MY179890A - Sputtering target for magnetic recording film formation and production method therefor - Google Patents

Sputtering target for magnetic recording film formation and production method therefor

Info

Publication number
MY179890A
MY179890A MYPI2017701004A MYPI2017701004A MY179890A MY 179890 A MY179890 A MY 179890A MY PI2017701004 A MYPI2017701004 A MY PI2017701004A MY PI2017701004 A MYPI2017701004 A MY PI2017701004A MY 179890 A MY179890 A MY 179890A
Authority
MY
Malaysia
Prior art keywords
sputtering target
magnetic recording
production method
film formation
recording film
Prior art date
Application number
MYPI2017701004A
Inventor
Shin-Ichi Ogino
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY179890A publication Critical patent/MY179890A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/04Alloys based on a platinum group metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851Coating a support with a magnetic layer by sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/08Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
    • H01F10/10Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
    • H01F10/12Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
    • H01F10/14Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • B22F3/15Hot isostatic pressing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Magnetic Record Carriers (AREA)

Abstract

An FePt-based sintered sputtering target containing C and/or BN, wherein an area ratio of AuCu alloy grains on a polished surface of a cross section that is perpendicular to a sputtered surface of the sputtering target is 0.5% or higher and 15% or less. An object of this invention is to provide a sputtering target capable of reducing the particles that are generated during sputtering and efficiently depositing a magnetic thin film of a magnetic recording medium.
MYPI2017701004A 2014-09-26 2015-09-18 Sputtering target for magnetic recording film formation and production method therefor MY179890A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014197407 2014-09-26

Publications (1)

Publication Number Publication Date
MY179890A true MY179890A (en) 2020-11-18

Family

ID=55581105

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017701004A MY179890A (en) 2014-09-26 2015-09-18 Sputtering target for magnetic recording film formation and production method therefor

Country Status (5)

Country Link
JP (1) JP6084711B2 (en)
CN (2) CN107075665A (en)
MY (1) MY179890A (en)
SG (1) SG11201701838XA (en)
WO (1) WO2016047578A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY186238A (en) 2016-09-12 2021-06-30 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target
JP7057692B2 (en) * 2018-03-20 2022-04-20 田中貴金属工業株式会社 Fe-Pt-Oxide-BN-based sintered body for sputtering target
JP6878349B2 (en) * 2018-04-27 2021-05-26 田中貴金属工業株式会社 C-containing sputtering target and its manufacturing method
TWI702294B (en) * 2018-07-31 2020-08-21 日商田中貴金屬工業股份有限公司 Sputtering target for magnetic recording media
JP7104001B2 (en) * 2019-06-28 2022-07-20 田中貴金属工業株式会社 Fe-Pt-BN-based sputtering target and its manufacturing method
JP7267425B2 (en) * 2019-07-12 2023-05-01 田中貴金属工業株式会社 Fe-Pt-BN-based sputtering target and manufacturing method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4885333B1 (en) * 2010-09-03 2012-02-29 Jx日鉱日石金属株式会社 Ferromagnetic sputtering target
CN103270554B (en) * 2010-12-20 2016-09-28 吉坤日矿日石金属株式会社 It is dispersed with the Fe-Pt type sputtering target of C particle
JP5041261B2 (en) * 2011-01-31 2012-10-03 三菱マテリアル株式会社 Sputtering target for forming a magnetic recording medium film and method for producing the same
JP5041262B2 (en) * 2011-01-31 2012-10-03 三菱マテリアル株式会社 Sputtering target for forming a magnetic recording medium film and method for producing the same
US9683284B2 (en) * 2011-03-30 2017-06-20 Jx Nippon Mining & Metals Corporation Sputtering target for magnetic recording film
CN103930592B (en) * 2011-12-22 2016-03-16 吉坤日矿日石金属株式会社 Be dispersed with the Fe-Pt type sputtering target of C particle
SG11201404067PA (en) * 2012-06-18 2014-10-30 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film
US10325762B2 (en) * 2012-07-20 2019-06-18 Jx Nippon Mining & Metals Corporation Sputtering target for forming magnetic recording film and process for producing same
SG11201404222PA (en) * 2012-08-31 2014-10-30 Jx Nippon Mining & Metals Corp Fe-BASED MAGNETIC MATERIAL SINTERED BODY
MY169260A (en) * 2012-09-21 2019-03-20 Jx Nippon Mining & Metals Corp Fe-pt-based magnetic materials sintered compact
JP6366095B2 (en) * 2014-07-29 2018-08-01 株式会社フルヤ金属 Sputtering target for magnetic recording media

Also Published As

Publication number Publication date
CN107075665A (en) 2017-08-18
JP6084711B2 (en) 2017-02-22
CN114959599A (en) 2022-08-30
WO2016047578A1 (en) 2016-03-31
SG11201701838XA (en) 2017-04-27
JPWO2016047578A1 (en) 2017-04-27

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