CN114989394A - 一种低氯环氧树脂的制备方法及应用 - Google Patents
一种低氯环氧树脂的制备方法及应用 Download PDFInfo
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- CN114989394A CN114989394A CN202210859348.0A CN202210859348A CN114989394A CN 114989394 A CN114989394 A CN 114989394A CN 202210859348 A CN202210859348 A CN 202210859348A CN 114989394 A CN114989394 A CN 114989394A
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- epoxy resin
- chlorine
- metal oxide
- low
- impurities
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 117
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 117
- 239000000460 chlorine Substances 0.000 title claims abstract description 103
- 229910052801 chlorine Inorganic materials 0.000 title claims abstract description 102
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 83
- 239000012535 impurity Substances 0.000 claims abstract description 65
- 238000006243 chemical reaction Methods 0.000 claims abstract description 59
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 49
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 49
- 230000005526 G1 to G0 transition Effects 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- 238000007865 diluting Methods 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000005684 electric field Effects 0.000 description 9
- 229910001510 metal chloride Inorganic materials 0.000 description 8
- 239000006227 byproduct Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910001902 chlorine oxide Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/025—Polycondensates containing more than one epoxy group per molecule characterised by the purification methods used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
Abstract
Description
项目 | 实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 |
m(最初氯含量)/ppm | 802 | 813 | 845 | 862 | 852 |
m(最终氯含量)/ppm | 237 | 214 | 209 | 218 | 221 |
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210859348.0A CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
US18/172,961 US20240026066A1 (en) | 2022-07-20 | 2023-02-22 | Preparation Method of Low-Chlorine Epoxy Resin and Use Thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210859348.0A CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114989394A true CN114989394A (zh) | 2022-09-02 |
CN114989394B CN114989394B (zh) | 2023-09-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202210859348.0A Active CN114989394B (zh) | 2022-07-20 | 2022-07-20 | 一种低氯环氧树脂的制备方法及应用 |
Country Status (2)
Country | Link |
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US (1) | US20240026066A1 (zh) |
CN (1) | CN114989394B (zh) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122915A (ja) * | 1982-01-14 | 1983-07-21 | Sumitomo Chem Co Ltd | エポキシ樹脂の製造方法 |
JPS5933318A (ja) * | 1982-08-20 | 1984-02-23 | Mitsubishi Petrochem Co Ltd | ポリエポキシ化合物の製造方法 |
US4535150A (en) * | 1984-12-04 | 1985-08-13 | Celanese Corporation | Process for preparing epoxy resins having low hydrolyzable chlorine contents |
JPS62119222A (ja) * | 1985-11-19 | 1987-05-30 | Mitsui Petrochem Ind Ltd | 加水分解性塩素の低減化方法 |
JPS62235314A (ja) * | 1986-04-05 | 1987-10-15 | Toto Kasei Kk | エポキシ樹脂の精製方法 |
JPH01108219A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
JPH1036484A (ja) * | 1996-07-26 | 1998-02-10 | Dainippon Ink & Chem Inc | エポキシ樹脂の精製方法 |
JP2014065835A (ja) * | 2012-09-26 | 2014-04-17 | Asahi Kasei E-Materials Corp | エポキシ樹脂の製造方法 |
CN108192075A (zh) * | 2017-12-27 | 2018-06-22 | 惠柏新材料科技(上海)股份有限公司 | 超高纯度环氧树脂的精制方法 |
-
2022
- 2022-07-20 CN CN202210859348.0A patent/CN114989394B/zh active Active
-
2023
- 2023-02-22 US US18/172,961 patent/US20240026066A1/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122915A (ja) * | 1982-01-14 | 1983-07-21 | Sumitomo Chem Co Ltd | エポキシ樹脂の製造方法 |
JPS5933318A (ja) * | 1982-08-20 | 1984-02-23 | Mitsubishi Petrochem Co Ltd | ポリエポキシ化合物の製造方法 |
US4535150A (en) * | 1984-12-04 | 1985-08-13 | Celanese Corporation | Process for preparing epoxy resins having low hydrolyzable chlorine contents |
JPS62119222A (ja) * | 1985-11-19 | 1987-05-30 | Mitsui Petrochem Ind Ltd | 加水分解性塩素の低減化方法 |
JPS62235314A (ja) * | 1986-04-05 | 1987-10-15 | Toto Kasei Kk | エポキシ樹脂の精製方法 |
JPH01108219A (ja) * | 1987-10-21 | 1989-04-25 | Mitsui Petrochem Ind Ltd | エポキシ樹脂の精製方法 |
JPH1036484A (ja) * | 1996-07-26 | 1998-02-10 | Dainippon Ink & Chem Inc | エポキシ樹脂の精製方法 |
JP2014065835A (ja) * | 2012-09-26 | 2014-04-17 | Asahi Kasei E-Materials Corp | エポキシ樹脂の製造方法 |
CN108192075A (zh) * | 2017-12-27 | 2018-06-22 | 惠柏新材料科技(上海)股份有限公司 | 超高纯度环氧树脂的精制方法 |
Also Published As
Publication number | Publication date |
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CN114989394B (zh) | 2023-09-19 |
US20240026066A1 (en) | 2024-01-25 |
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PB01 | Publication | ||
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Effective date of registration: 20221214 Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Applicant after: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Address before: 710000 Hubin Garden community, No. 3, Huanhu North Road, Weiyang District, Xi'an City, Shaanxi Province Applicant before: Du Biao |
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Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Zhilun New Materials Technology (Xi'an) Co.,Ltd. Country or region after: China Address before: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee before: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Country or region before: China |