KR100381431B1 - 반도체 다이 냉각용 장치 및 방법 - Google Patents

반도체 다이 냉각용 장치 및 방법 Download PDF

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Publication number
KR100381431B1
KR100381431B1 KR10-1999-7010524A KR19997010524A KR100381431B1 KR 100381431 B1 KR100381431 B1 KR 100381431B1 KR 19997010524 A KR19997010524 A KR 19997010524A KR 100381431 B1 KR100381431 B1 KR 100381431B1
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KR
South Korea
Prior art keywords
semiconductor die
cooling
plate
cooling plate
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1999-7010524A
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English (en)
Korean (ko)
Other versions
KR20010012569A (ko
Inventor
와이너폴
패니시아마리오제이.
마칼제이.
Original Assignee
인텔 코오퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010012569A publication Critical patent/KR20010012569A/ko
Application granted granted Critical
Publication of KR100381431B1 publication Critical patent/KR100381431B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR10-1999-7010524A 1997-05-14 1998-04-14 반도체 다이 냉각용 장치 및 방법 Expired - Fee Related KR100381431B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/856,267 1997-05-14
US08/856,267 US5923086A (en) 1997-05-14 1997-05-14 Apparatus for cooling a semiconductor die
US08/856,267 1997-05-14

Publications (2)

Publication Number Publication Date
KR20010012569A KR20010012569A (ko) 2001-02-15
KR100381431B1 true KR100381431B1 (ko) 2003-04-23

Family

ID=25323202

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-7010524A Expired - Fee Related KR100381431B1 (ko) 1997-05-14 1998-04-14 반도체 다이 냉각용 장치 및 방법

Country Status (7)

Country Link
US (1) US5923086A (https=)
JP (1) JP4040695B2 (https=)
KR (1) KR100381431B1 (https=)
CN (1) CN1154180C (https=)
AU (1) AU6971898A (https=)
MY (1) MY114590A (https=)
WO (1) WO1998052223A1 (https=)

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US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
US6372997B1 (en) 2000-02-25 2002-04-16 Thermagon, Inc. Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
US6364669B1 (en) * 2000-07-12 2002-04-02 Advanced Micro Devices, Inc. Spring contact for providing high current power to an integrated circuit
US6317326B1 (en) * 2000-09-14 2001-11-13 Sun Microsystems, Inc. Integrated circuit device package and heat dissipation device
AU2002245395A1 (en) * 2001-02-07 2002-08-19 University Of Rochester A system and method for high resolution optical imaging, data storage, lithography, and inspection
US6545346B2 (en) 2001-03-23 2003-04-08 Intel Corporation Integrated circuit package with a capacitor
US6558169B2 (en) 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
FR2826508B1 (fr) 2001-06-20 2004-05-28 Alstom Module electronique de puissance et composant de puissance destine a equiper un tel module
US6504242B1 (en) 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having a wetting layer on a thermally conductive heat spreader
US6836014B2 (en) * 2002-10-03 2004-12-28 Credence Systems Corporation Optical testing of integrated circuits with temperature control
US6771500B1 (en) * 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
JP4607445B2 (ja) * 2003-11-04 2011-01-05 浜松ホトニクス株式会社 温度制御装置及び顕微鏡台
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US20070125526A1 (en) * 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200809477A (en) 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7834442B2 (en) * 2007-12-12 2010-11-16 International Business Machines Corporation Electronic package method and structure with cure-melt hierarchy
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN102316699B (zh) * 2010-07-07 2015-10-14 富泰华工业（深圳）有限公司 冷却方法、使用该冷却设备方法的电路板维修装置及设备
KR101343233B1 (ko) * 2011-11-28 2013-12-18 삼성전기주식회사 전력 모듈 패키지
CN102788945A (zh) * 2012-07-19 2012-11-21 中国科学院电工研究所 一种功率半导体模块通用夹具
JP6048068B2 (ja) * 2012-10-25 2016-12-21 株式会社島津製作所 プラズマ用高周波電源及びそれを用いたｉｃｐ発光分光分析装置
TWI576196B (zh) * 2012-12-05 2017-04-01 新川股份有限公司 The cooling method of the joining tool cooling device and the joining tool
TWI490956B (zh) * 2013-03-12 2015-07-01 新川股份有限公司 覆晶接合器以及覆晶接合方法
CN108626331B (zh) 2017-03-21 2021-03-02 株式会社椿本链条 张紧装置

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KR890007419A (ko) * 1987-10-21 1989-06-19 미다가쓰시게 반도체모듈 및 그 냉각장치
KR900700955A (ko) * 1988-04-08 1990-08-17 미다 가쓰시게 반도체 모듈과 그 냉각시스템을 이용한 컴퓨터
JPH0661670A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd セラミック基板の冷却構造
JPH07336077A (ja) * 1994-06-14 1995-12-22 Fujitsu Ltd 発熱体パッケージの冷却構造
US5491363A (en) * 1992-02-10 1996-02-13 Nec Corporation Low boiling point liquid coolant cooling structure for electronic circuit package
JPH08172148A (ja) * 1994-12-15 1996-07-02 Hitachi Ltd マルチチップモジュ−ルの冷却装置

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KR890007419A (ko) * 1987-10-21 1989-06-19 미다가쓰시게 반도체모듈 및 그 냉각장치
KR900700955A (ko) * 1988-04-08 1990-08-17 미다 가쓰시게 반도체 모듈과 그 냉각시스템을 이용한 컴퓨터
US5491363A (en) * 1992-02-10 1996-02-13 Nec Corporation Low boiling point liquid coolant cooling structure for electronic circuit package
JPH0661670A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd セラミック基板の冷却構造
JPH07336077A (ja) * 1994-06-14 1995-12-22 Fujitsu Ltd 発熱体パッケージの冷却構造
JPH08172148A (ja) * 1994-12-15 1996-07-02 Hitachi Ltd マルチチップモジュ−ルの冷却装置

Also Published As

Publication number Publication date
JP2001526838A (ja) 2001-12-18
MY114590A (en) 2002-11-30
JP4040695B2 (ja) 2008-01-30
CN1263638A (zh) 2000-08-16
AU6971898A (en) 1998-12-08
CN1154180C (zh) 2004-06-16
WO1998052223A1 (en) 1998-11-19
KR20010012569A (ko) 2001-02-15
US5923086A (en) 1999-07-13

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