CN114959599A - 磁记录膜形成用溅射靶及其制造方法 - Google Patents

磁记录膜形成用溅射靶及其制造方法 Download PDF

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Publication number
CN114959599A
CN114959599A CN202210426425.3A CN202210426425A CN114959599A CN 114959599 A CN114959599 A CN 114959599A CN 202210426425 A CN202210426425 A CN 202210426425A CN 114959599 A CN114959599 A CN 114959599A
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CN
China
Prior art keywords
powder
sputtering target
sputtering
mol
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210426425.3A
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English (en)
Chinese (zh)
Inventor
荻野真一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN114959599A publication Critical patent/CN114959599A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851Coating a support with a magnetic layer by sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/14Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • B22F3/15Hot isostatic pressing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)
CN202210426425.3A 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法 Pending CN114959599A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014197407 2014-09-26
JP2014-197407 2014-09-26
CN201580051739.8A CN107075665A (zh) 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法
PCT/JP2015/076628 WO2016047578A1 (ja) 2014-09-26 2015-09-18 磁気記録膜形成用スパッタリングターゲット及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201580051739.8A Division CN107075665A (zh) 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法

Publications (1)

Publication Number Publication Date
CN114959599A true CN114959599A (zh) 2022-08-30

Family

ID=55581105

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210426425.3A Pending CN114959599A (zh) 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法
CN201580051739.8A Pending CN107075665A (zh) 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201580051739.8A Pending CN107075665A (zh) 2014-09-26 2015-09-18 磁记录膜形成用溅射靶及其制造方法

Country Status (5)

Country Link
JP (1) JP6084711B2 (ja)
CN (2) CN114959599A (ja)
MY (1) MY179890A (ja)
SG (1) SG11201701838XA (ja)
WO (1) WO2016047578A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636149B (zh) * 2016-09-12 2018-09-21 日商Jx金屬股份有限公司 強磁性材濺鍍靶
JP7057692B2 (ja) * 2018-03-20 2022-04-20 田中貴金属工業株式会社 スパッタリングターゲット用Fe-Pt-酸化物-BN系焼結体
JP6878349B2 (ja) * 2018-04-27 2021-05-26 田中貴金属工業株式会社 C含有スパッタリングターゲット及びその製造方法
TWI702294B (zh) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 磁氣記錄媒體用濺鍍靶
JP7104001B2 (ja) * 2019-06-28 2022-07-20 田中貴金属工業株式会社 Fe-Pt-BN系スパッタリングターゲット及びその製造方法
WO2021010019A1 (ja) * 2019-07-12 2021-01-21 田中貴金属工業株式会社 Fe-Pt-BN系スパッタリングターゲット及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103038388A (zh) * 2010-09-03 2013-04-10 吉坤日矿日石金属株式会社 强磁性材料溅射靶
WO2014034390A1 (ja) * 2012-08-31 2014-03-06 Jx日鉱日石金属株式会社 Fe系磁性材焼結体
WO2014045744A1 (ja) * 2012-09-21 2014-03-27 Jx日鉱日石金属株式会社 Fe-Pt系磁性材焼結体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9945026B2 (en) * 2010-12-20 2018-04-17 Jx Nippon Mining & Metals Corporation Fe-Pt-based sputtering target with dispersed C grains
JP5041262B2 (ja) * 2011-01-31 2012-10-03 三菱マテリアル株式会社 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法
JP5041261B2 (ja) * 2011-01-31 2012-10-03 三菱マテリアル株式会社 磁気記録媒体膜形成用スパッタリングターゲットおよびその製造方法
US9683284B2 (en) * 2011-03-30 2017-06-20 Jx Nippon Mining & Metals Corporation Sputtering target for magnetic recording film
CN103930592B (zh) * 2011-12-22 2016-03-16 吉坤日矿日石金属株式会社 分散有C粒子的Fe-Pt型溅射靶
MY167825A (en) * 2012-06-18 2018-09-26 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film
SG11201404072YA (en) * 2012-07-20 2014-10-30 Jx Nippon Mining & Metals Corp Sputtering target for forming magnetic recording film and process for producing same
JP6366095B2 (ja) * 2014-07-29 2018-08-01 株式会社フルヤ金属 磁気記録媒体用スパッタリングターゲット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103038388A (zh) * 2010-09-03 2013-04-10 吉坤日矿日石金属株式会社 强磁性材料溅射靶
WO2014034390A1 (ja) * 2012-08-31 2014-03-06 Jx日鉱日石金属株式会社 Fe系磁性材焼結体
WO2014045744A1 (ja) * 2012-09-21 2014-03-27 Jx日鉱日石金属株式会社 Fe-Pt系磁性材焼結体

Also Published As

Publication number Publication date
MY179890A (en) 2020-11-18
JP6084711B2 (ja) 2017-02-22
SG11201701838XA (en) 2017-04-27
JPWO2016047578A1 (ja) 2017-04-27
WO2016047578A1 (ja) 2016-03-31
CN107075665A (zh) 2017-08-18

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