CN114989394B - 一种低氯环氧树脂的制备方法及应用 - Google Patents
一种低氯环氧树脂的制备方法及应用 Download PDFInfo
- Publication number
- CN114989394B CN114989394B CN202210859348.0A CN202210859348A CN114989394B CN 114989394 B CN114989394 B CN 114989394B CN 202210859348 A CN202210859348 A CN 202210859348A CN 114989394 B CN114989394 B CN 114989394B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- chlorine
- metal oxide
- reaction
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 117
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 117
- 239000000460 chlorine Substances 0.000 title claims abstract description 99
- 229910052801 chlorine Inorganic materials 0.000 title claims abstract description 97
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000012535 impurity Substances 0.000 claims abstract description 64
- 238000006243 chemical reaction Methods 0.000 claims abstract description 59
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 49
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 49
- 230000005526 G1 to G0 transition Effects 0.000 claims abstract description 8
- 238000011068 loading method Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 230000005684 electric field Effects 0.000 description 9
- 229910001510 metal chloride Inorganic materials 0.000 description 8
- 239000006227 byproduct Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910001902 chlorine oxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/025—Polycondensates containing more than one epoxy group per molecule characterised by the purification methods used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
Abstract
Description
项目 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 |
m(最初氯含量)/ppm | 802 | 813 | 845 | 862 | 852 |
m(最终氯含量)/ppm | 237 | 214 | 209 | 218 | 221 |
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210859348.0A CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
US18/172,961 US20240026066A1 (en) | 2022-07-20 | 2023-02-22 | Preparation Method of Low-Chlorine Epoxy Resin and Use Thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210859348.0A CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114989394A CN114989394A (zh) | 2022-09-02 |
CN114989394B true CN114989394B (zh) | 2023-09-19 |
Family
ID=83021361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210859348.0A Active CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20240026066A1 (zh) |
CN (1) | CN114989394B (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122915A (ja) * | 1982-01-14 | 1983-07-21 | Sumitomo Chem Co Ltd | エポキシ樹脂の製造方法 |
JPS5933318A (ja) * | 1982-08-20 | 1984-02-23 | Mitsubishi Petrochem Co Ltd | ポリエポキシ化合物の製造方法 |
US4535150A (en) * | 1984-12-04 | 1985-08-13 | Celanese Corporation | Process for preparing epoxy resins having low hydrolyzable chlorine contents |
JPS62119222A (ja) * | 1985-11-19 | 1987-05-30 | Mitsui Petrochem Ind Ltd | 加水分解性塩素の低減化方法 |
JPS62235314A (ja) * | 1986-04-05 | 1987-10-15 | Toto Kasei Kk | エポキシ樹脂の精製方法 |
JPH01108219A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
JPH1036484A (ja) * | 1996-07-26 | 1998-02-10 | Dainippon Ink & Chem Inc | エポキシ樹脂の精製方法 |
