CN114728741B - 盖带及电子部件包装体 - Google Patents

盖带及电子部件包装体 Download PDF

Info

Publication number
CN114728741B
CN114728741B CN202080079157.1A CN202080079157A CN114728741B CN 114728741 B CN114728741 B CN 114728741B CN 202080079157 A CN202080079157 A CN 202080079157A CN 114728741 B CN114728741 B CN 114728741B
Authority
CN
China
Prior art keywords
cover tape
layer
meth
sealant layer
styrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080079157.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN114728741A (zh
Inventor
上村祥司
铃木诚志
矢部徹
佐佐木研太
阿部皓基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020146683A external-priority patent/JP2021080024A/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN114728741A publication Critical patent/CN114728741A/zh
Application granted granted Critical
Publication of CN114728741B publication Critical patent/CN114728741B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
CN202080079157.1A 2019-11-15 2020-11-05 盖带及电子部件包装体 Active CN114728741B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019207149 2019-11-15
JP2019-207149 2019-11-15
JP2020146683A JP2021080024A (ja) 2019-11-15 2020-09-01 カバーテープおよび電子部品包装体
JP2020-146683 2020-09-01
PCT/JP2020/041378 WO2021095638A1 (ja) 2019-11-15 2020-11-05 カバーテープおよび電子部品包装体

Publications (2)

Publication Number Publication Date
CN114728741A CN114728741A (zh) 2022-07-08
CN114728741B true CN114728741B (zh) 2025-04-08

Family

ID=75911991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080079157.1A Active CN114728741B (zh) 2019-11-15 2020-11-05 盖带及电子部件包装体

Country Status (3)

Country Link
JP (2) JP7544680B2 (enExample)
CN (1) CN114728741B (enExample)
WO (1) WO2021095638A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023054158A1 (ja) * 2021-09-28 2023-04-06 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP2023147816A (ja) * 2022-03-30 2023-10-13 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
TWI832291B (zh) 2022-06-15 2024-02-11 南亞塑膠工業股份有限公司 保護膠帶及晶圓的加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115038A (ja) * 2002-09-25 2004-04-15 Toppan Printing Co Ltd 蓋用積層成形材料及びそれを用いた蓋
JP2019156405A (ja) * 2018-03-07 2019-09-19 住友ベークライト株式会社 カバーテープおよび電子部品包装体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005082162A (ja) * 2003-09-05 2005-03-31 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP5296564B2 (ja) * 2009-01-28 2013-09-25 電気化学工業株式会社 カバーフィルム
JP5648673B2 (ja) 2012-12-11 2015-01-07 三菱電機株式会社 冷蔵庫
WO2015005330A1 (ja) * 2013-07-09 2015-01-15 住友ベークライト株式会社 電子部品包装用カバーテープ
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
MY174235A (en) * 2016-09-28 2020-04-01 Sumitomo Bakelite Co Resin composition, cover tape, and electronic component package
JP7261537B2 (ja) * 2016-12-02 2023-04-20 大日本印刷株式会社 透明導電性カバーテープ
WO2018101295A1 (ja) * 2016-12-02 2018-06-07 大日本印刷株式会社 透明導電性カバーテープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004115038A (ja) * 2002-09-25 2004-04-15 Toppan Printing Co Ltd 蓋用積層成形材料及びそれを用いた蓋
JP2019156405A (ja) * 2018-03-07 2019-09-19 住友ベークライト株式会社 カバーテープおよび電子部品包装体

Also Published As

Publication number Publication date
JP2022009083A (ja) 2022-01-14
JP7544680B2 (ja) 2024-09-03
JP2023027234A (ja) 2023-03-01
WO2021095638A1 (ja) 2021-05-20
CN114728741A (zh) 2022-07-08

Similar Documents

Publication Publication Date Title
CN114728741B (zh) 盖带及电子部件包装体
JP7289816B2 (ja) カバーテープおよび電子部品包装体
TWI738837B (zh) 樹脂組成物、覆蓋帶及電子零件用包裝體
JP6777216B1 (ja) カバーテープおよび電子部品包装体
KR20240052785A (ko) 커버 테이프 및 전자 부품 포장체
JP2021080024A (ja) カバーテープおよび電子部品包装体
JP2023021347A (ja) 紙キャリアテープ用カバーテープ、電子部品搬送用包装体および電子部品包装体
JP2018118766A (ja) カバーテープおよび電子部品用包装体
WO2005102860A1 (ja) カバーテープ及び電子部品包装用キャリアテープシステム
CN114787052B (zh) 盖带及电子部件包装体
JP2020100707A (ja) 樹脂組成物およびカバーテープ
TWI876603B (zh) 蓋帶、蓋帶的製造方法、蓋帶的原料輥及電子零件包裝體
TWI905454B (zh) 蓋帶及電子零件包裝體
TWI890281B (zh) 電子零件包裝用蓋帶及電子零件包裝體
JP2024061650A (ja) カバーテープ、カバーテープの製造方法、カバーテープの原反ロール、および電子部品包装体
JP7003099B2 (ja) カバーテープおよび電子部品包装体
JP6930625B1 (ja) カバーテープおよび電子部品包装体
JP2020121785A (ja) 電子部品包装用のカバーテープおよび電子部品包装体
JP2017128699A (ja) 樹脂組成物およびカバーテープ
JP2007182236A (ja) カバーフィルム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant