Inc. Spring contact for providing high current power to an integrated circuit
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US6545346B2 (en) 2001-03-23 2003-04-08 Intel Corporation Integrated circuit package with a capacitor
US6558169B2 (en) 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
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US6504242B1 (en) 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having a wetting layer on a thermally conductive heat spreader
US6836014B2 (en) * 2002-10-03 2004-12-28 Credence Systems Corporation Optical testing of integrated circuits with temperature control
US6771500B1 (en) * 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
JP4607445B2 (ja) * 2003-11-04 2011-01-05 浜松ホトニクス株式会社 温度制御装置及び顕微鏡台
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US20070125526A1 (en) * 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200809477A (en) 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7834442B2 (en) * 2007-12-12 2010-11-16 International Business Machines Corporation Electronic package method and structure with cure-melt hierarchy
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN102316699B (zh) * 2010-07-07 2015-10-14 富泰华工业（深圳）有限公司 冷却方法、使用该冷却设备方法的电路板维修装置及设备
KR101343233B1 (ko) * 2011-11-28 2013-12-18 삼성전기주식회사 전력 모듈 패키지
CN102788945A (zh) * 2012-07-19 2012-11-21 中国科学院电工研究所 一种功率半导体模块通用夹具
JP6048068B2 (ja) * 2012-10-25 2016-12-21 株式会社島津製作所 プラズマ用高周波電源及びそれを用いたｉｃｐ発光分光分析装置
TWI576196B (zh) * 2012-12-05 2017-04-01 新川股份有限公司 The cooling method of the joining tool cooling device and the joining tool
TWI490956B (zh) * 2013-03-12 2015-07-01 新川股份有限公司 覆晶接合器以及覆晶接合方法
CN108626331B (zh) 2017-03-21 2021-03-02 株式会社椿本链条 张紧装置

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JP2926537B2 (ja) * 1994-12-15 1999-07-28 株式会社日立製作所 マルチチップモジュ−ルの冷却装置

Also Published As

Publication number Publication date
JP2001526838A (ja) 2001-12-18
MY114590A (en) 2002-11-30
JP4040695B2 (ja) 2008-01-30
CN1263638A (zh) 2000-08-16
AU6971898A (en) 1998-12-08
WO1998052223A1 (en) 1998-11-19
KR20010012569A (ko) 2001-02-15
KR100381431B1 (ko) 2003-04-23
US5923086A (en) 1999-07-13

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Granted publication date: 20040616

Termination date: 20100414