JP2014065835A (ja) * | 2012-09-26 | 2014-04-17 | Asahi Kasei E-Materials Corp | エポキシ樹脂の製造方法 |
CN108192075A (zh) * | 2017-12-27 | 2018-06-22 | 惠柏新材料科技(上海)股份有限公司 | 超高纯度环氧树脂的精制方法 |
-
2022
- 2022-07-20 CN CN202210859348.0A patent/CN114989394B/zh active Active
-
2023
- 2023-02-22 US US18/172,961 patent/US20240026066A1/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122915A (ja) * | 1982-01-14 | 1983-07-21 | Sumitomo Chem Co Ltd | エポキシ樹脂の製造方法 |
JPS5933318A (ja) * | 1982-08-20 | 1984-02-23 | Mitsubishi Petrochem Co Ltd | ポリエポキシ化合物の製造方法 |
US4535150A (en) * | 1984-12-04 | 1985-08-13 | Celanese Corporation | Process for preparing epoxy resins having low hydrolyzable chlorine contents |
JPS62119222A (ja) * | 1985-11-19 | 1987-05-30 | Mitsui Petrochem Ind Ltd | 加水分解性塩素の低減化方法 |
JPS62235314A (ja) * | 1986-04-05 | 1987-10-15 | Toto Kasei Kk | エポキシ樹脂の精製方法 |
JPH01108219A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
JPH1036484A (ja) * | 1996-07-26 | 1998-02-10 | Dainippon Ink & Chem Inc | エポキシ樹脂の精製方法 |
JP2014065835A (ja) * | 2012-09-26 | 2014-04-17 | Asahi Kasei E-Materials Corp | エポキシ樹脂の製造方法 |
CN108192075A (zh) * | 2017-12-27 | 2018-06-22 | 惠柏新材料科技(上海)股份有限公司 | 超高纯度环氧树脂的精制方法 |
Also Published As
Publication number | Publication date |
---|---|
CN114989394A (zh) | 2022-09-02 |
US20240026066A1 (en) | 2024-01-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103467372B (zh) | 一种防老剂rd和防老剂fr的联合生产的方法 | |
CN114989394B (zh) | 一种低氯环氧树脂的制备方法及应用 | |
CN104151582A (zh) | 一种石墨烯-聚酰亚胺导电黑膜的制备方法 | |
CN105906837A (zh) | 一种聚苯硫醚合成料浆中n-甲基吡咯烷酮溶剂的回收方法 | |
CN113709997A (zh) | 一种柔性导电膜及电路板的制备方法 | |
CN107216250B (zh) | 一种利用聚对苯二甲酸乙二醇酯废料制备对苯二甲酸二异辛酯的方法 | |
CN107799204B (zh) | 一种触摸屏用石墨烯导电薄膜及其制备方法 | |
CN112830939B (zh) | 一种二聚体小分子电子给体材料及其制备方法 | |
CN110129083A (zh) | 一种促进褐煤在低温等离子体中解聚的方法 | |
CN102176348B (zh) | 基于纺织品模板制备铟锡氧化物/pdms树脂导电材料 | |
CN106082347A (zh) | 二氧化锰的制备方法 | |
CN106633154A (zh) | 一种环保型抗静电pet薄膜的制备方法及其产品 | |
CN113880790A (zh) | 3,4-环氧环己基甲基-3’,4’-环氧环已基甲酸酯的相转移催化合成法 | |
CN101845249A (zh) | 一种透明导电印刷油墨及其制备方法和用途 | |
CN201290107Y (zh) | 一种按优先顺序响应的按键处理电路 | |
CN111285392A (zh) | 一种以电路板蚀刻废液为原料连续生产电镀级氧化铜的方法 | |
CN110903483A (zh) | 一种有效提高聚醚改性硅油生产稳定性和纯度的制备工艺 | |
CN115073652B (zh) | 一种环氧树脂除氯用极性吸附剂及其制备方法、及利用其制备超高纯环氧树脂的方法 | |
CN103280327A (zh) | 高介电常数电极箔制备方法 | |
CN110964199B (zh) | 一种聚酰亚胺树脂的制备方法及其在油墨中的应用 | |
CN112210181B (zh) | 一种温度反应型电容器封装材料及其制备方法 | |
CN102647021A (zh) | 一种自供电太阳能汇流箱 | |
KR20190076143A (ko) | 폴리페닐렌 설파이드의 제조방법 | |
CN113539693A (zh) | 一种降低高压铝电解电容器损耗的方法 | |
CN115093542A (zh) | 降低环氧树脂总氯含量的方法、超高纯环氧树脂及其应用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20221214 Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Applicant after: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Address before: 710000 Hubin Garden community, No. 3, Huanhu North Road, Weiyang District, Xi'an City, Shaanxi Province Applicant before: Du Biao |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Zhilun New Materials Technology (Xi'an) Co.,Ltd. Country or region after: China Address before: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee before: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Country or region before: China |