MY191374A - Magnetic material sputtering target and method for manufacturing same - Google Patents

Magnetic material sputtering target and method for manufacturing same

Info

Publication number
MY191374A
MY191374A MYPI2019002892A MYPI2019002892A MY191374A MY 191374 A MY191374 A MY 191374A MY PI2019002892 A MYPI2019002892 A MY PI2019002892A MY PI2019002892 A MYPI2019002892 A MY PI2019002892A MY 191374 A MY191374 A MY 191374A
Authority
MY
Malaysia
Prior art keywords
sputtering target
oxides
magnetic material
manufacturing same
material sputtering
Prior art date
Application number
MYPI2019002892A
Inventor
Yuki Furuya
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY191374A publication Critical patent/MY191374A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)

Abstract

Provided is a magnetic sputtering target which includes oxides having a melting point of 500?C or lower, and the magnetic sputtering target is characterized by an average number density of oxides having a grain size of 10 ?m or more on a sputter surface of the sputtering target is 5/mm2 or less. The present invention addresses the problem of providing a sputtering target and a method for manufacturing the same, whereby the generation of particles or abnormal electric discharge caused by oxides in the sputtering target, particularly coarsely grown oxides, can be reduced. Figure 3
MYPI2019002892A 2016-12-28 2017-12-07 Magnetic material sputtering target and method for manufacturing same MY191374A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016255597 2016-12-28
PCT/JP2017/043990 WO2018123500A1 (en) 2016-12-28 2017-12-07 Magnetic material sputtering target and method for manufacturing same

Publications (1)

Publication Number Publication Date
MY191374A true MY191374A (en) 2022-06-21

Family

ID=62710993

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019002892A MY191374A (en) 2016-12-28 2017-12-07 Magnetic material sputtering target and method for manufacturing same

Country Status (6)

Country Link
JP (1) JP6734399B2 (en)
CN (1) CN109844167B (en)
MY (1) MY191374A (en)
SG (1) SG11201903240PA (en)
TW (1) TWI753073B (en)
WO (1) WO2018123500A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112739846A (en) * 2018-09-25 2021-04-30 Ｊｘ金属株式会社 Sputtering target and powder for producing sputtering target
TWI812869B (en) * 2019-07-18 2023-08-21 日商田中貴金屬工業股份有限公司 Sputtering target for magnetic recording media

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003216441A1 (en) * 2002-02-28 2003-09-16 Seagate Technology Llc Chemically ordered, cobalt-platinum alloys for magnetic recording
JP4962905B2 (en) * 2007-03-12 2012-06-27 三菱マテリアル株式会社 Method for producing Co-based sintered alloy sputtering target for forming magnetic recording film with less generation of particles
US9103023B2 (en) * 2009-03-27 2015-08-11 Jx Nippon Mining & Metals Corporation Nonmagnetic material particle-dispersed ferromagnetic material sputtering target
EP2511397B1 (en) * 2009-12-11 2018-09-26 JX Nippon Mining & Metals Corporation Magnetic material sputtering target
WO2012077665A1 (en) * 2010-12-09 2012-06-14 Jx日鉱日石金属株式会社 Ferromagnetic material sputtering target
US20130213804A1 (en) * 2010-12-17 2013-08-22 Jx Nippon Mining & Metals Corporation Ferromagnetic material sputtering target
SG189257A1 (en) * 2010-12-17 2013-05-31 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film and method for producing same
US9761422B2 (en) * 2012-02-22 2017-09-12 Jx Nippon Mining & Metals Corporation Magnetic material sputtering target and manufacturing method for same
JP6005767B2 (en) * 2014-01-17 2016-10-12 Ｊｘ金属株式会社 Sputtering target for magnetic recording media
WO2016035415A1 (en) * 2014-09-04 2016-03-10 Ｊｘ金属株式会社 Sputtering target
MY189794A (en) * 2016-03-31 2022-03-08 Jx Nippon Mining & Metals Corp Ferromagnetic material sputtering target

Also Published As

Publication number Publication date
TWI753073B (en) 2022-01-21
JP6734399B2 (en) 2020-08-05
SG11201903240PA (en) 2019-05-30
TW201835361A (en) 2018-10-01
CN109844167A (en) 2019-06-04
JPWO2018123500A1 (en) 2019-03-28
CN109844167B (en) 2022-01-04
WO2018123500A1 (en) 2018-07-05

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