JP7254216B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP7254216B2
JP7254216B2 JP2021572959A JP2021572959A JP7254216B2 JP 7254216 B2 JP7254216 B2 JP 7254216B2 JP 2021572959 A JP2021572959 A JP 2021572959A JP 2021572959 A JP2021572959 A JP 2021572959A JP 7254216 B2 JP7254216 B2 JP 7254216B2
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Japan
Prior art keywords
squeegee
opening
substrate
bonding material
metal mask
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JP2021572959A
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Japanese (ja)
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JPWO2021149286A1 (https=
JPWO2021149286A5 (https=
Inventor
康平 薮田
隆行 山田
裕明 春名
貴夫 三井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2021149286A1 publication Critical patent/JPWO2021149286A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021572959A 2020-01-22 2020-08-13 半導体装置の製造方法 Active JP7254216B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020008140 2020-01-22
JP2020008140 2020-01-22
PCT/JP2020/030762 WO2021149286A1 (ja) 2020-01-22 2020-08-13 半導体装置の製造方法

Publications (3)

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JPWO2021149286A1 JPWO2021149286A1 (https=) 2021-07-29
JPWO2021149286A5 JPWO2021149286A5 (https=) 2022-07-14
JP7254216B2 true JP7254216B2 (ja) 2023-04-07

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Family Applications (1)

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JP2021572959A Active JP7254216B2 (ja) 2020-01-22 2020-08-13 半導体装置の製造方法

Country Status (3)

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JP (1) JP7254216B2 (https=)
CN (1) CN114981937A (https=)
WO (1) WO2021149286A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024127732A1 (de) * 2024-09-25 2026-03-26 Infineon Technologies Ag Schablonenmaske und verfahren zum bilden von verbindungsschichten auf einem substrat für ein halbleitermodul

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010143227A (ja) 2010-02-05 2010-07-01 Bonmaaku:Kk スクリーン印刷版
JP2016127219A (ja) 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
JP2016190182A (ja) 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124064U (ja) * 1984-01-31 1985-08-21 松下電器産業株式会社 はんだ層印刷用マスク
JP2816084B2 (ja) * 1992-10-26 1998-10-27 三洋電機株式会社 半田塗布方法、半導体装置の製造方法およびスキージ
JPH08153962A (ja) * 1994-11-28 1996-06-11 Hitachi Ltd 半田ペースト印刷方法及び半田ペースト印刷装置
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク
JP3896285B2 (ja) * 2002-01-24 2007-03-22 三菱電機株式会社 半導体装置の製造方法
JP2008066344A (ja) * 2006-09-04 2008-03-21 Toyota Industries Corp 多層基板と金属接合材料の印刷方法
JP6265693B2 (ja) * 2013-11-12 2018-01-24 三菱電機株式会社 半導体装置およびその製造方法
US10566304B2 (en) * 2015-09-07 2020-02-18 Hitachi Chemical Company, Ltd. Assembly and semiconductor device
JP6741548B2 (ja) * 2016-10-14 2020-08-19 日本碍子株式会社 半導体製造装置用部材及びその製法
DE112017007305B4 (de) * 2017-03-24 2022-12-15 Mitsubishi Electric Corporation Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010143227A (ja) 2010-02-05 2010-07-01 Bonmaaku:Kk スクリーン印刷版
JP2016127219A (ja) 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
JP2016190182A (ja) 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法

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CN114981937A (zh) 2022-08-30
WO2021149286A1 (ja) 2021-07-29
JPWO2021149286A1 (https=) 2021-07-29

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