CN114981937A - 半导体装置的制造方法 - Google Patents

半导体装置的制造方法 Download PDF

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Publication number
CN114981937A
CN114981937A CN202080093359.1A CN202080093359A CN114981937A CN 114981937 A CN114981937 A CN 114981937A CN 202080093359 A CN202080093359 A CN 202080093359A CN 114981937 A CN114981937 A CN 114981937A
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CN
China
Prior art keywords
squeegee
opening
substrate
bonding material
metal mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080093359.1A
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English (en)
Chinese (zh)
Inventor
薮田康平
山田隆行
春名裕明
三井贵夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN114981937A publication Critical patent/CN114981937A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202080093359.1A 2020-01-22 2020-08-13 半导体装置的制造方法 Pending CN114981937A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020008140 2020-01-22
JP2020-008140 2020-01-22
PCT/JP2020/030762 WO2021149286A1 (ja) 2020-01-22 2020-08-13 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN114981937A true CN114981937A (zh) 2022-08-30

Family

ID=76991847

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080093359.1A Pending CN114981937A (zh) 2020-01-22 2020-08-13 半导体装置的制造方法

Country Status (3)

Country Link
JP (1) JP7254216B2 (https=)
CN (1) CN114981937A (https=)
WO (1) WO2021149286A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024127732A1 (de) * 2024-09-25 2026-03-26 Infineon Technologies Ag Schablonenmaske und verfahren zum bilden von verbindungsschichten auf einem substrat für ein halbleitermodul

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1434504A (zh) * 2002-01-24 2003-08-06 三菱电机株式会社 半导体装置及其制造方法和印刷掩膜
JP2008066344A (ja) * 2006-09-04 2008-03-21 Toyota Industries Corp 多層基板と金属接合材料の印刷方法
CN104637832A (zh) * 2013-11-12 2015-05-20 三菱电机株式会社 半导体装置及其制造方法
JP2016190182A (ja) * 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法
CN107921541A (zh) * 2015-09-07 2018-04-17 日立化成株式会社 接合体及半导体装置
CN107958837A (zh) * 2016-10-14 2018-04-24 日本碍子株式会社 半导体制造装置用部件及其制法
CN110447091A (zh) * 2017-03-24 2019-11-12 三菱电机株式会社 半导体装置的制造方法及半导体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124064U (ja) * 1984-01-31 1985-08-21 松下電器産業株式会社 はんだ層印刷用マスク
JP2816084B2 (ja) * 1992-10-26 1998-10-27 三洋電機株式会社 半田塗布方法、半導体装置の製造方法およびスキージ
JPH08153962A (ja) * 1994-11-28 1996-06-11 Hitachi Ltd 半田ペースト印刷方法及び半田ペースト印刷装置
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク
JP2010143227A (ja) * 2010-02-05 2010-07-01 Bonmaaku:Kk スクリーン印刷版
JP6214576B2 (ja) * 2015-01-08 2017-10-18 三菱電機株式会社 半導体デバイスの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1434504A (zh) * 2002-01-24 2003-08-06 三菱电机株式会社 半导体装置及其制造方法和印刷掩膜
JP2008066344A (ja) * 2006-09-04 2008-03-21 Toyota Industries Corp 多層基板と金属接合材料の印刷方法
CN104637832A (zh) * 2013-11-12 2015-05-20 三菱电机株式会社 半导体装置及其制造方法
JP2016190182A (ja) * 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法
CN107921541A (zh) * 2015-09-07 2018-04-17 日立化成株式会社 接合体及半导体装置
CN107958837A (zh) * 2016-10-14 2018-04-24 日本碍子株式会社 半导体制造装置用部件及其制法
CN110447091A (zh) * 2017-03-24 2019-11-12 三菱电机株式会社 半导体装置的制造方法及半导体装置

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JP7254216B2 (ja) 2023-04-07
WO2021149286A1 (ja) 2021-07-29
JPWO2021149286A1 (https=) 2021-07-29

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